公开(公告)号：KR20180018363A

公开(公告)日：2018-02-21

申请号：KR20170099534

申请日：2017-08-07

Applicant: APPLE INC

Inventor： EHMAN REX T ,  NATH JAYESH ,  DI NALLO CARLO ,  HORIUCHI JAMES G ,  DE JONG ERIK G ,  SAUERS JASON C ,  BRZEZINSKI MAKIKO K ,  YONG SIWEN ,  ZHANG LIJUN ,  JIANG YI ,  WANG ZHEYU ,  MARTINIS MARIO ,  DA COSTA BRAS LIMA EDUARDO ,  HAN XU ,  PASCOLINI MATTIA ,  NESS TREVOR J

IPC: H01Q1/48 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q9/28 ,  H01Q9/40 ,  H01Q11/08 ,  H04M1/02

CPC classification number: H01Q1/273 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q1/50 ,  H01Q7/00 ,  H01Q9/0421 ,  H01Q9/14 ,  H04B5/00 ,  H04B5/0031

Abstract: 손목시계와같은전자디바이스는금속측벽들과같은금속부분들을갖는하우징을가질수 있다. 하우징은안테나를위한안테나접지를형성할수 있다. 안테나를위한안테나공진요소는, 디바이스의전면에서디스플레이층, 터치센서층, 및근거리통신안테나층과같은용량결합된(capacitively coupled) 컴포넌트층들의스택으로형성될수 있다. 추가적안테나가디바이스의주변에지및 안테나접지를따라서이어지는주변공진요소로부터형성될수 있다. 후면안테나는무선주파수안테나공진요소로서무선전력수신코일을사용하여형성될수 있거나, 또는광 기반컴포넌트들에대한플라스틱지지체상의금속안테나트레이스들로부터형성될수 있다.

Abstract translation: 诸如手表的电子设备可以具有带金属部分例如金属侧壁的外壳。 外壳可以形成天线的天线接地。 用于天线的天线谐振元件可以由装置正面处的诸如显示层，触摸传感器层和近场通信天线层的电容耦合组件层的堆叠形成。 附加天线可以由沿着该设备的外围边缘和天线接地延伸的外围谐振元件形成。 背面天线可以使用无线电力接收线圈作为高频天线谐振元件形成，或者可以由用于基于光的部件的塑料支撑上的金属天线迹线形成。

公开(公告)号：AU2018101337A4

公开(公告)日：2018-10-11

申请号：AU2018101337

申请日：2018-09-12

Applicant: APPLE INC

Inventor： GABLE BRIAN M ,  NALLO CARLO DI ,  ELY COLIN M ,  HORTON CRAIG A ,  DE JONG ERIK G ,  ROTHKOPF FLETCHER R ,  WETTERSTEN HENRY B ,  LI HOISHUN ,  SAUERS JASON C ,  NATH JAYESH ,  MARTINIS MARIO ,  PASCOLINI MATTIA ,  COLEMAN MICHAEL P ,  EHMAN REX T ,  WANG ZHEYU

IPC: H04M1/02 ,  B29C45/14 ,  H01Q1/24 ,  H01Q1/38 ,  H04M1/18 ,  H05K7/18

Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure 5 between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.

公开(公告)号：AU2018101337B4

公开(公告)日：2019-10-24

申请号：AU2018101337

申请日：2018-09-12

Applicant: APPLE INC

Inventor： GABLE BRIAN M ,  NALLO CARLO DI ,  ELY COLIN M ,  HORTON CRAIG A ,  DE JONG ERIK G ,  ROTHKOPF FLETCHER R ,  WETTERSTEN HENRY B ,  LI HOISHUN ,  SAUERS JASON C ,  NATH JAYESH ,  MARTINIS MARIO ,  PASCOLINI MATTIA ,  COLEMAN MICHAEL P ,  EHMAN REX T ,  WANG ZHEYU

IPC: H04M1/02 ,  B29C45/14 ,  H01Q1/24 ,  H01Q1/38 ,  H04M1/18 ,  H05K7/18

Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure 5 between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.