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    Systems and methods for providing vias through a modular component
    1.
    发明授权
    Systems and methods for providing vias through a modular component 有权
    通过模块化组件提供通孔的系统和方法

    公开(公告)号：US08861217B2

    公开(公告)日：2014-10-14

    申请号：US13668692

    申请日：2012-11-05

    Applicant: Apple Inc.

    Inventor： Gloria Lin ,  William Bryson Gardner, Jr. ,  Joseph Fisher, Jr. ,  Dennis Pyper ,  Amir Salehi

    IPC: H05K7/20 ,  H01R43/00 ,  H05K1/14 ,  H05K1/11 ,  H05K3/22

    CPC classification number: H05K1/145 ,  H05K1/115 ,  H05K1/141 ,  H05K3/222 ,  H05K2201/0919 ,  H05K2201/09627 ,  H05K2201/10446 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49169

    Abstract: This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive elements and/or active of the electrical system around which a packaging has been plastic molded. The module can be stacked under another component of the electrical system. Vias can then be provided that extend through the module. The vias can include, for example, electrically conductive pathways. In this manner, the vias can provide electrical pathways for coupling the component stacked on top of the module to other entities of an electronic device including the electrical system. For example, the component can be coupled to other entities such as other components, other modules, printed circuit boards, other electrical systems, or to any other suitable entity.

    Abstract translation: 这涉及用于通过电气系统的模块提供一个或多个通孔的系统和方法。 例如，在一些实施例中，模块可以包括电气系统的一个或多个无源元件和/或主动元件，其中包装已经被塑料模制。 该模块可以堆叠在电气系统的另一个部件下。 然后可以提供通过模块延伸的通孔。 通孔可以包括例如导电通路。 以这种方式，通孔可以提供用于将堆叠在模块顶部上的部件耦合到包括电气系统的电子设备的其他实体的电路径。 例如，组件可以耦合到诸如其他组件，其他模块，印刷电路板，其他电气系统或任何其它合适实体的其他实体。

    CONFIGURABLE TESTING PLATFORMS FOR CIRCUIT BOARDS WITH REMOVABLE TEST POINT PORTION
    2.
    发明申请
    CONFIGURABLE TESTING PLATFORMS FOR CIRCUIT BOARDS WITH REMOVABLE TEST POINT PORTION 审中-公开
    具有可拆卸测试点的电路板的可配置测试平台

    公开(公告)号：US20130127488A1

    公开(公告)日：2013-05-23

    申请号：US13739917

    申请日：2013-01-11

    Applicant: Apple Inc.

    Inventor： Michael Rosenblatt ,  W. Bryson Gardner, JR. ,  Amir Salehi ,  Tony Aghazarian

    IPC: G01R1/04

    CPC classification number: G01R1/0408 ,  G01R31/2818 ,  H05K1/0268 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/09127 ,  H05K2201/09181

    Abstract: Circuit boards are provided that include a functional portion and at least one removable test point portion. The removable test point portion may include test points which are accessed to verify whether the functional portion is operating properly or whether installed electronic components are electrically coupled to the board. If multiple boards are manufactured together on a single panel (in which the individual boards are broken off), the test points can be placed on bridges (e.g., removable portions) that connect the individual boards together during manufacturing and testing. Configurable test boards are also provided that can be adjusted to accommodate circuit boards of different size and electrical testing requirements. Methods and systems for testing these circuit boards are also provided.

    Abstract translation: 提供了包括功能部分和至少一个可拆卸测试点部分的电路板。 可拆卸测试点部分可以包括被访问以验证功能部分是否正常操作或者是否安装的电子部件电耦合到板的测试点。 如果在单个面板（其中单独的电路板被断开）中一起制造多个电路板，则测试点可以放置在在制造和测试期间将各个电路板连接在一起的桥接器（例如，可拆卸部分）上。 还提供了可配置的测试板，可以调整以适应不同尺寸和电气测试要求的电路板。 还提供了用于测试这些电路板的方法和系统。

    DIRECTED HEATING FOR COMPONENT REWORK
    3.
    发明申请
    DIRECTED HEATING FOR COMPONENT REWORK 审中-公开
    方向加热用于组件工程

    公开(公告)号：US20130119051A1

    公开(公告)日：2013-05-16

    申请号：US13668154

    申请日：2012-11-02

    Applicant: Apple Inc.

    Inventor： Weyman Chen ,  Michael M. Nikkhoo ,  Amir Salehi

    IPC: H05K13/04

    CPC classification number: H05K13/0486

    Abstract: Reworking a component solder attached to a printed circuit board is described. The reworking is accomplished by directing energy only at the solder/pad arrangement used to attach the component to the printed circuit board. In one embodiment, the directed energy takes the form of an alternating magnetic field that inductively couples with the solder/pad arrangement. The alternating magnetic field has a frequency at least 800 kHz. In another embodiment, the directed energy takes the form of a laser beam that is concurrently directed at the solder/pad arrangements for liquefying the solder.

    Abstract translation: 描述了附着在印刷电路板上的部件焊料的重新加工。 返修是通过仅在用于将部件连接到印刷电路板的焊料/焊盘布置处引导能量来实现的。 在一个实施例中，定向能量采用与焊料/焊盘布置感应耦合的交变磁场的形式。 交变磁场的频率至少为800 kHz。 在另一个实施例中，定向能量采用激光束的形式，其同时指向用于液化焊料的焊料/焊盘布置。

    Printed circuits with staggered contact pads and compact component mounting arrangements
    4.
    发明授权
    Printed circuits with staggered contact pads and compact component mounting arrangements 有权
    具有交错接触垫和紧凑型元件安装布置的印刷电路

    公开(公告)号：US09001522B2

    公开(公告)日：2015-04-07

    申请号：US13674834

    申请日：2012-11-12

    Applicant: Apple Inc.

    Inventor： Wyeman Chen ,  Michael Nikkhoo ,  Amir Salehi

    IPC: H05K7/10 ,  H01R12/00 ,  H05K1/11 ,  H05K13/04 ,  H01R12/52 ,  H05K3/34

    CPC classification number: H01R9/095 ,  H01R12/526 ,  H05K1/111 ,  H05K3/3415 ,  H05K13/0465 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2203/1572 ,  H05K2203/304 ,  Y02P70/611 ,  Y10T29/49144

    Abstract: Electronic devices may be provided with printed circuits to which integrated circuits and other electrical components may be mounted. A first printed circuit may have a first surface with an array of contact pads arranged in rows and columns. Each column of contact pads may have a series of contact pads separated by gaps. The contact pads in each column may be staggered with respect to the contact pads in adjacent columns such that each contact pad in a given column is horizontally adjacent to associated gaps in the adjacent columns. A component may be mounted to an opposing surface of the printed circuit such that it overlaps one of the gaps between the staggered contact pads. By mounting the component to portions of the first printed circuit that do not overlap the staggered contact pads, the risk of damaging the electrical component during solder reflow operations may be minimized.

    Abstract translation: 电子设备可以设置有可以安装集成电路和其他电气部件的印刷电路。 第一印刷电路可以具有以行和列排列的接触焊盘阵列的第一表面。 每列接触垫可具有由间隙分开的一系列接触垫。 每列中的接触垫可以相对于相邻列中的接触垫交错，使得给定列中的每个接触垫水平邻近相邻列中的相关间隙。 组件可以安装到印刷电路的相对表面，使得它与交错接触垫之间的间隙中的一个重叠。 通过将组件安装到不与交错接触垫重叠的第一印刷电路的部分，可以最小化在回流焊接操作期间损坏电气部件的风险。

    RF SHIELDING FOR ELECTRONIC COMPONENTS
    7.
    发明申请
    RF SHIELDING FOR ELECTRONIC COMPONENTS 审中-公开
    电子元件射频屏蔽

    公开(公告)号：US20130120957A1

    公开(公告)日：2013-05-16

    申请号：US13631216

    申请日：2012-09-28

    Applicant: Apple Inc.

    Inventor： Christopher Matthew Werner ,  Fletcher R. Rothkopf ,  Stephen Brian Lynch ,  Dennis R. Pyper ,  Wyeman Chen ,  Michael M. Nikkhoo ,  Amir Salehi

    IPC: H05K9/00 ,  H05K3/34 ,  H05K3/30

    CPC classification number: H05K3/225 ,  H05K1/0216 ,  H05K9/0032 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2203/176 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144

    Abstract: An RF shield formed of RF opaque material that permits access to components on a printed circuit board is described. The RF shield can include a first portion attached to the PCB and a removable top portion attached to the first portion at an interface. The top portion is removed from the first portion to expose the components on the PCB. In one aspect of the described embodiment, the top portion is peeled away from the first portion. The components are enclosed within the RF shield after the removal of the top portion by attaching and sealing another top portion to the first portion at the interface by, for example, laser attaching the first portion and the other top portion at the interface.

    Abstract translation: 描述由RF不透明材料形成的RF屏蔽，其允许访问印刷电路板上的部件。 RF屏蔽件可以包括附接到PCB的第一部分和在界面处附接到第一部分的可移除顶部。 顶部从第一部分移除以露出PCB上的部件。 在所述实施例的一个方面，顶部从第一部分剥离。 在通过例如在接口处附接第一部分和另一顶部的激光器的激光附接和密封另一顶部到界面处的第一部分之后，将部件封装在RF屏蔽内。

    Configurable testing platforms for circuit boards with removable test point portions
    10.
    发明授权
    Configurable testing platforms for circuit boards with removable test point portions 有权
    具有可移动测试点部分的电路板的可配置测试平台

    公开(公告)号：US09513314B2

    公开(公告)日：2016-12-06

    申请号：US13739917

    申请日：2013-01-11

    Applicant: Apple Inc.

    Inventor： Michael Rosenblatt ,  W. Bryson Gardner ,  Amir Salehi ,  Tony Aghazarian

    IPC: G01R31/02 ,  G01R1/04 ,  G01R31/28 ,  H05K1/02 ,  H05K3/00 ,  H05K3/40

    CPC classification number: G01R1/0408 ,  G01R31/2818 ,  H05K1/0268 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/09127 ,  H05K2201/09181

    Abstract: Circuit boards are provided that include a functional portion and at least one removable test point portion. The removable test point portion may include test points which are accessed to verify whether the functional portion is operating properly or whether installed electronic components are electrically coupled to the board. If multiple boards are manufactured together on a single panel (in which the individual boards are broken off), the test points can be placed on bridges (e.g., removable portions) that connect the individual boards together during manufacturing and testing. Configurable test boards are also provided that can be adjusted to accommodate circuit boards of different size and electrical testing requirements. Methods and systems for testing these circuit boards are also provided.

    Abstract translation: 提供了包括功能部分和至少一个可拆卸测试点部分的电路板。 可拆卸测试点部分可以包括被访问以验证功能部分是否正常操作或者是否安装的电子部件电耦合到板的测试点。 如果在单个面板（其中单独的电路板被断开）中一起制造多个电路板，则测试点可以放置在在制造和测试期间将各个电路板连接在一起的桥接器（例如，可拆卸部分）上。 还提供了可配置的测试板，可以调整以适应不同尺寸和电气测试要求的电路板。 还提供了用于测试这些电路板的方法和系统。

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