公开(公告)号：WO2018057146A1

公开(公告)日：2018-03-29

申请号：PCT/US2017/046536

申请日：2017-08-11

Applicant: APPLE INC.

Inventor： STANLEY, Craig M. ,  PORTER, Simon K. ,  SHEERIN, John H. ,  TRAINER, Glenn K. ,  DELLA ROSA, Jason C. ,  HUWE, Ethan L. ,  MCINTOSH, Sean T. ,  WANG, Erik L. ,  STRINGER, Christopher J. ,  ANDERSON, Molly J. ,  PARKER, Samuel G. ,  WU, Meiting ,  MENDEZ, Javier ,  LIU, Rong ,  COUSINS, Benjamin A. ,  SUN, Yupin ,  QI, Jun ,  BRINSFIELD, Jason W.

IPC: H04R1/02 ,  G06F3/01 ,  H04R1/26 ,  H04R1/28 ,  H04R1/30 ,  H04R1/40 ,  H04R3/12 ,  H04R5/02 ,  H04R31/00

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

Abstract translation: 本公开涉及扬声器，并且更具体地涉及用于在房间中均匀分配音乐的阵列扬声器。 多个音频驱动器可以径向分布在扬声器外壳内，使得驱动器的输出均匀分布在整个房间内。 在一些实施例中，音频驱动器的出口几何形状可以被配置为从支撑阵列扬声器的表面弹回，以改善整个房间内的音乐分布。 阵列扬声器可以包括分布在阵列扬声器的壳体内的多个振动隔离元件。 隔振元件可以配置成减小阵列扬声器超低音扬声器产生的力量。

公开(公告)号：WO2020069374A1

公开(公告)日：2020-04-02

申请号：PCT/US2019/053547

申请日：2019-09-27

Applicant: APPLE INC.

Inventor： MCINTOSH, Sean T. ,  DELLA ROSA, Jason C. ,  PARKER, Samuel G. ,  COUSINS, Benjamin A. ,  HUWE, Ethan L. ,  STANLEY, Craig M. ,  TWEHUES, Brian R. ,  GHAHRI SARABI, Mohammad Soroush ,  GRINKER, Scott C. ,  ANDERSEN, Esge ,  SIAHAAN, Edward ,  JUHNKE, Ethan W. ,  ZHANG, Mei ,  HUA, Thanh P. ,  JI, Qigen ,  ZHU, Hao ,  SANG, Haochuan ,  CHAWAN, Arun D. ,  PANECKI, Lee M. ,  LEBLANC, Jason J. ,  WU, Meiting

IPC: H04R1/08 ,  H04R1/10

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

公开(公告)号：WO2020197674A1

公开(公告)日：2020-10-01

申请号：PCT/US2020/019280

申请日：2020-02-21

Applicant: APPLE INC.

Inventor： HATFIELD, Dustin A. ,  AOYAGI, Shota ,  EMMOTT, Timoty E. ,  HUWE, Ethan L. ,  LERNER, Mitchell R. ,  MCINTOSH, Sean T. ,  TSAI, Yi-Fang D. ,  DELLA ROSA, Jason C. ,  SHEPPARD, Patrick W. ,  PARKER, Samuel G. ,  FEATHERS, David J. ,  TWEHUES, Brian R. ,  STRONGWATER, Daniel

IPC: H04R1/10

Abstract: An eartip (600) including an eartip body having an attachment end (614) and an interfacing end (612) opposite from the attachment end (614), and including an inner eartip body (606) and an outer eartip body (608). The inner eartip body (606) has a sidewall that extends between the interfacing end (612) and the attachment end (614), and includes a groove (602) formed in an outer surface of the sidewall. The outer eartip body (608) is sized and shaped to be inserted into an ear canal and extends from the interfacing end (612) toward the attachment end (614) of the eartip (600).

公开(公告)号：WO2022060382A1

公开(公告)日：2022-03-24

申请号：PCT/US2020/052447

申请日：2020-09-24

Applicant: APPLE INC.

Inventor： SOOHOO, Eric T. ,  AMINI, Mahmoud R. ,  BLOOM, Daniel R. ,  MCINTOSH, Sean T. ,  SHI LI, Tian ,  KOLE, Jared ,  LEBLANC, Jason ,  ELY, Colin M. ,  CAMERON, Peter ,  KINNEY, Michael ,  JOL, Eric ,  SIAHAAN, Edward ,  ZUPKE, Robert ,  GUPTA, Rohan ,  FRANCIS, Jordon J.

IPC: H01R24/60 ,  H01R13/6595 ,  H01R13/633 ,  H01R13/631 ,  H01R13/66 ,  H01R12/71

Abstract: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.

公开(公告)号：EP4027652A3

公开(公告)日：2022-09-28

申请号：EP21213102.3

申请日：2021-12-08

Applicant: Apple Inc.

Inventor： PANECKI, Lee M ,  MINERBI, Michael B. ,  MCINTOSH, Sean T.

IPC: H04R1/02 ,  H04R1/10

Abstract: An earphone comprising: a device housing that defines an internal cavity within the device housing; an acoustic port formed through a wall of the device housing and having an opening at an exterior surface of the device housing; an audio driver disposed within the device housing and aligned to emit sound through the acoustic port; and a mesh disposed within the acoustic port and having an outer periphery spaced apart from the device housing wall, wherein the mesh forms a portion of an exterior surface of the earphone that is recessed from the opening at the exterior surface of the device housing.

公开(公告)号：EP4255125A3

公开(公告)日：2024-04-17

申请号：EP23187797.8

申请日：2017-08-11

Applicant: Apple Inc.

Inventor： STANLEY, Craig M. ,  PORTER, Simon K. ,  SHEERIN, John H. ,  TRAINER, Glenn K. ,  DELLA ROSA, Jason C. ,  HUWE, Ethan L. ,  MCINTOSH, Sean T. ,  WANG, Erik L. ,  STRINGER, Christopher J. ,  ANDERSON, Molly J. ,  PARKER, Samuel G. ,  WU, Meiting ,  MENDEZ, Javier ,  LIU, Rong ,  COUSINS, Benjamin A. ,  SUN, Yupin ,  QI, Jun ,  BRINSFIELD, Jason W.

IPC: H04R1/02 ,  G06F3/01 ,  H04R1/26 ,  H04R1/28 ,  H04R1/30 ,  H04R1/40 ,  H04R3/12 ,  H04R5/02 ,  H04R31/00 ,  H04R9/02

CPC classification number: H04R1/026 ,  H04R1/26 ,  H04R1/30 ,  H04R5/02 ,  H04R31/006 ,  H04R2201/40120130101 ,  H04R2400/1320130101 ,  H04R2420/0720130101 ,  H03K17/962 ,  H05K1/0274 ,  H05K1/141 ,  H05K2201/0906320130101 ,  H05K2201/1010620130101 ,  H05K2201/1037820130101 ,  G06F3/0202 ,  G06F3/041 ,  G06F3/03547 ,  H03K2217/96078520130101 ,  H04R1/025 ,  H04R1/403 ,  H04R3/12 ,  H04R2201/3420130101 ,  H04R1/2826 ,  G06F3/044 ,  H04R9/022 ,  H04R2201/02820130101

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：EP4027652A2

公开(公告)日：2022-07-13

申请号：EP21213102.3

申请日：2021-12-08

Applicant: Apple Inc.

Inventor： PANECKI, Lee M ,  MINERBI, Michael B. ,  MCINTOSH, Sean T.

IPC: H04R1/02 ,  H04R1/10

Abstract: An earphone comprising: a device housing that defines an internal cavity within the device housing; an acoustic port formed through a wall of the device housing and having an opening at an exterior surface of the device housing; an audio driver disposed within the device housing and aligned to emit sound through the acoustic port; and a mesh disposed within the acoustic port and having an outer periphery spaced apart from the device housing wall, wherein the mesh forms a portion of an exterior surface of the earphone that is recessed from the opening at the exterior surface of the device housing.

公开(公告)号：EP3834428A1

公开(公告)日：2021-06-16

申请号：EP20712768.9

申请日：2020-02-21

Applicant: Apple Inc.

Inventor： HATFIELD, Dustin A. ,  AOYAGI, Shota ,  EMMOTT, Timothy E. ,  HUWE, Ethan L. ,  LERNER, Mitchell R. ,  MCINTOSH, Sean T. ,  TSAI, Yi-Fang D. ,  DELLA ROSA, Jason C. ,  SHEPPARD, Patrick W. ,  PARKER, Samuel G. ,  FEATHERS, David J. ,  TWEHUES, Brian R. ,  STRONGWATER, Daniel

IPC: H04R1/10

公开(公告)号：EP4266837A3

公开(公告)日：2024-06-05

申请号：EP23187766.3

申请日：2017-08-11

Applicant: Apple Inc.

Inventor： STANLEY, Craig M. ,  PORTER, Simon K. ,  SHEERIN, John H. ,  TRAINER, Glenn K. ,  DELLA ROSA, Jason C. ,  HUWE, Ethan L. ,  MCINTOSH, Sean T. ,  WANG, Erik L. ,  STRINGER, Christopher J. ,  ANDERSON, Molly J. ,  PARKER, Samuel G. ,  WU, Meiting ,  MENDEZ, Javier ,  LIU, Rong ,  COUSINS, Benjamin A. ,  SUN, Yupin ,  QI, Jun ,  BRINSFIELD, Jason W.

IPC: H04R1/02 ,  G06F3/01 ,  H04R1/26 ,  H04R1/28 ,  H04R1/30 ,  H04R1/40 ,  H04R3/12 ,  H04R5/02 ,  H04R31/00 ,  H04R9/02

CPC classification number: H04R1/026 ,  H04R1/26 ,  H04R1/30 ,  H04R5/02 ,  H04R31/006 ,  H04R2201/40120130101 ,  H04R2400/1320130101 ,  H04R2420/0720130101 ,  H03K17/962 ,  H05K1/0274 ,  H05K1/141 ,  H05K2201/0906320130101 ,  H05K2201/1010620130101 ,  H05K2201/1037820130101 ,  G06F3/0202 ,  G06F3/041 ,  G06F3/03547 ,  H03K2217/96078520130101 ,  H04R1/025 ,  H04R1/403 ,  H04R3/12 ,  H04R2201/3420130101 ,  H04R1/2826 ,  G06F3/044 ,  H04R9/022 ,  H04R2201/02820130101

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：EP4255125A2

公开(公告)日：2023-10-04

申请号：EP23187797.8

申请日：2017-08-11

Applicant: Apple Inc.

Inventor： STANLEY, Craig M. ,  PORTER, Simon K. ,  SHEERIN, John H. ,  TRAINER, Glenn K. ,  DELLA ROSA, Jason C. ,  HUWE, Ethan L. ,  MCINTOSH, Sean T. ,  WANG, Erik L. ,  STRINGER, Christopher J. ,  ANDERSON, Molly J. ,  PARKER, Samuel G. ,  WU, Meiting ,  MENDEZ, Javier ,  LIU, Rong ,  COUSINS, Benjamin A. ,  SUN, Yupin ,  QI, Jun ,  BRINSFIELD, Jason W.

IPC: H05K1/02

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.