公开(公告)号：EP3384530A1

公开(公告)日：2018-10-10

申请号：EP17707450.7

申请日：2017-02-10

Applicant: Apple Inc.

Inventor： HU, Hsin-Hua ,  PEDDER, James E. ,  BITA, Ion ,  CHOI, Jaein ,  TANG, Hairong ,  HSU, Chin Wei ,  CHALASANI, Sandeep ,  CHEN, Chih-Lei ,  ONO, Shinya ,  KANG, Sunggu ,  HUANG, Jung Yen ,  TSAI, Lun

IPC: H01L25/075 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L25/0753 ,  H01L23/3157 ,  H01L23/3192 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/16 ,  H01L25/167 ,  H01L2224/10145 ,  H01L2224/11002 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/13007 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1601 ,  H01L2224/16112 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/11

Abstract: Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.

公开(公告)号：WO2016099743A1

公开(公告)日：2016-06-23

申请号：PCT/US2015/060942

申请日：2015-11-16

Applicant: APPLE INC.

Inventor： CHANG, Kevin K. C. ,  HU, Hsin-Hua ,  CHAN, Clayton Ka Tsun ,  HUANG, Chien-Hsing

IPC: H01L33/38 ,  H01L25/075 ,  H01L33/46 ,  H01L33/00

CPC classification number: H01L33/38 ,  H01L24/83 ,  H01L24/95 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/20 ,  H01L33/46 ,  H01L33/483 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: LEDs and an electronic device are disclosed. In an embodiment an LED includes a p-n diode and a dielectric mirror spanning along a lateral sidewall of the p-n diode and directly underneath the p-n diode. An opening is formed in the dielectric mirror directly underneath the p-n diode, and a bottom conductive contact is on the dielectric mirror directly underneath the p-n diode and within the opening in the dielectric mirror.

Abstract translation: LED和电子设备被公开。 在一个实施例中，LED包括p-n二极管和跨越p-n二极管的横向侧壁并直接位于p-n二极管下方的电介质镜。 在p-n二极管正下方的电介质镜中形成一个开口，而在p-n二极管正下方和电介质反射镜的开口内的电介质镜上都有一个底部导电接触。

公开(公告)号：WO2019168763A1

公开(公告)日：2019-09-06

申请号：PCT/US2019/019273

申请日：2019-02-22

Applicant: APPLE INC.

Inventor： HUITEMA, Edzer ,  PATEL, Vaibhav ,  NAUTA, Tore ,  LI, Xia ,  HU, Hsin-Hua

IPC: H01L21/60 ,  H01L23/485 ,  H01L33/48 ,  H01L25/16 ,  H01L21/683

Abstract: Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.

公开(公告)号：EP2847789B1

公开(公告)日：2017-12-27

申请号：EP13788027.4

申请日：2013-05-01

Applicant: Apple Inc.

Inventor： BIBL, Andreas ,  HIGGINSON, John A. ,  HU, Hsin-Hua

IPC: B81C99/00 ,  H01L21/677 ,  H01L21/50 ,  B65G49/07 ,  H01L21/683 ,  H01L21/60 ,  H01L21/67 ,  H01L25/075 ,  H01L23/00

CPC classification number: B41J2/385 ,  B25J15/0052 ,  B25J15/0085 ,  B41J2/39 ,  B81B2201/038 ,  B81C99/002 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0079 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

公开(公告)号：EP3087617A1

公开(公告)日：2016-11-02

申请号：EP14809261.2

申请日：2014-11-25

Applicant: Apple Inc.

Inventor： MCGRODDY, Kelly ,  HU, Hsin-Hua ,  BIBL, Andreas ,  CHAN, Clayton Ka Tsun ,  HAEGER, Daniel Arthur

IPC: H01L33/14 ,  H01L25/075 ,  G02F1/1335 ,  G09G3/32 ,  H01L33/16 ,  H01L33/20 ,  H01L27/15 ,  H01L27/12 ,  H01L23/00

CPC classification number: H01L33/145 ,  G09G3/32 ,  H01L24/75 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/016 ,  H01L27/156 ,  H01L33/0016 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/06 ,  H01L33/14 ,  H01L33/16 ,  H01L33/20 ,  H01L33/30 ,  H01L33/42 ,  H01L2224/75305 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/82203 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.

公开(公告)号：EP3729494A1

公开(公告)日：2020-10-28

申请号：EP19711196.6

申请日：2019-02-22

Applicant: Apple Inc.

Inventor： HUITEMA, Edzer ,  PATEL, Vaibhav ,  NAUTA, Tore ,  LI, Xia ,  HU, Hsin-Hua

IPC: H01L21/60 ,  H01L23/485 ,  H01L33/48 ,  H01L25/16 ,  H01L21/683

公开(公告)号：EP2780953B1

公开(公告)日：2020-06-24

申请号：EP12849007.5

申请日：2012-11-08

Applicant: Apple Inc.

Inventor： BIBL, Andreas ,  HIGGINSON, John A. ,  LAW, Hung-Fai Stephen ,  HU, Hsin-Hua

IPC: H01L33/36 ,  H01L33/00 ,  H01L25/075 ,  H01L33/20

公开(公告)号：EP2780954B1

公开(公告)日：2019-10-16

申请号：EP12849508.2

申请日：2012-11-08

Applicant: Apple Inc.

Inventor： HU, Hsin-Hua ,  BIBL, Andreas ,  HIGGINSON, John, A. ,  LAW, Hung-Fai, Stephen

IPC: H01L33/46 ,  H01L33/48 ,  H01L33/36 ,  H01L33/00 ,  H01L33/20