Abstract:
Display structures and methods of manufacture of display structure including a display panel with a curved three-dimensional film contour are described. In an embodiment, a display panel includes display area with a main body area and a plurality of petals extending from the main body area. The petals are folded into a curved three-dimensional (3D) film contour, and are separated by corresponding trenches between petals. The trenches may be filled with various seam hiding materials to visually obscure the trenches.
Abstract:
Display panel redundancy schemes and redundancy building blocks are described. In an embodiment, pixel driver chips are connected to both primary and redundant strings of LEDs within a local passive matrix, and driver terminal switches within the pixel driver chip are used to select either the primary or redundant strings of LEDs.
Abstract:
Local passive matrix displays and methods of operation are described. In an embodiment, the display includes a pixel driver chip coupled with a matrix of rows and columns of LEDs. The pixel driver chips may be arranged in rows across the display with separate portions to operate separate matrices of LEDs.
Abstract:
A display system includes an array of light emitting diodes (LEDs), first and second driver chips, and one or more protection chips on a display substrate. The first and second driver chips are to drive a first group of LEDs of the array of LEDs and a second group of LEDs of the array of LEDs, respectively. Each protection chip includes one or more electro-static discharge (ESD) protection devices to assist with protecting the driver chips from damage caused by an ESD event. In one embodiment, each ESD protection device is connected between one or more signal lines, one or more power supply voltage lines, and an electrical ground line of the display substrate. In one embodiment, at least one protection chip comprises one or more electric overstress (EOS) protection devices to assist with protecting the driver chips from damage caused by an EOS event.
Abstract:
Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.
Abstract:
A display device may include pixels that display image data. The display device may also include a circuit that receives pixel data having a gray level for at least one pixel, such that the pixel data corresponds to a frame of the image data and the frame includes sub-frames. The pixel data causes the circuit to provide at least one current pulse to the at least one pixel according to a first order of the sub-frames. The circuit may also receive a second order of the sub-frames, such that the second order is mapped with respect to the first order, and at least one current pulse is provided to the at least one pixel according to the second order. As such, visual artifacts depicted on the display are reduced.
Abstract:
Methods and apparatuses relating to controlling an emission of a display panel. In one embodiment, a display driver hardware circuit includes row selection logic to select a number of rows in an emission group of a display panel, wherein the number of rows is adjustable from a single row to a full panel of the display panel, column selection logic to select a number of columns in the emission group of the display panel, wherein the number of columns is adjustable from a single column to the full panel of the display panel, and emission logic to select a number of pulses per data frame to be displayed, wherein the number of pulses per data frame is adjustable from one to a plurality and a pulse length is adjustable from a continuous duty cycle to a non-continuous duty cycle.