Abstract:
A back-illuminated single-photon avalanche diode (SPAD) image sensor includes a sensor wafer stacked vertically over a circuit wafer. The sensor wafer includes one or more SPAD regions, with each SPAD region (400) including an anode gradient layer (402), a cathode region (404) positioned adjacent to a front surface of the SPAD region, and an anode avalanche layer (408) positioned over the cathode region. Each SPAD region is connected to a voltage supply and an output circuit in the circuit wafer through inter-wafer connectors. Deep trench isolation elements (424) are used to provide electrical and optical isolation between SPAD regions.
Abstract:
A method for performing correlated double sampling for a sensor, such as an image sensor. The method includes collecting a first charge corresponding to a first parameter, transferring the first charge to a first storage component, transferring the first charge from the first storage component to a second storage component, resetting the first storage component, transferring the first charge from the second storage component to the first storage component, and reading the first storage component to determine the first charge. The method may be implemented in electronic devices including image sensors.
Abstract:
An optoelectronic device includes a semiconductor substrate (10) and an array of optoelectronic cells (12), formed on the semiconductor substrate. The cells include first epitaxial layers defining a lower distributed Bragg-reflector (DBR) stack (20); second epitaxial layers formed over the lower DBR stack, defining a quantum well structure (22); third epitaxial layers, formed over the quantum well structure, defining an upper DBR stack (24); and electrodes (30) formed over the upper DBR stack, which are configurable to inject an excitation current into the quantum well structure of each optoelectronic cell. A first set of the optoelectronic cells are configured to emit laser radiation in response to the excitation current. In a second set of the optoelectronic cells (16), interleaved with the first set, at least one element of the optoelectronic cells, selected from among the epitaxial layers and the electrodes, is configured so that the optoelectronic cells in the second set do not emit the laser radiation.
Abstract:
A radiation source (20) includes a semiconductor substrate (24), an array of vertical-cavity surface-emitting lasers (VCSELs) (22) formed on the substrate, which are configured to emit optical radiation, and a transparent crystalline layer (40, 50) formed over the array of VCSELs. The transparent crystalline layer has an outer surface configured to diffuse the radiation emitted by the VCSELs.
Abstract:
An image sensor can include pixels that are grouped into subsets of pixels, with each subset including three or more pixels. A method for asymmetrical high dynamic range imaging can include capturing an image of a subject scene using a single integration time for all of the pixels. In a subset of pixels, charge in N pixels is read out and summed together. N represents a number that is between two and one less than a total number of pixels in the subset. Un-summed charge is read out from one pixel in the subset. The un-summed charge and the summed charge are combined when producing a high dynamic range image.
Abstract:
Apparatuses and methods for charge transfer in image sensors are disclosed. One example of an image sensor pixel may include a first charge storage node and a second charge storage node. A transfer circuit may be coupled between the first and second charge storage nodes, and the transfer circuit may have a first region proximate the first charge storage node and configured to have a first potential. The transfer circuit may also have a second region proximate the second charge storage node configured to have a second, higher potential. An input node may be configured to control the first and second potentials based on a transfer signal provided to the input node.
Abstract:
A display system includes an array of light emitting diodes (LEDs), first and second driver chips, and one or more protection chips on a display substrate. The first and second driver chips are to drive a first group of LEDs of the array of LEDs and a second group of LEDs of the array of LEDs, respectively. Each protection chip includes one or more electro-static discharge (ESD) protection devices to assist with protecting the driver chips from damage caused by an ESD event. In one embodiment, each ESD protection device is connected between one or more signal lines, one or more power supply voltage lines, and an electrical ground line of the display substrate. In one embodiment, at least one protection chip comprises one or more electric overstress (EOS) protection devices to assist with protecting the driver chips from damage caused by an EOS event.
Abstract:
A vertically stacked image sensor having a photodiode chip and a transistor array chip. The photodiode chip includes at least one photodiode and a transfer gate extends vertically from a top surface of the photodiode chip. The image sensor further includes a transistor array chip stacked on top of the photodiode chip. The transistor array chip includes the control circuitry and storage nodes. The image sensor further includes a logic chip vertically stacked on the transistor array chip. The transfer gate communicates data from the at least one photodiode to the transistor array chip and the logic chip selectively activates the vertical transfer gate, the reset gate, the source follower gate, and the row select gate.
Abstract:
A pixel (700) in an image sensor can include a photodetector (708) and a storage region (712) disposed in one substrate, or a photodetector disposed in one substrate (738) and a storage region in another substrate (740). A buried light shield (710) is disposed between the photodetector and the storage region. A sense region (716), such as a floating diffusion, can be adjacent to the storage region, with the buried light shield disposed between the photodetector and the storage and sense regions. When the photodetector and the storage region are disposed in separate substrates, a vertical gate (714) can be formed through the buried light shield and used to initiate the transfer of charge from the photodetector and the storage region. A transfer channel (744) formed adjacent to, or around the vertical gate provides a channel for the charge to transfer from the photodetector to the storage region.
Abstract:
A method of operating an image sensor. Charge accumulated in a photodiode during a first sub-exposure may be selectively stored in a storage node responsive to a first control signal. Charge accumulated in the photodiode during a first reset period may be selectively discarded responsive to a second control signal. Charge accumulated in the photodiode during a second sub-exposure may be selectively stored responsive to the first control signal. Charge stored in the storage node from the first and second sub-exposures may be transferred to a floating diffusion node responsive to a third control signal.