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公开(公告)号：US10579772B2
公开(公告)日：2020-03-03
申请号：US15996992
申请日：2018-06-04
Applicant: ASML NETHERLANDS B.V.
Inventor： Christophe David Fouquet , Bernardo Kastrup , Arie Jeffrey Den Boef , Johannes Catharinus Hubertus Mulkens , James Benedict Kavanagh , James Patrick Koonmen , Neal Patrick Callan
Abstract: A computer-implemented defect prediction method for a device manufacturing process involving processing a portion of a design layout onto a substrate, the method including: identifying a hot spot from the portion of the design layout; determining a range of values of a processing parameter of the device manufacturing process for the hot spot, wherein when the processing parameter has a value outside the range, a defect is produced from the hot spot with the device manufacturing process; determining an actual value of the processing parameter; determining or predicting, using the actual value, existence, probability of existence, a characteristic, or a combination thereof, of a defect produced from the hot spot with the device manufacturing process.
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公开(公告)号：US20200218849A1
公开(公告)日：2020-07-09
申请号：US16804048
申请日：2020-02-28
Applicant: ASML NETHERLANDS B.V.
Inventor： Christophe David Fouquet , Bernardo Kastrup , Arie Jeffrey Den Boef , Johannes Catharinus Hubertus Mulkens , James Benedict Kavanagh , James Patrick Koonmen , Neal Patrick Callan
IPC: G06F30/398 , H01L21/66 , G03F7/20 , G06F30/20 , G06N7/00
Abstract: A defect prediction method for a device manufacturing process involving processing a portion of a design layout onto a substrate, the method including: identifying a hot spot from the portion of the design layout; determining a range of values of a processing parameter of the device manufacturing process for the hot spot, wherein when the processing parameter has a value outside the range, a defect is produced from the hot spot with the device manufacturing process; determining an actual value of the processing parameter; determining or predicting, using the actual value, existence, probability of existence, a characteristic, or a combination thereof, of a defect produced from the hot spot with the device manufacturing process.
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Patent Agency Ranking
公开(公告)号：US09507907B2
公开(公告)日：2016-11-29
申请号：US14730993
申请日：2015-06-04
Applicant: ASML NETHERLANDS B.V.
Inventor： Christophe David Fouquet , Bernardo Kastrup , Arie Jeffrey Den Boef , Johannes Catharinus Hubertus Mulkens , James Benedict Kavanagh , James Patrick Koonmen , Neal Patrick Callan
CPC classification number: G06F17/5081 , G03F7/705 , G03F7/70525 , G03F7/7065 , G06F17/5009 , G06N7/005 , H01L22/20
Abstract: Disclosed herein is a computer-implemented defect prediction method for a device manufacturing process involving processing a portion of a design layout onto a substrate, the method comprising: identifying a hot spot from the portion of the design layout; determining a range of values of a processing parameter of the device manufacturing process for the hot spot, wherein when the processing parameter has a value outside the range, a defect is produced from the hot spot with the device manufacturing process; determining an actual value of the processing parameter; and determining or predicting, using the actual value, an existence, a probability of existence, a characteristic, or a combination selected therefrom, of a defect produced from the hot spot with the device manufacturing process.
Abstract translation: 这里公开了一种用于设备制造过程的计算机实现的缺陷预测方法，该方法涉及将设计布局的一部分处理到衬底上，所述方法包括：从所述设计布局的所述部分中识别热点; 确定所述热点的装置制造过程的处理参数的值的范围，其中当所述处理参数具有超出所述范围的值时，通过所述装置制造过程从所述热点产生缺陷; 确定处理参数的实际值; 并且使用实际值确定或预测由设备制造过程产生的缺陷产生的缺陷的存在，存在概率，特征或其选择的组合。
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公开(公告)号：US11080459B2
公开(公告)日：2021-08-03
申请号：US16804048
申请日：2020-02-28
Applicant: ASML NETHERLANDS B.V.
Inventor： Christophe David Fouquet , Bernardo Kastrup , Arie Jeffrey Den Boef , Johannes Catharinus Hubertus Mulkens , James Benedict Kavanagh , James Patrick Koonmen , Neal Patrick Callan
IPC: G06F30/398 , H01L21/66 , G03F7/20 , G06F30/20 , G06N7/00
Abstract: A defect prediction method for a device manufacturing process involving processing a portion of a design layout onto a substrate, the method including: identifying a hot spot from the portion of the design layout; determining a range of values of a processing parameter of the device manufacturing process for the hot spot, wherein when the processing parameter has a value outside the range, a defect is produced from the hot spot with the device manufacturing process; determining an actual value of the processing parameter; determining or predicting, using the actual value, existence, probability of existence, a characteristic, or a combination thereof, of a defect produced from the hot spot with the device manufacturing process.
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公开(公告)号：US09990462B2
公开(公告)日：2018-06-05
申请号：US15339669
申请日：2016-10-31
Applicant: ASML NETHERLANDS B.V.
Inventor： Christophe David Fouquet , Bernardo Kastrup , Arie Jeffrey Den Boef , Johannes Catharinus Hubertus Mulkens , James Benedict Kavanagh , James Patrick Koonmen , Neal Patrick Callan
CPC classification number: G06F17/5081 , G03F7/705 , G03F7/70525 , G03F7/7065 , G06F17/5009 , G06N7/005 , H01L22/20
Abstract: Disclosed herein is a computer-implemented defect prediction method for a device manufacturing process involving processing a portion of a design layout onto a substrate, the method comprising: identifying a hot spot from the portion of the design layout; determining a range of values of a processing parameter of the device manufacturing process for the hot spot, wherein when the processing parameter has a value outside the range, a defect is produced from the hot spot with the device manufacturing process; determining an actual value of the processing parameter; determining or predicting, using the actual value, existence, probability of existence, a characteristic, or a combination thereof, of a defect produced from the hot spot with the device manufacturing process.
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公开(公告)号：US12067340B2
公开(公告)日：2024-08-20
申请号：US17389682
申请日：2021-07-30
Applicant: ASML NETHERLANDS B.V.
Inventor： Christophe David Fouquet , Bernardo Kastrup , Arie Jeffrey Den Boef , Johannes Catharinus Hubertus Mulkens , James Benedict Kavanagh , James Patrick Koonmen , Neal Patrick Callan
CPC classification number: G06F30/398 , G03F7/705 , G03F7/70525 , G03F7/7065 , G06F30/20 , G06N7/01 , H01L22/20
Abstract: A defect prediction method for a device manufacturing process involving processing a portion of a design layout onto a substrate, the method including: identifying a hot spot from the portion of the design layout; determining a range of values of a processing parameter of the device manufacturing process for the hot spot, wherein when the processing parameter has a value outside the range, a defect is produced from the hot spot with the device manufacturing process; determining an actual value of the processing parameter; determining or predicting, using the actual value, existence, probability of existence, a characteristic, or a combination thereof, of a defect produced from the hot spot with the device manufacturing process.
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公开(公告)号：US20180365369A1
公开(公告)日：2018-12-20
申请号：US15996992
申请日：2018-06-04
Applicant: ASML NETHERLANDS B.V.
Inventor： Christophe David FOUQUET , Bernardo KASTRUP , Arie Jeffrey Den Boef , Johannes Catharinus Hubertus Mulkens , James Benedict Kavanagh , James Patrick Koonmen , Neal Patrick Callan
CPC classification number: G06F17/5081 , G03F7/705 , G03F7/70525 , G03F7/7065 , G06F17/5009 , G06N7/005 , H01L22/20
Abstract: A computer-implemented defect prediction method for a device manufacturing process involving processing a portion of a design layout onto a substrate, the method including: identifying a hot spot from the portion of the design layout; determining a range of values of a processing parameter of the device manufacturing process for the hot spot, wherein when the processing parameter has a value outside the range, a defect is produced from the hot spot with the device manufacturing process; determining an actual value of the processing parameter; determining or predicting, using the actual value, existence, probability of existence, a characteristic, or a combination thereof, of a defect produced from the hot spot with the device manufacturing process.
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