Abstract:
In an embodiment, a lithography method is disclosed that includes providing a providing a first heat load to a first area of an object, and providing a second heat load to a second area of the object, wherein the second heat load is configured to ensure a deformation of the first area of the object caused by providing both the first heat load and the second heat load is smaller than a deformation of the first area of the object caused by providing only the first heat load.
Abstract:
A lithographic apparatus component, such as a metrology system or an optical element (e.g., a mirror) is provided with a temperature control system for controlling deformation of the component. The control system includes channels provided close to a surface of the component through which a two phase cooling medium is supplied. The metrology system measures a position of at least a moveable item with respect to a reference position and includes a metrology frame connected to the reference position. An encoder is connected to the moveable item and constructed and arranged to measure a relative position of the encoder with respect to a reference grid. The reference grid may be provided directly on a surface of the metrology frame. A lithographic projection apparatus may have the metrology system for measuring a position of the substrate table with respect to the projection system.
Abstract:
Disclosed is a substrate support for an apparatus of the type which projects a beam of EUV radiation onto a target portion of a substrate. The substrate support comprises a substrate table constructed to hold a substrate, a support block for supporting the substrate table, and a cover plate disposed around the substrate table. The top surface of the cover plate and the top surface of a substrate mounted on the substrate table are all substantially at the same level. At least one sensor unit is located on the substrate support and its top surface is also at the same level as that of the cover plate and substrate. Also disclosed is an EUV lithographic apparatus comprising such a substrate support.
Abstract:
A projection system (PS) is provided that includes a sensor system (20) that measures at least one parameter that relates to the physical deformation of a frame (10) that supports the optical elements (11) within the projection system (PS), and a control system (30) that, based on the measurements from the sensor system (20.), determines an expected deviation of.the position of the beam of radiation projected by the projection system (PS) that is caused by the physical deformation of the frame (10).