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    METHOD AND APPARATUS FOR INSPECTION AND METROLOGY
    2.
    发明申请
    METHOD AND APPARATUS FOR INSPECTION AND METROLOGY 审中-公开
    检验和计量方法与装置

    公开(公告)号：WO2016142214A3

    公开(公告)日：2017-04-06

    申请号：PCT/EP2016054310

    申请日：2016-03-01

    Applicant: ASML NETHERLANDS BV

    Inventor： VAN VOORST PETER DANNY ,  AKBULUT DUYGU ,  VAN BERKEL KOOS ,  VAN DE WIJDEVEN JEROEN JOHAN MAARTEN ,  ZIJP FERRY

    IPC: G03F7/20 ,  G01N21/956 ,  G02B21/00

    CPC classification number: G03F7/70483 ,  G01B11/00 ,  G01N21/956 ,  G02B21/0016 ,  G02B27/0988 ,  G03F7/70625 ,  G03F7/70633

    Abstract: A method of position control of an optical component relative to a surface is disclosed. The method may include: obtaining a first signal by a first position measurement process; controlling relative movement between the optical component and the surface for a first range of motion using the first signal; obtaining a second signal by a second position measurement process different than the first position measurement process; and controlling relative movement between the optical component and the surface for a second range of motion using the second signal, the second range of motion being nearer the surface than the first range of motion.

    Abstract translation: 公开了一种光学部件相对于表面的位置控制的方法。 该方法可以包括：通过第一位置测量处理获得第一信号; 使用所述第一信号来控制所述光学部件和所述表面之间的第一运动范围的相对运动; 通过与第一位置测量处理不同的第二位置测量处理获得第二信号; 以及使用所述第二信号来控制所述光学部件和所述表面之间的相对运动的第二运动范围，所述第二运动范围比所述第一运动范围更靠近所述表面。

    POSITION SENSOR, LITHOGRAPHIC APPARATUS AND METHOD FOR MANUFACTURING DEVICES
    3.
    发明专利
    POSITION SENSOR, LITHOGRAPHIC APPARATUS AND METHOD FOR MANUFACTURING DEVICES 未知

    公开(公告)号：SG11201900623PA

    公开(公告)日：2019-02-27

    申请号：SG11201900623P

    申请日：2017-06-30

    Applicant: ASML NETHERLANDS BV

    Inventor： HUISMAN SIMON ,  MATHIJSSEN SIMON ,  GOORDEN SEBASTIANUS ,  AKBULUT DUYGU ,  POLO ALESSANDRO

    IPC: G03F9/00

    Abstract: An alignment sensor for a lithographic apparatus has an optical system configured to deliver, collect and process radiation selectively in a first waveband (e.g. 500-900 nm) and/or in a second waveband (e.g. 1500-2500 nm). The radiation of the first and second wavebands share a common optical path in at least some portion of the optical system, while the radiation of the first waveband is processed by a first processing sub-system and the radiation of the second waveband is processed by a second processing sub-system. The processing subsystems in one example include self-referencing interferometers. The radiation of the second waveband allows marks to be measured through an opaque layer. Optical coatings and other components of each processing sub-system can be tailored to the respective waveband, without completely duplicating the optical system.

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