公开(公告)号：JP2006186369A

公开(公告)日：2006-07-13

申请号：JP2005372013

申请日：2005-12-26

Applicant: ASML NETHERLANDS BV

Inventor： BEST KEITH FRANK ,  CONSOLINI JOSEPH J ,  FRIZ ALEXANDER ,  CHISHOLM RODNEY

IPC: H01L21/027 ,  G03F7/20 ,  H01L21/02 ,  H01L21/68

Abstract: PROBLEM TO BE SOLVED: To provide a wafer which is a semiconductor wafer of which surfaces on both sides can be polished to any degree. SOLUTION: One side of a semiconductor wafer is polished to comparatively higher degree that is suitable for making a fine pattern by a lithography process, and the other side thereof is polished to comparatively low degree, that is appropriate to provide alignment marks WM3 and WM4 effective for arranging wafers in the lithography process. COPYRIGHT: (C)2006,JPO&NCIPI