Abstract:
PROBLEM TO BE SOLVED: To provide a method of transferring a substrate and a transfer system having more improved placement accuracy than hitherto known. SOLUTION: This method in a lithographic apparatus can transfer a substrate from a first substrate holder to a second substrate holder by a transfer unit based on transfer data available thereto. The second substrate holder includes a surface on which a plurality of first bars are provided. This method provides a memory in which bar position data and substrate position data are encoded. Thereby, the substrate is provided on the first substrate holder. Then, a position error and direction of the substrate are measured. The direction adjustment data are calculated based on the bar position data, the substrate position data and the measured direction. The direction of the substrate is then adjusted in accordance with the direction adjustment data. After that, the substrate is transferred from the first substrate holder to the second substrate holder by the transfer unit, and is disposed on the second substrate holder. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate table with higher reliability for releasing a wafer from the substrate table in a lithography apparatus.SOLUTION: A lithography apparatus comprises an illumination system which adjusts a radiation beam, and a support which supports a patterning device. The patterning device can form a patterned radiation beam by patterning the cross-section of the radiation beam. The apparatus further comprises a substrate table which holds a substrate, and a projection system which projects the patterned radiation beam onto a target part of the substrate. The substrate table is equipped with a chuck having a plurality of protrusions which support corresponding parts on the lower surface of a wafer. At least one top surface of the protrusion is equipped with a plurality of elements which define a reduced contact surface between the substrate and the top surface of the protrusion.
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus which prevents unevenness in supporting a substrate. SOLUTION: A lithographic projection apparatus includes: a beam production system to provide a beam of radiation, pattern the beam of radiation, and project the patterned beam onto a target portion of the substrate; a support table including protrusions to support an article; a detector to detect height deviations of the protrusions; a material removing device arranged to modify a height of protrusion material; a controller coupled between the detector and the material removing device. The material removing device includes a removal tool selected from a group consisting of a mechanical polishing device, a magneto rheological finishing tool, and a single or multipoint diamond tool. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus that prevents the slip occurring on a substrate table. SOLUTION: The lithographic apparatus includes an illumination system IL configured to adjust a radiation beam B; a support MT constructed to support a patterning device MA, the patterning device imparting the radiation beam B with a pattern in its cross-section to form a patterned radiation beam; a mirror block MB provided with the substrate table WT constructed to hold a substrate W; and a projection system PS configured to project the patterned radiation beam onto a target portion of the substrate W, wherein the mirror block MB is constructed and arranged to reduce slip between the mirror block MB and the substrate table WT. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To improve calibration of multiple alignment heads and to improve overlay accuracy and product yield. SOLUTION: A calibration method for calibrating the positions of secondary alignment heads by using a primary alignment head in a multi-head alignment system is disclosed. The system is used for marker measurement on the surface of a wafer e.g. and is performed during a lithographic processing for forming a circuit in the wafer or on the wafer. A plurality of offset measurements are performed for at least one secondary alignment head, so that the offset of the secondary alignment heads with respect to the primary alignment head can be measured, and used as correction data in subsequent wafer measurement calculations. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for calibrating an optimum take over height of a substrate in a lithographic apparatus between a substrate table and an ejector element movable to load and unload the substrate from the substrate table. SOLUTION: The method includes clamping the substrate on one of the substrate table and ejector element; moving the ejector element between an unloaded state wherein the substrate is supported by the substrate table and a loaded state wherein the substrate is at least partly supported by the ejector element; determining a reference height of the ejector element at the moment that the weight of the substrate is at least partly taken over between the substrate table and the ejector element; and determining the optimum take over height for the ejector element from the determined reference height. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate arranging method having improved arrangement accuracy relative to known ones until now; a substrate transferring method; and a transferring system. SOLUTION: This invention is related to a method of arranging a substrate on a surface of a substrate holder provided with a plurality of bars. In this method, substrate arrangement data for allowing the substrate to be arranged at a specific position with respect to the positions of the plurality of bars located on a surface of the substrate holder are first calculated. Then, the substrate is arranged at the specific position in accordance with the substrate arrangement data. The specific position is based on an arrangement position to minimize an overlay error or based on an arrangement position to minimize deformation of the substrate. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of transferring a substrate and a transfer system, having more improved placement accuracy than hitherto known. SOLUTION: This method can transfer a substrate from a first substrate holder, e.g. a pre-alignment unit to a second substrate holder, e.g. a substrate table in a lithographic apparatus by a transfer unit, based on transfer data used available thereto. First, a substrate is provided to the first substrate holder. Subsequently, a positional difference of the substrate is measured and positional adjustment data are calculated based on the measured positional difference. Then, the second substrate holder is moved to its reference position in accordance with the positional adjustment data. Finally, the substrate is transferred from the first substrate holder to the second substrate holder by the transfer unit in accordance with the transfer data, and the substrate is disposed on the second substrate holder after moving. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
A calibration method is disclosed, for the position calibration of secondary alignment heads with a primary alignment head in a multi- head alignment system, such as that used for the measurement of markers on the surface of a wafer, as carried out during a lithographic process in the formation of circuits in or on the wafer. A plurality of offset measurements are made for at least one of the secondary alignment heads, so that the offset of the secondary alignment heads with respect to the primary alignment head can be measured, and used as correction data in subsequent wafer measurement calculations. Fig. 18