Method of transferring substrate, transfer system and lithographic projection apparatus
    1.
    发明专利
    Method of transferring substrate, transfer system and lithographic projection apparatus 有权
    传输基板,传输系统和平面投影装置的方法

    公开(公告)号:JP2009135443A

    公开(公告)日:2009-06-18

    申请号:JP2008262677

    申请日:2008-10-09

    Abstract: PROBLEM TO BE SOLVED: To provide a method of transferring a substrate and a transfer system having more improved placement accuracy than hitherto known. SOLUTION: This method in a lithographic apparatus can transfer a substrate from a first substrate holder to a second substrate holder by a transfer unit based on transfer data available thereto. The second substrate holder includes a surface on which a plurality of first bars are provided. This method provides a memory in which bar position data and substrate position data are encoded. Thereby, the substrate is provided on the first substrate holder. Then, a position error and direction of the substrate are measured. The direction adjustment data are calculated based on the bar position data, the substrate position data and the measured direction. The direction of the substrate is then adjusted in accordance with the direction adjustment data. After that, the substrate is transferred from the first substrate holder to the second substrate holder by the transfer unit, and is disposed on the second substrate holder. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种转移基板和传输系统的方法,该方法具有比迄今已知的更好的放置精度。 解决方案:光刻设备中的这种方法可以基于可用的传输数据,通过传送单元将基板从第一基板保持器传送到第二基板保持器。 第二基板保持器包括其上设置有多个第一条的表面。 该方法提供了一种存储器,其中对条位数据和衬底位置数据进行编码。 由此,基板设置在第一基板支架上。 然后,测量基板的位置误差和方向。 基于杆位置数据,基板位置数据和测量方向计算方向调整数据。 然后根据方向调整数据调整基板的方向。 之后,通过转印单元将衬底从第一衬底保持器转移到第二衬底保持器,并且设置在第二衬底保持器上。 版权所有(C)2009,JPO&INPIT

    Substrate table, and method of enhancing substrate release characteristics
    2.
    发明专利
    Substrate table, and method of enhancing substrate release characteristics 有权
    基板表和增强基板释放特性的方法

    公开(公告)号:JP2012033964A

    公开(公告)日:2012-02-16

    申请号:JP2011238385

    申请日:2011-10-31

    CPC classification number: G03F7/707 G03F7/70708 H01L21/6875 H01L21/68757

    Abstract: PROBLEM TO BE SOLVED: To provide a substrate table with higher reliability for releasing a wafer from the substrate table in a lithography apparatus.SOLUTION: A lithography apparatus comprises an illumination system which adjusts a radiation beam, and a support which supports a patterning device. The patterning device can form a patterned radiation beam by patterning the cross-section of the radiation beam. The apparatus further comprises a substrate table which holds a substrate, and a projection system which projects the patterned radiation beam onto a target part of the substrate. The substrate table is equipped with a chuck having a plurality of protrusions which support corresponding parts on the lower surface of a wafer. At least one top surface of the protrusion is equipped with a plurality of elements which define a reduced contact surface between the substrate and the top surface of the protrusion.

    Abstract translation: 要解决的问题:提供一种具有更高可靠性的衬底台,用于从光刻设备中的衬底台释放晶片。 解决方案:光刻设备包括调节辐射束的照明系统和支撑图案形成装置的支撑件。 图案形成装置可以通过图案化辐射束的横截面来形成图案化的辐射束。 该装置还包括保持衬底的衬底台和将图案化的辐射束投影到衬底的目标部分上的投影系统。 衬底台配备有具有多个突起的卡盘,该突起支撑晶片下表面上的对应部分。 突起的至少一个顶表面装备有多个元件,其限定了基板和突起的顶表面之间的减小的接触表面。 版权所有(C)2012,JPO&INPIT

    Lithographic apparatus, method for removing material of one or more protrusions on support surface, and article support system
    3.
    发明专利
    Lithographic apparatus, method for removing material of one or more protrusions on support surface, and article support system 有权
    平面设备,用于移除支持表面上的一个或多个主题的材料的方法和文章支持系统

    公开(公告)号:JP2010199581A

    公开(公告)日:2010-09-09

    申请号:JP2010031894

    申请日:2010-02-17

    CPC classification number: B24B31/112 B24B35/00 G03B27/58 G03F7/707 G03F7/70783

    Abstract: PROBLEM TO BE SOLVED: To provide a lithographic apparatus which prevents unevenness in supporting a substrate. SOLUTION: A lithographic projection apparatus includes: a beam production system to provide a beam of radiation, pattern the beam of radiation, and project the patterned beam onto a target portion of the substrate; a support table including protrusions to support an article; a detector to detect height deviations of the protrusions; a material removing device arranged to modify a height of protrusion material; a controller coupled between the detector and the material removing device. The material removing device includes a removal tool selected from a group consisting of a mechanical polishing device, a magneto rheological finishing tool, and a single or multipoint diamond tool. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种防止支撑基板的不均匀性的光刻设备。 光刻投影设备包括:光束产生系统,用于提供辐射束,对辐射束进行图案化,并将图案化的光束投射到基板的目标部分上; 支撑台,其包括用于支撑制品的突起; 用于检测突起的高度偏差的检测器; 布置成改变突起材料的高度的材料去除装置; 耦合在检测器和材料去除装置之间的控制器。 材料去除装置包括从由机械抛光装置,磁流变整理工具和单点或多点金刚石工具组成的组中选择的清除工具。 版权所有(C)2010,JPO&INPIT

    Position calibration of alignment head in multi-head alignment system
    5.
    发明专利
    Position calibration of alignment head in multi-head alignment system 有权
    多头对齐系统中对准头的位置校准

    公开(公告)号:JP2011023725A

    公开(公告)日:2011-02-03

    申请号:JP2010160451

    申请日:2010-07-15

    CPC classification number: G03F9/7011 G03F9/7019 G03F9/7088

    Abstract: PROBLEM TO BE SOLVED: To improve calibration of multiple alignment heads and to improve overlay accuracy and product yield. SOLUTION: A calibration method for calibrating the positions of secondary alignment heads by using a primary alignment head in a multi-head alignment system is disclosed. The system is used for marker measurement on the surface of a wafer e.g. and is performed during a lithographic processing for forming a circuit in the wafer or on the wafer. A plurality of offset measurements are performed for at least one secondary alignment head, so that the offset of the secondary alignment heads with respect to the primary alignment head can be measured, and used as correction data in subsequent wafer measurement calculations. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题:改善多个对准头的校准,并提高重叠精度和产品产量。 公开了一种用于通过使用多头对准系统中的主对准头校准二次对准头的位置的校准方法。 该系统用于在晶片表面上进行标记测量,例如 并且在用于在晶片或晶片上形成电路的光刻处理期间执行。 对于至少一个次对准头执行多个偏移测量,使得可以测量次对准头相对于主对准头的偏移,并用作随后的晶片测量计算中的校正数据。 版权所有(C)2011,JPO&INPIT

    Calibration method and lithographic apparatus for calibrating optimum take over height of substrate
    6.
    发明专利
    Calibration method and lithographic apparatus for calibrating optimum take over height of substrate 有权
    用于校准基板高度最佳采样的校准方法和平面设备

    公开(公告)号:JP2010109369A

    公开(公告)日:2010-05-13

    申请号:JP2009244037

    申请日:2009-10-23

    CPC classification number: G03B27/58 G03F7/70516 G03F7/70691

    Abstract: PROBLEM TO BE SOLVED: To provide a method for calibrating an optimum take over height of a substrate in a lithographic apparatus between a substrate table and an ejector element movable to load and unload the substrate from the substrate table. SOLUTION: The method includes clamping the substrate on one of the substrate table and ejector element; moving the ejector element between an unloaded state wherein the substrate is supported by the substrate table and a loaded state wherein the substrate is at least partly supported by the ejector element; determining a reference height of the ejector element at the moment that the weight of the substrate is at least partly taken over between the substrate table and the ejector element; and determining the optimum take over height for the ejector element from the determined reference height. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种用于校准光刻设备中的基板的最佳接管高度的方法,该基板在可移动以从基板台加载和卸载基板的基板台和顶出元件之间。 解决方案:该方法包括将衬底夹在衬底台和顶出器元件中的一个上; 在所述衬底被所述衬底台支撑的卸载状态和所述衬底至少部分地被所述顶出器元件支撑的负载状态之间移动所述顶出器元件; 在衬底的重量至少部分地覆盖在衬底台和顶出器元件之间的时刻,确定顶出器元件的基准高度; 以及从所确定的参考高度确定所述喷射器元件的最佳接管高度。 版权所有(C)2010,JPO&INPIT

    Method of arranging substrate, method of transferring substrate, support system and lithographic projection apparatus
    7.
    发明专利
    Method of arranging substrate, method of transferring substrate, support system and lithographic projection apparatus 有权
    安装基板的方法,基板的传输方法,支撑系统和平面投影装置

    公开(公告)号:JP2009170874A

    公开(公告)日:2009-07-30

    申请号:JP2008264460

    申请日:2008-10-10

    CPC classification number: G03F7/70783 G03F7/70633

    Abstract: PROBLEM TO BE SOLVED: To provide a substrate arranging method having improved arrangement accuracy relative to known ones until now; a substrate transferring method; and a transferring system. SOLUTION: This invention is related to a method of arranging a substrate on a surface of a substrate holder provided with a plurality of bars. In this method, substrate arrangement data for allowing the substrate to be arranged at a specific position with respect to the positions of the plurality of bars located on a surface of the substrate holder are first calculated. Then, the substrate is arranged at the specific position in accordance with the substrate arrangement data. The specific position is based on an arrangement position to minimize an overlay error or based on an arrangement position to minimize deformation of the substrate. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种相对于迄今已知的布置精度提高的基片布置方法; 基板转印方法; 和转移系统。 解决方案:本发明涉及将衬底布置在设置有多个条的衬底保持器的表面上的方法。 在该方法中,首先计算用于使基板相对于位于基板保持件的表面上的多个条的位置的特定位置配置的基板布置数据。 然后,基板根据基板布置数据布置在特定位置。 具体位置基于布置位置,以最小化覆盖误差或者基于布置位置以最小化基板的变形。 版权所有(C)2009,JPO&INPIT

    Method of transferring substrate, transfer system and lithographic projection apparatus
    8.
    发明专利
    Method of transferring substrate, transfer system and lithographic projection apparatus 审中-公开
    传输基板,传输系统和平面投影装置的方法

    公开(公告)号:JP2009135442A

    公开(公告)日:2009-06-18

    申请号:JP2008262638

    申请日:2008-10-09

    Abstract: PROBLEM TO BE SOLVED: To provide a method of transferring a substrate and a transfer system, having more improved placement accuracy than hitherto known. SOLUTION: This method can transfer a substrate from a first substrate holder, e.g. a pre-alignment unit to a second substrate holder, e.g. a substrate table in a lithographic apparatus by a transfer unit, based on transfer data used available thereto. First, a substrate is provided to the first substrate holder. Subsequently, a positional difference of the substrate is measured and positional adjustment data are calculated based on the measured positional difference. Then, the second substrate holder is moved to its reference position in accordance with the positional adjustment data. Finally, the substrate is transferred from the first substrate holder to the second substrate holder by the transfer unit in accordance with the transfer data, and the substrate is disposed on the second substrate holder after moving. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种转移基板和转印系统的方法,其具有比迄今已知的更好的放置精度。 解决方案:该方法可以从第一衬底保持器(例如, 将预对准单元连接到第二衬底保持器,例如。 基于转印单元的光刻设备中的基板,基于可用于其的转印数据。 首先,将基板设置到第一基板保持器。 随后,测量基板的位置差异,并且基于所测量的位置差来计算位置调整数据。 然后,根据位置调整数据将第二基板支架移动到其基准位置。 最后,根据传送数据,通过转印单元将衬底从第一衬底保持器转移到第二衬底保持器,并且衬底在移动之后设置在第二衬底保持器上。 版权所有(C)2009,JPO&INPIT

    POSITION CALIBRATION OF ALIGNMENT HEADS IN A MULTI-HEAD ALIGNMENT SYSTEM

    公开(公告)号:SG168488A1

    公开(公告)日:2011-02-28

    申请号:SG2010051423

    申请日:2010-07-15

    Abstract: A calibration method is disclosed, for the position calibration of secondary alignment heads with a primary alignment head in a multi- head alignment system, such as that used for the measurement of markers on the surface of a wafer, as carried out during a lithographic process in the formation of circuits in or on the wafer. A plurality of offset measurements are made for at least one of the secondary alignment heads, so that the offset of the secondary alignment heads with respect to the primary alignment head can be measured, and used as correction data in subsequent wafer measurement calculations. Fig. 18

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