Abstract:
PROBLEM TO BE SOLVED: To provide a method for removal of deposition on an optical element of a lithographic apparatus, and the lithographic apparatus. SOLUTION: The method for removal of deposition on a radiation collector of a lithographic apparatus includes a process of providing a gas barrier to the end of the radiation collector, thereby providing a radiation collector enclosure volume; a process of providing a gas to the enclosure volume, the gas selected from a halogen containing gas and a hydrogen, deuterium and/or tritium containing gas; and a process of removing at least part of the deposition from the radiation collector. The lithographic apparatus includes the radiation collector; a circumferential hull enclosing the radiation collector; and the gas barrier at the end of the radiation collector, thereby providing the radiation collector enclosure volume. The radiation collector is enclosed by the circumferential hull and the gas barrier. An inlet feeds a gas to the radiation collector enclosure volume and an outlet exhausts a gas from the radiation collector enclosure volume. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a lithography apparatus capable of removing a collector contaminant by a relatively simple method. SOLUTION: This lithography apparatus is equipped with a collector for receiving an irradiated beam from an irradiation source and transmitting the irradiated beam to a lighting system. In the collector, at least one of fluid duct is provided. The lithography apparatus has a temperature controller for heat-controlling the collector using the fluid duct of the collector. The temperature controller supplies a first fluid to the fluid duct during a first period and supplies a second fluid to the fluid duct at least during a second period. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithography apparatus, a device manufacturing method for manufacturing a device with high precision, and a device manufactured by the same. SOLUTION: The lithography apparatus comprises: an illumination system IL for providing a projection beam of radiation PB; and a support structure MT for supporting a patterning means MA. The lithographic apparatus further comprises: a substrate table WT for holding a substrate W; a projection system PL for projecting the patterned beam onto a target portion of the substrate W; and a condenser which is structured to transmit a radiation R, received from a first radiation source SO, to the illumination system IL. The condenser K comprises at least one heater for heating the condenser when a condensing component receives substantially no radiation from the radiation source SO. COPYRIGHT: (C)2005,JPO&NCIPI