Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
    2.
    发明专利
    Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method 有权
    检查方法和装置,光刻设备,光刻处理单元和器件制造方法

    公开(公告)号:JP2009038339A

    公开(公告)日:2009-02-19

    申请号:JP2008120101

    申请日:2008-05-02

    CPC classification number: G03F1/84 G03F7/7065

    Abstract: PROBLEM TO BE SOLVED: To provide a method and an apparatus for accurately determining the location on a patterned substrate from which a measurement of an image of the pattern is being obtained. SOLUTION: A method of measuring a property of a substrate includes generating a patterned mask configured to cause a radiation beam B passing through the mask MA to acquire the pattern, simulating radiating the substrate W with a patterned radiation beam that has been patterned using the mask to obtain a simulated pattern, determining at least one location of the simulated pattern that is prone to patterning errors, and irradiating the substrate with the patterned radiation beam using a lithographic process. The method also includes measuring the accuracy of at least one property of the at least one location of the pattern on the substrate that has been determined as being prone to patterning errors, and adjusting the lithographic process according to the measuring. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种用于精确地确定图案化基板上的位置的方法和装置,从该图案基板获得图案的图像的测量。 解决方案:测量衬底的性质的方法包括:生成图案化掩模,其被配置成使通过掩模MA的辐射束B获得图案,模拟用图案化的图案化辐射束辐射衬底W 使用掩模获得模拟图案,确定易于图案化错误的模拟图案的至少一个位置,以及使用光刻工艺对图案化辐射束照射基板。 该方法还包括测量已被确定为易于图案化错误的衬底上的图案的至少一个位置的至少一个特性的精度,以及根据测量来调整光刻工艺。 版权所有(C)2009,JPO&INPIT

    Method and apparatus for characterizing angular-resolved spectroscopic lithography
    3.
    发明专利
    Method and apparatus for characterizing angular-resolved spectroscopic lithography 有权
    用于表征角度分辨光谱的方法和装置

    公开(公告)号:JP2008042202A

    公开(公告)日:2008-02-21

    申请号:JP2007200847

    申请日:2007-08-01

    CPC classification number: G06K9/4661 G03F7/70625

    Abstract: PROBLEM TO BE SOLVED: To provide reconfiguration of a target which diffracts radiation.
    SOLUTION: This reconfiguration includes estimating the geometry of a target; obtaining a model diffraction pattern based on the estimated geometry; irradiating radiation to the target; detecting a diffraction pattern of the radiation diffracted by the target; comparing the model diffraction pattern and the detected diffraction pattern; and determining the actual geometry of the target based on the difference between the model diffraction pattern and the detected diffraction pattern. The model diffraction pattern is determined based on the Bloch mode expansion.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:提供衍射辐射的靶的重新配置。 解决方案:该重新配置包括估计目标的几何形状; 基于估计的几何获得模型衍射图; 向目标照射辐射; 检测由靶衍射的辐射的衍射图案; 比较模型衍射图和检测衍射图; 并且基于模型衍射图案和检测到的衍射图案之间的差异来确定目标的实际几何形状。 基于Bloch模式扩展确定模型衍射图案。 版权所有(C)2008,JPO&INPIT

    Passive integrated optical systems and methods for reduction of spatial optical coherence

    公开(公告)号:IL316606A

    公开(公告)日:2024-12-01

    申请号:IL31660624

    申请日:2024-10-28

    Abstract: Passive integrated optical systems and methods are described. The present systems and methods facilitate reduction of spatial optical coherence in source radiation used for metrology, for example. Current coherence scramblers used for metrology typically include one or more (moving) mechanical components configured to reduce the coherence of source radiation. However, these mechanical coherence scramblers occupy volume within a system and introduce the threat of mechanical wear and/or failure. In contrast, the present systems and methods utilize a combination of passive integrated optical elements to form a coherence scrambler. This reduces or eliminates the use of mechanical components and increases durability, among other advantages.

    5.
    发明专利
    未知

    公开(公告)号:DE60124336D1

    公开(公告)日:2006-12-21

    申请号:DE60124336

    申请日:2001-04-26

    Abstract: Alignment to buried marks is carried out by using electromagnetic radiation to induce waves in the layers covering the buried layer. The acoustic or thermal waves cause reflectivity changes and displacements in the surface whose position and/or time dependence reveals the true position of the buried alignment mark. The buried alignment mark may be revealed by mapping the thickness of covering layers in its vicinity, e.g. by measuring the time dependence of the decay of a standing wave induced in the covering layers or by measuring the delay time of echoes of a travelling wave created at interfaces between different ones of the covering layers. Alternatively, a travelling wave can be created over the whole area of the mark so that echoes off the top and bottom of the buried mark carry positive and negative images of the mark; these cause reflectivity differences and displacements when they reach the surface which can be aligned to.

    10.
    发明专利
    未知

    公开(公告)号:DE60124336T2

    公开(公告)日:2007-06-06

    申请号:DE60124336

    申请日:2001-04-26

    Abstract: Alignment to buried marks is carried out by using electromagnetic radiation to induce waves in the layers covering the buried layer. The acoustic or thermal waves cause reflectivity changes and displacements in the surface whose position and/or time dependence reveals the true position of the buried alignment mark. The buried alignment mark may be revealed by mapping the thickness of covering layers in its vicinity, e.g. by measuring the time dependence of the decay of a standing wave induced in the covering layers or by measuring the delay time of echoes of a travelling wave created at interfaces between different ones of the covering layers. Alternatively, a travelling wave can be created over the whole area of the mark so that echoes off the top and bottom of the buried mark carry positive and negative images of the mark; these cause reflectivity differences and displacements when they reach the surface which can be aligned to.

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