Abstract:
기판에걸쳐조명프로파일을스캐닝하여그 위에기능영역들을형성하도록구성되는스캐닝노광장치를제어하는방법이개시된다. 상기방법은스캐닝노광작업에서, 기능영역들을포함하는노광필드의노광동안조명프로파일의동적제어를위한제어프로파일을얻는단계; 및개별적인기능영역의노광품질을최적화하는단계를포함한다. 최적화하는단계는 a) 스캐닝방향으로노광필드의범위를넘어제어프로파일을확장하는단계; 및/또는 b) 제어프로파일에디컨볼루션방식을적용하는단계를포함할수 있고, 디컨볼루션방식의구조는스캐닝방향으로의조명프로파일의치수에기초한다.
Abstract:
PROBLEM TO BE SOLVED: To provide a level sensor which is used to measure the height of a substrate in a lithographic projection device, can be also used for a single-stage immersion lithographic device, has no process dependency, is of high reaction rate, and is of a kind different from a conventional type. SOLUTION: The level sensor includes a transmitter 10 and a receiver 11. The transmitter is configured to transmit a pressure wave 100 to a predetermined position on the surface of a substrate between the substrate W and a projection system PS, and to allow the substrate W to reflect at least a part of the pressure wave. The receiver receives at least a part of the reflected wave. The level sensor is configured to determine the height of the surface in the substrate W based on the pressure wave transmitted and received. The level sensor can be used for immersion process, quickly works and has a scarce process dependency, because the pressure wave is used. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To control a laser radiation spectrum emitted by a laser radiation source, thereby allowing a lithographic apparatus to more accurately project patterns on a substrate. SOLUTION: A lithographic method includes: a step of calculating laser metric based on a spectrum of a laser radiation emitted to the lithographic apparatus from a laser and representation of an aerial image of the pattern projected on the substrate by the lithographic apparatus; a step of either changing operation of the laser or adjusting the lithographic apparatus by using the laser metric; and a step of projecting the pattern on the substrate. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an additional technology for reducing and/or increasing a lens-heating action. SOLUTION: In the lithographic apparatus, a control system is provided so as to automatically reduce throughput of device manufacture when aberration of lens-heating exceeds a specific threshold value. Determination whether the aberration of lens-heating exceeds the threshold value, is obtained by, for example, prediction using a lens-heating model or measurement of a previously exposed substrate. Reduction of the throughput can be achieved by reducing beam power or duty-cycle of the apparatus. In a specific embodiment, time required for substrate transfer between exposed portions is increased. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method and a device that can be used to reduce a range in which an assist feature is exposed to light in a resist on a substrate.SOLUTION: A method for projecting a pattern from a patterning device on a substrate by using a projection system includes applying phase correction to radiation diffracted from an assist feature of a pattern by using a light phase adjustment device in the projection system. The phase correction acts to reduce the size of an assist feature image exposed to light in a resist on the substrate or prevent printing of the assist feature image in the resist on the substrate, as well as to maintain contribution to strengthening of an image of a function feature of a pattern by the assist feature image.
Abstract:
PROBLEM TO BE SOLVED: To provide a method having better focus control. SOLUTION: A method for deciding exposure setting for a target field on a substrate in a lithography exposure process includes to provide calibration data by deciding a location of a calibration field in a first direction in a plurality of calibration locations in a second direction and a third direction in relation to the calibration field. Further, the method includes to provide production data by deciding a position of a target field on a substrate in the second and the third directions, and by measuring a position of an exposure field in the first direction in at least one measurement position in relation to the exposure field in the second and the third directions. Furthermore, the method includes: to perform comparisons between at least one first measured relative position and a plurality of relative calibration positions; and to use the comparisons for deciding the exposure setting on the basis of a measured position of the exposure field in the first direction and the calibration data, in relation to at least one relative calibration position in which the calibration data is different from at least one measured relative position. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus including a position measurement system for accurately measuring a substrate table position.SOLUTION: The lithographic apparatus comprises: a substrate table position measurement system for measuring a substrate table position; and a projection system position measurement system for measuring a projection system position. The substrate table position measurement system comprises: a substrate table reference element mounted on the substrate table; and a first sensor head. The substrate table reference element extends in a measurement plane substantially parallel to a holding plane of a substrate on the substrate table. The holding plane is arranged at one side of the measurement plane and the first sensor head is arranged at an opposite side of the measurement plane. The projection system position measurement system includes one or more projection system reference elements and a sensor assembly. The sensor head and the sensor assembly or the associated projection system measurement elements are mounted on a sensor frame.
Abstract:
PROBLEM TO BE SOLVED: To reduce time for measuring level fluctuations on a substrate surface. SOLUTION: A lithographic device includes a patterning sub-system transferring a pattern from a patterning device to a substrate (W). The patterning sub-system is controlled according to a recorded result of measurement of the level fluctuations of the recorded substrate surface. Level sensors (LSP, LSD) are disposed to project level sensing radiation beams, reflect them from the position on the substrate surface, and detect the reflected sensing beams to measure the surface level of the position. Each level sensor includes at least one moving optical element (MP, MD) and at least one-dimensionally scans the substrate surface by optical movement (δY) to obtain the result of measurement of the surface levels of different positions without mechanical operation between the level sensor and the substrate. An optical path length-equalizing means is disposed to avoid focus fluctuations during scanning by using a molded reflector and/or an additional moving mirror. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus improved in the curvature compensation of a substrate. SOLUTION: A lighting system is configured to form a slit type image on the flat plane of a patterning device. The slit type image has a curved shape with a slit curvature in a scanning direction, a length LS in the scanning direction, and a rectangular width for a scanning direction Y. The slit type image is configured to generate a curved pattern image of a patterned radiation beam on the image flat plane of a projection system. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To improve the measurement of a variability of MSD that influences the uniformity of CD. SOLUTION: A test method includes operating a lithographic apparatus several times while deliberately imposing a relatively large dynamic positioning error at different specific frequencies and axes (504). Variations (CDU) in the error (CD) in an applied pattern are measured for different frequencies and amplitudes of the injected error over a frequency band of interest for a given axis. Calculation using the measurements and knowledge of the frequencies injected (508, 510) allows analysis of dynamic positioning error variations in frequency bands correlated with each injected error frequency. Based on parameters of patterning operations and a relationship between the injected axis and the measured axis, a correlation function (CF) is used in the calculation. A CD sensitivity is measured by operating the apparatus at a reduced speed and injecting errors at frequencies determined by the null frequency of scanning slit filter response. COPYRIGHT: (C)2011,JPO&INPIT