公开(公告)号：NL2008924A

公开(公告)日：2013-01-02

申请号：NL2008924

申请日：2012-06-01

Applicant: ASML NETHERLANDS BV

Inventor： CAO YU ,  MULKENS JOHANNES ,  YE JUN ,  VELLANKI VENUGOPAL

IPC: G03F7/20

公开(公告)号：SG11201606207WA

公开(公告)日：2016-09-29

申请号：SG11201606207W

申请日：2015-01-07

Applicant: ASML NETHERLANDS BV

Inventor： HUNSCHE STEFAN ,  VELLANKI VENUGOPAL

IPC: G03F7/20

Abstract: A defect prediction method for a device manufacturing process involving processing a pattern onto a substrate, the method comprising: identifying a processing window limiting pattern (PWLP) from the pattern; determining a processing parameter under which the PWLP is processed; and determining or predicting, using the processing parameter, existence, probability of existence, a characteristic, or a combination thereof, of a defect produced from the PWLP with the device manufacturing process.