TERMINATION OF FREE RADICAL EMULSION POLYMERIZATION, AND COMPOSITION FOR STABILIZING LATEX

    公开(公告)号:JP2001253903A

    公开(公告)日:2001-09-18

    申请号:JP2001061426

    申请日:2001-03-06

    Abstract: PROBLEM TO BE SOLVED: To provide a composition for termination, not only capable of effectively terminating a free radical polymerization reaction but also capable of imparting an improved stability to a rubber latex without providing bad effect to safety, health and environment. SOLUTION: This composition for termination contains at least one kind of hydrophilic radical scavenger (that is the terminator) and at least one kind of hydrophobic radical scavenger. Preferably, the composition targets the use in an emulsion process for a rubber latex. The composition exhibits excellent activities not only as the terminator of the free radical emulsion polymerization but also as the stabilizer for the corresponding polymer. Further, the composition can inhibit the additional polymerization even after stripping the polymer with steam without requiring the additional stabilizer. The composition can inhibit the polymerization without using chemicals having high risk on the safety, the health or the environment.

    COMPOSITION AND METHOD FOR COPPER CHEMICAL MECHANICAL PLANARIZATION

    公开(公告)号:MY133337A

    公开(公告)日:2007-11-30

    申请号:MYPI20034568

    申请日:2003-11-28

    Abstract: A FAMILY OF SLURRIES ARE DISCLOSED WHICH ARE USEFUL IN MODIFYING EXPOSED SURFACES OF WAFERS FOR SEMICONDUCTOR FABRICATION ARE PROVIDED ALONG WITH METHODS OF MODIFYING EXPOSED SURFACES OF WAFERS FOR SEMICONDUCTOR FABRICATION UTILIZING SUCH A FAMILY OF WORKING SLURRIES, AND SEMICONDUCTOR WAFERS. THE SLURRIES OF THE INVENTION ARE COMPRISED OF A LIQUID CARRIER;A SULFUR-BEARING COMPOUNDS CAPABLE OF CONVERTING COPPER TO COPPER SULFIDE; OPTIONALLY , ABRASIVE PARTICLES (POLISHING AGENT; OPTIONALLY A CHELATING AGENT; OPTIONALLY A BUFFERING AGENT; OPTIONALLY, A STOPPING COMPOUND; OPTIONALLY, OTHER ADDITIVES; AND OPTIONALLY,A CO-SOLVENT. THE METHOD OF THE INVENTION COMPRISES THE STEPS F : A) PROVIDING A WAFER COMPRISING A FIRST MATERIAL HAVING A SURFACE ETCHED TO FORM A PATTERN AND A SECOND MATERIAL DEPOSITED OVER THE SURFACE OF THE FIRST MATERIAL; B) CONTACTING THE SECOND MATERIAL OF THE WAFER WITH ABRASIVE IN THE PRESENCE OF THE WORKING SLURRY; AND C) RELATIVELY MOVING THE WAFER OR POLISHING PAD OR BOTH WHILE THE SECOND MATERIAL IS IN CONTACT WITH THE SLURRY AND ABRASIVE PARTICLES UNTIL AN EXPOSED SURFACE OF THE WAFER IS PLANAR AN COMPRISES AT LEAST ONE AREA OF EXPOSED FIRST MATERIAL AND ONE AREA OF EXPOSED SECOND MATERIAL.

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