公开(公告)号：EP0164674A2

公开(公告)日：1985-12-18

申请号：EP85106835.3

申请日：1985-06-03

Applicant: Advanced Technology Laboratories, Inc.

Inventor： Frey, Gregg W.

IPC: H01B1/22

CPC classification number: H05K3/4007 ,  C08K7/18 ,  C09J5/02 ,  H01B1/22 ,  H05K3/244 ,  H05K3/323 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09754 ,  H05K2201/10234 ,  H05K2201/10977 ,  C08L63/00

Abstract: The present invention is a method and structure which produces extremely thin, electrically conductive epoxy bonds (24) between two substrates (12, 14). Copper microspheres (26), having an average diameter of about 2 microns are bound in an epoxy layer (28) which bonds two substrates (12, 14) together. The microspheres (26) make electrical contact between the substrates (12, 14) while providing inter- sphere gaps which are filled with the epoxy which actually bonds the substrates (12, 14) together.

公开(公告)号：EP0164674A3

公开(公告)日：1987-01-07

申请号：EP85106835

申请日：1985-06-03

Applicant: Advanced Technology Laboratories, Inc.

Inventor： Frey, Gregg W.

IPC: H01B01/22

CPC classification number: H05K3/4007 ,  C08K7/18 ,  C09J5/02 ,  H01B1/22 ,  H05K3/244 ,  H05K3/323 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09754 ,  H05K2201/10234 ,  H05K2201/10977 ,  C08L63/00

Abstract: The present invention is a method and structure which produces extremely thin, electrically conductive epoxy bonds (24) between two substrates (12, 14). Copper microspheres (26), having an average diameter of about 2 microns are bound in an epoxy layer (28) which bonds two substrates (12, 14) together. The microspheres (26) make electrical contact between the substrates (12, 14) while providing inter- sphere gaps which are filled with the epoxy which actually bonds the substrates (12, 14) together.