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公开(公告)号：US11892467B2
公开(公告)日：2024-02-06
申请号：US17555002
申请日：2021-12-17
Applicant: Analog Devices, Inc.
Inventor： Kemiao Jia , Xin Zhang , Michael Judy
IPC: G01P15/125 , G01P1/00
CPC classification number: G01P15/125 , G01P1/00
Abstract: A microelectromechanical systems (MEMS) accelerometer is provided, comprising a substrate disposed in a plane defined by a first axis and a second axis perpendicular to the first axis; a first proof mass and a second proof mass coupled to the substrate and configured to translate in opposite directions of each other along a third axis perpendicular to the first and second axes; and at least one lever coupling the first proof mass to the second proof mass, wherein, the MEMS accelerometer is configured to detect acceleration along the third axis via detection of translation of the first and second proof masses along the third axis; and the MEMS accelerometer exhibits symmetry about the first and second axes.
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公开(公告)号：US11255873B2
公开(公告)日：2022-02-22
申请号：US16129755
申请日：2018-09-12
Applicant: Analog Devices, Inc.
Inventor： Xin Zhang , Gaurav Vohra , Michael Judy
IPC: G01P15/125 , G01P15/08
Abstract: Z-axis teeter-totter accelerometers with embedded movable structures are disclosed. The teeter-totter accelerometer may include an embedded mass which pivots or translates out-of-plane from the teeter-totter beam. The pivoting or translating embedded mass may be positioned to increase the sensitivity of the z-axis accelerometer by providing greater z-axis displacement than the teeter-totter beam itself exhibits.
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公开(公告)号：US20200314607A1
公开(公告)日：2020-10-01
申请号：US16831741
申请日：2020-03-26
Applicant: Analog Devices, Inc.
Inventor： Eugene Oh Hwang , Tao Yu , Phillip Nadeau , Michael Judy , Rui Zhang
Abstract: Described herein are techniques for improving the signal-to-noise ratio of a wireless sensor platform. The device that interrogates a wireless sensor node (an interrogator) may be configured to determine the quantity to be measured by extracting information from multiple echoes produced in response to multiple interrogation pulses or produced due to multi-path propagation. Although different echoes may have been transformed to different extents, the echoes may share unique characteristics that are specific to the wireless sensor node that produced them. Accordingly, the SNR may be improved by keeping only portions of the received signal that exhibit such characteristics. The SNR may be further improved by summing the echoes together. In some embodiments, the echoes may be summed together in a coherent fashion, thereby producing an echo having an amplitude greater than the amplitude of each of the received echoes.
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公开(公告)号：US20250118715A1
公开(公告)日：2025-04-10
申请号：US18730912
申请日：2023-01-24
Applicant: Analog Devices, Inc.
Inventor： Xin Zhang , Jianglong Zhang , Li Chen , John C. Cowles , Michael Judy , Shafi Saiyed
IPC: H01L25/16 , B81B7/00 , H01L23/538
Abstract: Compact packages including microelectromechanical system (MEMS) devices and multiple application specific integrated circuits (ASICs) are described. These packages are sufficiently small to be applicable to contexts in which space requirements are particularly strict, such as in consumer electronics. These packages involve vertical die stacks. A first ASIC may be positioned on one side of the die stack and another ASIC may be positioned on the other side of the die stack. A die including a MEMS device (e.g., an accelerometer, gyroscope, switch, resonator, optical device) is positioned between the ASICs. Optionally, an interposer serving as cap substrate for the MEMS device is also positioned between the ASICs. In one example, a package of the types described herein has an extension of 2 mm×2 mm in the planar axes and less than 500-800 μm in height.
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公开(公告)号：US20240300808A1
公开(公告)日：2024-09-12
申请号：US18596223
申请日：2024-03-05
Applicant: Analog Devices, Inc.
Inventor： Kemiao Jia , Gaurav Vohra , Xin Zhang , Christine H. Tsau , Chen Yang , Andrew Proudman , Matthew Kent Emsley , George M. Molnar, II , Nikolay Pokrovskiy , Ali Mohammed Shakir , Michael Judy
CPC classification number: B81C1/00666 , B81B3/0072 , B81B2203/0118 , B81B2203/0307 , B81B2203/0315 , B81C2201/0111 , B81C2201/019
Abstract: Described herein are manufacturing techniques for achieving stress isolation in microelectromechanical systems (MEMS) devices that involve isolation trenches formed from the backside of the substrate. The techniques described herein involve etching a trench in the bottom side of the substrate subsequent to forming a MEMS platform, and processing the MEMS platform to form a MEMS device on the top side of the substrate subsequent to etching the trench.
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Patent Agency Ranking
公开(公告)号：US11981560B2
公开(公告)日：2024-05-14
申请号：US17342442
申请日：2021-06-08
Applicant: Analog Devices, Inc.
Inventor： Xin Zhang , Christopher Needham , Andrew Proudman , Nikolay Pokrovskiy , George M. Molnar, II , Laura Cornelia Popa , Michael Judy
CPC classification number: B81C1/00325 , B81B7/0048 , B81C1/00063 , B81B2203/01
Abstract: A stress-isolated microelectromechanical systems (MEMS) device and a method of manufacture of the stress-isolated MEMS device are provided. MEMS devices may be sensitive to stress and may provide lower performance when subjected to stress. A stress-isolated MEMS device may be manufactured by etching a trench and/or a cavity in a first side of a substrate and subsequently forming a MEMS device on a surface of a platform opposite the first side of the substrate. Such a stress-isolated MEMS device may exhibit better performance than a MEMS device that is not stress-isolated. Moreover, manufacturing the MEMS device by first forming a trench and cavity on a backside of a wafer, before forming the MEMS device on a suspended platform, provides increased yield and allows for fabrication of smaller parts, in at least some embodiments.
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公开(公告)号：US11805396B2
公开(公告)日：2023-10-31
申请号：US16831741
申请日：2020-03-26
Applicant: Analog Devices, Inc.
Inventor： Eugene Oh Hwang , Tao Yu , Phillip Nadeau , Michael Judy , Rui Zhang
Abstract: Described herein are techniques for improving the signal-to-noise ratio of a wireless sensor platform. The device that interrogates a wireless sensor node (an interrogator) may be configured to determine the quantity to be measured by extracting information from multiple echoes produced in response to multiple interrogation pulses or produced due to multi-path propagation. Although different echoes may have been transformed to different extents, the echoes may share unique characteristics that are specific to the wireless sensor node that produced them. Accordingly, the SNR may be improved by keeping only portions of the received signal that exhibit such characteristics. The SNR may be further improved by summing the echoes together. In some embodiments, the echoes may be summed together in a coherent fashion, thereby producing an echo having an amplitude greater than the amplitude of each of the received echoes.
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公开(公告)号：US20230234835A1
公开(公告)日：2023-07-27
申请号：US18100846
申请日：2023-01-24
Applicant: Analog Devices, Inc.
Inventor： Xin Zhang , Jianglong Zhang , Li Chen , John C. Cowles , Michael Judy , Shafi Saiyed
IPC: B81B7/00 , H01L23/00 , H01L23/498 , B81C1/00
CPC classification number: B81B7/0048 , H01L23/562 , H01L23/49827 , B81C1/00666
Abstract: Packaging of microfabricated devices, such as integrated circuits, microelectromechanical systems (MEMS), or sensor devices is described. The packaging is 3D heterogeneous packaging in at least some embodiments. The 3D heterogeneous packaging includes an interposer. The interposer includes stress relief platforms. Thus, stresses originating in the packaging do not propagate to the packaged device. A stress isolation platform is an example of a stress relief feature. A stress isolation platform includes a portion of an interposer coupled to the remainder of the interposer via stress isolation suspensions. Stress isolation suspensions can be formed by etching trenches through the interposer.
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公开(公告)号：US20210380403A1
公开(公告)日：2021-12-09
申请号：US17342442
申请日：2021-06-08
Applicant: Analog Devices, Inc.
Inventor： Xin Zhang , Christopher Needham , Andrew Proudman , Nikolay Pokrovskiy , George M. Molnar, II , Laura Cornelia Popa , Michael Judy
Abstract: A stress-isolated microelectromechanical systems (MEMS) device and a method of manufacture of the stress-isolated MEMS device are provided. MEMS devices may be sensitive to stress and may provide lower performance when subjected to stress. A stress-isolated MEMS device may be manufactured by etching a trench and/or a cavity in a first side of a substrate and subsequently forming a MEMS device on a surface of a platform opposite the first side of the substrate. Such a stress-isolated MEMS device may exhibit better performance than a MEMS device that is not stress-isolated. Moreover, manufacturing the MEMS device by first forming a trench and cavity on a backside of a wafer, before forming the MEMS device on a suspended platform, provides increased yield and allows for fabrication of smaller parts, in at least some embodiments.
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公开(公告)号：US10203352B2
公开(公告)日：2019-02-12
申请号：US15228229
申请日：2016-08-04
Applicant: Analog Devices, Inc.
Inventor： Xin Zhang , William A. Clark , Michael Judy
IPC: G01P15/125 , G01P15/18 , G01P15/08
Abstract: A microelectromechanical systems (MEMS) accelerometer is described. The MEMS accelerometer may comprise a proof mass configured to sense accelerations in a direction parallel the plane of the proof mass, and a plurality of compensation structures. The proof mass may be connected to one or more anchors through springs. The compensation structures may be coupled to the substrate of the MEMS accelerometer through a rigid connection to respective anchors. A compensation structure may comprise at least one compensation electrode forming one or more lateral compensation capacitors. The compensation capacitor(s) may be configured to sense displacement of the anchor to which the compensation structures is connected.
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