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公开(公告)号：DE2811593A1
公开(公告)日：1979-09-27
申请号：DE2811593
申请日：1978-03-17
Applicant: BASF AG
Inventor： CLAD WERNER DIPL ING DR , PFALZGRAF WALTER , SIEGLER MANFRED ING GRAD
Abstract: In the prepn. of multilayer chipboard from adhesive coated wood chips, wood fibres and/or other lignocellulosic contg. materials which are spread in >=3 layers and then hot pressed and in which the covering layers contain a different adhesive from that used in the middle layer, the covering layers contain a polyvalent isocyanate as adhesive and >=1 middle layer contains an aminoplast or phenoplast as binder. The boards can be used in building or as wall coverings as they can be coated and have high water and alkali resistance, hardness, and strength. There is no trouble due to HCHO formation as the outer layers use the isocyanate as adhesive.
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公开(公告)号：DE2622028A1
公开(公告)日：1977-12-08
申请号：DE2622028
申请日：1976-05-18
Applicant: BASF AG
Inventor： REUTHER WOLFGANG DIPL CHEM DR , OPPENLAENDER KNUT DIPL CHEM DR , RAFF PAUL DIPL CHEM DR , POMMER ERNST-HEINRICH DR , SIEGLER MANFRED ING GRAD
Abstract: Wood preservatives containing a boric acid/alkylene oxide adduct, with alkylene of 2 to 8 carbon atoms, and a process for protecting wood against fungi and insects with this agent.
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公开(公告)号：DE3042813A1
公开(公告)日：1982-06-09
申请号：DE3042813
申请日：1980-11-13
Applicant: BASF AG
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