THERMOPLASTIC MOLDING MATERIALS AND MOLDINGS PRODUCED FROM THESE

    公开(公告)号:CA1162345A

    公开(公告)日:1984-02-14

    申请号:CA355098

    申请日:1980-06-30

    Applicant: BASF AG

    Abstract: An ABS molding material comprising a copolymer matrix A in which is dispersed a graft copolymer B. The graft copolymer B is composed of styrene and acrylonitrile as the grafting monomers on polybutadiene as a grafting base and has a mean particle diameter of from 0.2 to 0.45 .mu.m (d50value of the cumulative mass distribution). The gel component, isolated from the molding materials, is required to have a spin-spin relaxation time of from 0.7 to 1.5 .mu.s, so that the molding materials have a high surface gloss coupled with good notched impact strength even at low temperatures. The copolymer A can be a copolymer of styrene and acrylonitrile or a terpolymer additionally containing .alpha.-methylstyrene. The molding material can furthermore contain conventional additives. The molding materials according to the invention can be employed where great toughness coupled with high gloss is required, as in household appliances and in the automotive industry.

    6.
    发明专利
    未知

    公开(公告)号:DE59602975D1

    公开(公告)日:1999-10-14

    申请号:DE59602975

    申请日:1996-01-20

    Applicant: BASF AG

    Abstract: Graft copolymers (A) comprise (a1) 30-90 wt. % grafting base with a Tg of below 10 degrees C, obtd. from (a11) 10-99.8 wt % 2-ethylhexyl acrylate, (a12) 0-89.8 wt. % other (2-32C alkyl) acrylate, (a13) 0.2-6 wt % diene with at least two conjugated double bond, (a14) 0-10 wt. % polyfunctional crosslinking monomer with no conjugated double bonds and (a15) 0-40 wt % other comonomers, and (a2) 10-70 wt. % of a grafted shell made up of (a21) 50-95 wt. % vinylaromatic monomer, (a22) 5-50 wt % (meth)acrylonitrile, (1-8C alkyl) (meth)acrylate, maleic anhydride, (meth)acrylamide and/or vinyl (1-8C alkyl) ether. Also claimed are thermoplastic moulding materials contg. 10-70 wt. % (A), 30-90 wt. % thermoplastic polymer (B) with a Tg of more than 20 degrees C, 0-50 wt. % filler particles (C) and 0-30 wt. % additives and processing aids (D).

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