HEAT AGING-RESISTANT POLYAMIDES
    3.
    发明专利

    公开(公告)号:MY139749A

    公开(公告)日:2009-10-30

    申请号:MYPI20060314

    申请日:2006-01-24

    Applicant: BASF AG

    Abstract: THERMOPLASTIC MOLDING COMPOSITIONS COMPRISING A) FROM 10 TO 99 % BY WEIGHT OF AT LEAST ONE THERMOPLASTIC POLYAMIDE. B) FROM 0.1 TO 5 % BY WEIGHT OF AT LEAST ONE POLYETHYLENEIMINE HOMO- OR COPOLYMER, C) FROM 0.05 TO 3 % BY WEIGHT OF A LUBRICANT, D) FROM 0.05 TO 3 % BY WEIGHT OF A COPPER-CONTAINING SLABILIZER OR OF A STERICALLY HINDERED PHENOL OR MIXTURES THEREOF, E) FROM 0 TO 60 % BY WEIGHT OF FURTHER ADDITIVES, THE SUM OF THE PERCENTAGES BY WEIGHT OF COMPONENTS A) TO E) ADDING UP TO 100%.

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