Poly:amide based thermoplastic moulding composition

    公开(公告)号:DE19714900A1

    公开(公告)日:1998-10-15

    申请号:DE19714900

    申请日:1997-04-10

    Applicant: BASF AG

    Abstract: A thermoplastic moulding composition (I) contains (A) 10-98 wt.% polyamide (B) 1-20 wt.% red phosphorous (C) 0.1-15 wt.% delaminated layer silicate (phyllosilicate) (D) 0-70 wt.% additional additives and processing aids. An article (II) prepared from the composition (I) is also claimed. Preferably the composition (I) contains 5-40 wt.% fibrous reinforcement as component (D). The polyamide (A) contains at least 5 wt.% units resulting from lactam monomers. (A) comprises 5-95 wt.% (A1) polyamide 6 and 5-95 wt.% (A2) a different polyamide. (A) is polyamide 6, polyamide 12, polyamide 6/66, polyamide 6/6T, polyamide 6/6I, polyamide 66, polyamide 610 and /or polyamide 46. The layer silicate (C) is montmorillonite, smectite, illite, sepiolite, polygorskite, muscovite, allevardite, amesite, hectorite, talc, fluorhectorite, beidellite, nontronite, stevensite, bentonite, mica, vermiculite, fluorvermiculite, halloysite and/or fluorine containing synthetic talc. The moulded article (II) has a layer structure equivalent to 1--2-1-n-Z; 1 = the thermoplastic matrix; and 2 = the delaminated layer silicate, having preferably a 40 deg A gap between layers.

Patent Agency Ranking