METHOD FOR CONTACTING ELECTRICAL COMPONENTS
    1.
    发明申请
    METHOD FOR CONTACTING ELECTRICAL COMPONENTS 审中-公开
    连接电子元件的方法

    公开(公告)号:WO2008101884A2

    公开(公告)日:2008-08-28

    申请号:PCT/EP2008051909

    申请日:2008-02-18

    Abstract: The invention relates to a method for electrically contacting electrical components (122) on a carrier (110), said method comprising the following steps: (a) at least one dispersion (116) comprising electroconductive particles is applied in at least one region of the carrier (110); (b) at least one electrical component (122) is applied to the dispersion (116), and (c) the dispersion (116) is fully or partially metallised in a currentless and/or galvanised manner. The invention also relates to an electrical module (134) comprising at least one carrier (110) and at least one electrical component (122). The electrical component (122) is contacted on the carrier (110) using an inventive method. The invention further relates to a device for carrying out the inventive method, to a dispersion (116) for using in the inventive method, and to a use of said dispersion (116).

    Abstract translation: 提出了一种用于在支撑件(110)上电接触电部件(122)的方法,该方法包括以下步骤:(a)在支撑件(110)的至少一个区域中施加至少一个分散体(116),分散体 116)包含导电颗粒; (B)将至少一个电气元件(122)施加到分散体(116); 和(c)分散体(116)完全或部分无电镀和/或电镀金属。 此外,提出了包括至少一个载体(110)和至少一个电气部件(122)的电气部件(134)。 电气部件(122)在载体(110)上与根据本发明的方法接触。 此外,提出了用于实施根据本发明的方法的装置和用于根据本发明的方法的分散体(116)以及该分散体(116)的用途。

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