Abstract:
Aqueous composition for developing photoresists applied to semiconductor substrates, said aqueous composition comprising a quaternary ammonium compound of formula I wherein (a) R1 is selected from a C4 to C30 organic radical of formula -X-CR10 R11 R12, wherein R10, R11 and R12 are independently selected from a C1 to C20 alkyl and two or three of R10, R11 and R12 may together form a ring system, and R2, R3 and R4 are selected from R1 or a C1 to C10 alkyl, C1 to C10 hydroxyalkyl C1 to 1C30 aminoalkyl or C1 to C20A alkoxyalkyl, and X is a chemical bond or a C1 to C4 divalent organic radical, or (b) R and R2 areindependently selected from an organic radical of formula IIa or IIb (IIa) 20 or wherein Y is C4 to C20 alkanediyl, Y 2 is a one-, two-or tricyclic C to C20 carbocyclic or heterocyclic aromatic system, and R3 and R4 are selected from R or a C to C 10 alkyl, C to C 10 hydroxyalkyl, C to C 30 aminoalkyl, or C to C 20 alkoxyalkyl, and X is a chemical bond or a C to C 4 divalent organic radical, and Xis a chemical bond or a C to C 4 divalent organic radical, or30 (c)at least two of R, R 2, R 3, and R 4 together form a saturated mono, bi or tricyclic C to C 30 organic ring system and the remaining R 3 and R 4, if any, together form a monocyclic C to C 30 organic ring system or are selected from a C to C 10 alkyl, C to C 10 hydroxyalkyl, C to C 30 aminoalkyl, or C to C20 alkoxyalkyl, and Xis a chemical bond or a C1 to C4 divalent organic radical, or 3 (d)a combination thereof, and wherein Z is a counter-ion and z is an integer, which is chosen so that the overall bulky quaternary ammonium compound is electrically uncharged.
Abstract:
In a method of treating a substrate including patterns having line-space dimensions of 50 nm or below, the substrate is rinsed by an aqueous composition including at least one non-ionic surfactant A and at least one hydrophobizer B. The at least one surfactant A has an equilibrium surface tension of 10 mN/m to 35 mN/m, determined from a solution of the at least one surfactant A in water at the critical micelle concentration. The hydrophobizer B is selected so that the contact angle of water to the substrate is increased by contacting the substrate with a solution of the hydrophobizer B in water by 5-95° compared to the contact angle of water to the substrate before such contacting.
Abstract:
Aqueous composition for developing photoresists applied to semiconductor substrates, said aqueous composition comprising a quaternary ammonium compound of formula I Wherein a) R1 is selected from a C4 to C30 organic radical of formula -X-CR10R11R12, wherein R10, R11 and R12 are independently selected from a C1 to C20 alkyl and two or three of R10, R11 and R12 may together form a ring system, and R2, R3 and R4 are selected from R1 or a C1 to C10 alkyl, C1 to C10 hydroxyalkyl C1 to C30 aminoalkyl or C1 to C20 alkoxyalkyl, and X is a chemical bond or a C1 to C4 divalent organic radical, or b) R1 and R2 are independently selected from an organic radical of formula Ila or lib wherein Y1 is C4 to C20 alkanediyl, Y2 is a one-, two- or tricyclic C5 to C20 carbocyclic or heterocyclic aromatic system, and R3 and R4 are selected from R1 or a C1 to C10 alkyl, C1 to C10 hydroxyalkyl, C1 to C30 aminoalkyl, or C1 to C20 alkoxyalkyl, and X is a chemical bond or a C1 to C4 divalent organic radical, and X is a chemical bond or a C1 to C4 divalent organic radical, or c) at least two of R1, R2, R3, and R4 together form a saturated mono, bi or tricyclic C5 to C30 organic ring system and the remaining R3 and R4, if any, together form a monocyclic C5 to C30 organic ring system or are selected from a C1 to C10 alkyl, C1 to C10 hydroxyalkyl, C1 to C30 aminoalkyl, or C1 to C20 alkoxyalkyl, and X is a chemical bond or a C1 to C4 divalent organic radical, or d) a combination thereof, and wherein Z is a counter-ion and z is an integer, which is chosen so that the overall bulky quaternary ammonium compound is electrically uncharged.
Abstract:
A method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices, the said method comprising the steps of (1) providing a substrate having patterned material layers having line-space dimensions of 50 nm and less and aspect ratios of >2; (2) providing the surface of the patterned material layers with a positive or a negative electrical charge by contacting the substrate at least once with an aqueous, fluorine-free solution S containing at least one fluorine-free cationic surfactant A having at least one cationic or potentially cationic group, at least one fluorine-free anionic surfactant A having at least one anionic or potentially anionic group, or at least one fluorine-free amphoteric surfactant A; and (3) removing the aqueous, fluorine-free solution S from the contact with the substrate.
Abstract:
The use of a Gemini additive in compositions for treating semiconductor substrates is provided. The compositions are useful in processes for manufacturing integrated circuits devices, optical devices, micromachines and mechanical precision devices, in particular for developing photoresists and post etch residue removal to avoid pattern collapse.
Abstract:
The use of a gemini additive of the general formula I in compositions for treating semiconductor substrates: in particular for developing photoresists and post etch residue removal to avoid pattern collapse.
Abstract:
Provided is use of an aqueous composition comprising a surfactant and a hydrophobizer for avoiding anti pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below. Said composition comprising at least one non-ionic surfactant A and at least one hydrophobizer B, wherein the at least one surfactant A has an equilibrium surface tension of 10 mN/m to 35 mN/m, determined from a solution of the at least one surfactant A in water at the critical micelle concentration, and the hydrophobizer B is selected so that the contact angle of water to the substrate is increased by contacting the substrate with a solution of the hydrophobizer B in water by 5 -95? compared to the contact angle of water to the substrate before such contacting.
Abstract:
METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICES, OPTICAL DEVICES, MICROMACHINES AND MECHANICAL PRECISION DEVICES, THE SAID METHOD COMPRISING THE STEPS OF (1) PROVIDING A SUBSTRATE HAVING PATTERNED MATERIAL LAYERS HAVING LINE-SPACE DIMENSIONS OF 50 NM AND LESS AND ASPECT RATIOS OF >2; (2) PROVIDING THE SURFACE OF THE PATTERNED MATERIAL LAYERS WITH A POSITIVE OR A NEGATIVE ELECTRICAL CHARGE BY CONTACTING THE SUBSTRATE AT LEAST ONCE WITH AN AQUEOUS, FLUORINE-FREE SOLUTION S CONTAINING AT LEAST ONE FLUORINE-FREE CATIONIC SURFACTANT A HAVING AT LEAST ONE CATIONIC OR POTENTIALLY CATIONIC GROUP, AT LEAST ONE FLUORINE-FREE ANIONIC SURFACTANT A HAVING AT LEAST ONE ANIONIC OR POTENTIALLY ANIONIC GROUP, OR AT LEAST ONE FLUORINE-FREE AMPHOTERIC SURFACTANT A; AND (3) REMOVING THE AQUEOUS, FLUORINE-FREE SOLUTION S FROM THE CONTACT WITH THE SUBSTRATE. (FIG.1)
Abstract:
A composition comprising a quaternary ammonium compound for developing photoresists applied to semiconductor substrates is provided. A method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices is also provided. The pattern collapse can be avoided by prevent swelling of the photoresist by using the improved composition.