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    MICROELECTROMECHANICAL DEVICES AND FABRICATION METHODS
    2.
    发明申请
    MICROELECTROMECHANICAL DEVICES AND FABRICATION METHODS 审中-公开
    微电子设备和制造方法

    公开(公告)号：WO2007021396A8

    公开(公告)日：2007-09-07

    申请号：PCT/US2006026531

    申请日：2006-07-07

    Applicant: BOSCH GMBH ROBERT ,  YAMA GARY

    Inventor： YAMA GARY

    IPC: B81C99/00

    CPC classification number: B81C1/00333

    Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes a buried polysilicon layer and a "protective layer" deposited over the buried polysilicon layer to prevent possible erosion of, or damage to the buried polysilicon layer during processing steps. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.

    Abstract translation: 这里描述和说明了许多发明。 在一个方面，本发明涉及MEMS器件，以及制造或制造MEMS器件的技术，其具有在最终封装之前封装在腔室中的机械结构。 实施例还包括掩埋多晶硅层和沉积在掩埋多晶硅层上的“保护层”，以防止在处理步骤期间可能的侵蚀或损坏埋多晶硅层。 当沉积时，封装机械结构的材料包括以下属性中的一个或多个：低拉伸应力，良好的阶梯覆盖，在经受后续加工时保持其完整性，不会显着和/或不利地影响 室中的机械结构（如果在沉积期间涂覆材料）和/或促进与高性能集成电路的集成。 在一个实施例中，封装机械结构的材料是例如硅（多晶，无定形或多孔，无论掺杂或未掺杂），碳化硅，硅 - 锗，锗或砷化镓。

    MICROELECTROMECHANICAL DEVICES AND FABRICATION METHODS
    4.
    发明申请
    MICROELECTROMECHANICAL DEVICES AND FABRICATION METHODS 审中-公开
    微电子设备和制造方法

    公开(公告)号：WO2008067097A3

    公开(公告)日：2008-11-27

    申请号：PCT/US2007082882

    申请日：2007-10-29

    Applicant: BOSCH GMBH ROBERT ,  METZ MATTHIAS ,  PAN ZHIYU ,  STARK BRIAN ,  ULM MARKUS ,  YAMA GARY

    Inventor： METZ MATTHIAS ,  PAN ZHIYU ,  STARK BRIAN ,  ULM MARKUS ,  YAMA GARY

    IPC: B81C1/00

    CPC classification number: B81C1/00301 ,  B81B2207/015 ,  B81B2207/097 ,  B81C2203/0136 ,  B81C2203/0145 ,  H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event.

    Abstract translation: 这里描述和说明了许多发明。 在一个方面，本发明涉及MEMS器件，以及制造或制造MEMS器件的技术，其具有在最终封装之前封装在腔室中的机械结构。 实施例还包括作为半导体感测结构的一部分的压电材料的位置。 结合压电材料的半导体感测结构可以用作感测装置以提供与感测到的事件相关联的输出信号。

    IN-PLANE MECHANICALLY COUPLED MICROELECTROMECHANICAL TUNING FORK RESONATORS
    5.
    发明申请
    IN-PLANE MECHANICALLY COUPLED MICROELECTROMECHANICAL TUNING FORK RESONATORS 审中-公开
    平面机械耦合微电子机械调谐器谐振器

    公开(公告)号：WO2007046869A3

    公开(公告)日：2007-12-21

    申请号：PCT/US2006019531

    申请日：2006-05-19

    Applicant: BOSCH GMBH ROBERT ,  UNIV LELAND STANFORD JUNIOR ,  PAN ZHIYU ,  CHANDLER ROB NORRIS ,  LUTZ MARKUS ,  PARTRIDGE AARON ,  MATERNA VOLKER ,  YAMA GARY ,  FREY WILHELM

    Inventor： PAN ZHIYU ,  CHANDLER ROB NORRIS ,  LUTZ MARKUS ,  PARTRIDGE AARON ,  MATERNA VOLKER ,  YAMA GARY ,  FREY WILHELM

    IPC: H03H9/50 ,  H03H9/02

    CPC classification number: H03H9/505 ,  H03H9/0023 ,  H03H9/02338 ,  H03H9/2468 ,  H03H2009/02496

    Abstract: In one aspect, the present invention is directed to a resonator architecture including a plurality of in-plane vibration microelectromechanical resonators (for example, 2 or 4 resonators) that are mechanically coupled to provide, for example, a differential signal output. In one embodiment, the present invention includes four commonly shaped microelectromechanical tuning fork resonators (12, 14, 16, 18) (for example, tuning fork resonators having two or more rectangular-shaped or square-shaped tines). Each resonator is mechanically coupled to another resonator of the architecture. For example, each resonator of the architecture is mechanically coupled to another one of the resonators on one side or a corner of one of the sides. In this way, all of the resonators, when induced, vibrate at the same frequency.

    Abstract translation: 在一个方面，本发明涉及一种包括机械耦合以提供例如差分信号输出的多个平面内振动微机电谐振器（例如，2或4个谐振器）的谐振器结构。 在一个实施例中，本发明包括四个通常形状的微机电音叉谐振器（12,14,16,18）（例如，具有两个或更多个矩形或正方形形状的叉的音叉谐振器）。 每个谐振器机械耦合到该架构的另一谐振器。 例如，该架构的每个谐振器在其中一个侧面的一侧或拐角上机械耦合到另一个谐振器。 以这种方式，所有谐振器在被感应时以相同的频率振动。

    SUBSTRATE WITH MULTIPLE ENCAPSULATED PRESSURES
    7.
    发明申请
    SUBSTRATE WITH MULTIPLE ENCAPSULATED PRESSURES 审中-公开
    带有多个封装压力的基板

    公开(公告)号：WO2010107619A3

    公开(公告)日：2011-04-21

    申请号：PCT/US2010026685

    申请日：2010-03-09

    Applicant: BOSCH GMBH ROBERT ,  CANDLER ROBERT N ,  YAMA GARY

    Inventor： CANDLER ROBERT N ,  YAMA GARY

    IPC: B81B7/02 ,  B81C1/00

    CPC classification number: H01L23/3171 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00293 ,  B81C2203/0136 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method of forming a device with multiple encapsulated pressures is disclosed herein. In accordance with one embodiment of the present invention, there is provided a method of forming a device with multiple encapsulated pressures, including providing a substrate, forming a functional layer on top of a surface of the substrate, the functional layer including a first device portion at a first location, and a second device portion at a second location adjacent to the first location, encapsulating the functional layer, forming at least one diffusion resistant layer above the encapsulated functional layer at a location above the first location and not above the second location, modifying an environment adjacent the at least one diffusion resistant layer, and diffusing a gas into the second location as a result of the modified environment.

    Abstract translation: 本文公开了形成具有多个封装压力的装置的方法。 根据本发明的一个实施例，提供了一种形成具有多个封装压力的器件的方法，包括提供衬底，在衬底的表面的顶部上形成功能层，所述功能层包括第一器件部分 在第一位置处的第二设备部分和与第一位置相邻的第二位置处的第二设备部分，封装功能层，在第一位置上方并且不在第二位置之上的位置处在封装的功能层上方形成至少一个扩散阻挡层 改变邻近所述至少一个扩散阻挡层的环境，以及由于所述改进的环境而将气体扩散到所述第二位置。

    ANTI-STICTION TECHNIQUE FOR ELECTROMECHANICAL SYSTEMS AND ELECTROMECHANICAL DEVICE EMPLOYING SAME
    8.
    发明申请
    ANTI-STICTION TECHNIQUE FOR ELECTROMECHANICAL SYSTEMS AND ELECTROMECHANICAL DEVICE EMPLOYING SAME 审中-公开
    机电系统的防伪技术及其使用的电子设备

    公开(公告)号：WO2006115592A8

    公开(公告)日：2007-11-01

    申请号：PCT/US2006008600

    申请日：2006-03-10

    Applicant: BOSCH GMBH ROBERT ,  ULM MARKUS ,  METZ MATTHIAS ,  STARK BRIAN ,  YAMA GARY ,  LUTZ MARKUS ,  PARTRIDGE AARON ,  FREY WILHELM

    Inventor： ULM MARKUS ,  METZ MATTHIAS ,  STARK BRIAN ,  YAMA GARY ,  LUTZ MARKUS ,  PARTRIDGE AARON ,  FREY WILHELM

    IPC: B81C1/00

    CPC classification number: B81C1/0096 ,  B81B3/0005 ,  B81C2201/112 ,  B82Y30/00 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

    Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.

    Abstract translation: 机械结构设置在室中，其至少一部分由封装结构限定。 第一种方法提供了一种通道盖，其具有至少部分地设置在防静电通道上方或至少一部分中的至少一个预制件部分，以密封抗静电通道。 第二种方法提供了通道盖，其具有至少部分地设置在防静电通道上方或至少一部分中的至少一部分，以密封抗静脉通道。 该至少一个部分与机电装置分开制造，然后固定在机电装置上。 第三种方法提供了通道盖，其具有至少部分地设置在抗静电通道上方或至少一部分中的至少一个部分，以密封抗静脉通道。 所述至少一个部分可以包括线球，螺柱，金属箔或焊料预制件。 一种器件包括衬底，封装结构和机械结构。 抗静电层设置在机械结构的至少一部分上。 在基板和封装结构中的至少一个中形成抗静电通道。 至少部分地，盖具有至少一个预制件部分设置在防静电通道的上方或其至少一部分中，以密封抗静电通道。

    ANISOTROPIC CONDUCTOR AND METHOD OF FABRICATION THEREOF
    9.
    发明申请
    ANISOTROPIC CONDUCTOR AND METHOD OF FABRICATION THEREOF 审中-公开
    各向异性导体及其制造方法

    公开(公告)号：WO2014189600A3

    公开(公告)日：2015-01-29

    申请号：PCT/US2014022175

    申请日：2014-03-08

    Applicant: BOSCH GMBH ROBERT ,  FEYH ANDO ,  PURKL FABIAN ,  SAMARAO ASHWIN ,  YAMA GARY ,  O'BRIEN GARY

    Inventor： FEYH ANDO ,  PURKL FABIAN ,  SAMARAO ASHWIN ,  YAMA GARY ,  O'BRIEN GARY

    IPC: C23C28/00 ,  C23C16/455

    CPC classification number: B81C1/00095 ,  B81B7/0006 ,  B82Y10/00 ,  B82Y30/00 ,  H01L21/02601 ,  H01L21/3142 ,  H01L45/146

    Abstract: An anisotropic conductor and a method of fabrication thereof. The anisotropic conductor includes an insulating matrix and a plurality of nanoparticles disposed therein. A first portion of the plurality of nanoparticles provides a conductor when subjected to a voltage and/or current pulse. A second portion of the plurality of the nanoparticles does not form a conductor when the voltage and or current pulse is applied to the first portion. The anisotropic conductor forms a conductive path between conductors of electronic devices, components, and systems, including microelectromechanical systems (MEMS) devices, components, and systems.

    Abstract translation: 各向异性导体及其制造方法。 各向异性导体包括绝缘基体和设置在其中的多个纳米颗粒。 多个纳米颗粒的第一部分在经受电压和/或电流脉冲时提供导体。 当电压和/或电流脉冲施加到第一部分时，多个纳米颗粒的第二部分不形成导体。 各向异性导体在电子器件，部件和系统的导体之间形成导电路径，包括微机电系统（MEMS）器件，部件和系统。

    SUSPENSION AND ABSORBER STRUCTURE FOR BOLOMETER
    10.
    发明申请
    SUSPENSION AND ABSORBER STRUCTURE FOR BOLOMETER 审中-公开
    BOLOMETER的悬挂和吸收结构

    公开(公告)号：WO2014143299A3

    公开(公告)日：2014-11-06

    申请号：PCT/US2013076216

    申请日：2013-12-18

    Applicant: BOSCH GMBH ROBERT ,  PURKL FABIAN ,  YAMA GARY ,  FEYH ANDO

    Inventor： PURKL FABIAN ,  YAMA GARY ,  FEYH ANDO

    IPC: G01J5/20 ,  G01J5/08

    CPC classification number: H01L31/101 ,  G01J5/0853 ,  G01J5/20 ,  H01L31/02327

    Abstract: A semiconductor device includes a substrate having an upper surface that defines a sensing region. A fixed beam structure is supported at a first level above the sensing region. The fixed beam structure includes fixed beam supports that extend upwardly from the upper surface of the substrate to position the fixed beam structure at the first level above the sensing region. An absorber structure is supported above the fixed beam structure at a second level above the sensing region. The absorber structure includes a pillar support that extends upwardly from the fixed beam structure to position the absorber structure at the second level above the sensing region.

    Abstract translation: 半导体器件包括具有限定感测区域的上表面的衬底。 在感测区域上方的第一级处支撑固定光束结构。 固定梁结构包括从基板的上表面向上延伸的固定梁支撑件，以将固定梁结构定位在感测区域上方的第一水平处。 吸收体结构在感测区域上方的第二级支撑在固定光束结构上方。 吸收器结构包括从固定梁结构向上延伸的支柱支撑件，以将吸收体结构定位在感测区域上方的第二水平处。

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