公开(公告)号：SG11202107879PA

公开(公告)日：2021-08-30

申请号：SG11202107879P

申请日：2020-01-20

Applicant: BREWER SCIENCE INC

Inventor： PRENGER LUKE ,  SOUTHARD ARTHUR O ,  WU QI ,  LIU XIAO

IPC: C09J7/40 ,  B32B7/06 ,  C03C17/00 ,  C08G12/08 ,  C08J7/04 ,  C08L61/20

Abstract: Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

公开(公告)号：SG11201700478YA

公开(公告)日：2017-02-27

申请号：SG11201700478Y

申请日：2015-07-22

Applicant: BREWER SCIENCE INC

Inventor： LIU XIAO ,  BAI DONGSHUN ,  FLAIM TONY D ,  ZHONG XING-FU ,  WU QI

IPC: H01L21/58

Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.

公开(公告)号：SG11202005465SA

公开(公告)日：2020-07-29

申请号：SG11202005465S

申请日：2018-12-21

Applicant: BREWER SCIENCE INC

Inventor： LIU XIAO ,  WU QI ,  PULIGADDA RAMA ,  BAI DONGSHUN ,  HUANG BARON

IPC: B32B7/06 ,  B32B27/20 ,  B32B27/28 ,  C09J5/04 ,  C09J11/06 ,  C09J171/08 ,  H01L21/18 ,  H01L21/268 ,  H01L23/00

Abstract: Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.

公开(公告)号：WO2016014648A3

公开(公告)日：2016-05-19

申请号：PCT/US2015041505

申请日：2015-07-22

Applicant: BREWER SCIENCE INC

Inventor： LIU XIAO ,  BAI DONGSHUN ,  FLAIM TONY D ,  ZHONG XING-FU ,  WU QI

IPC: H01L21/58

CPC classification number: B32B7/06 ,  B05D3/007 ,  B32B27/06 ,  B32B37/14 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2405/00 ,  B32B2457/00 ,  C08G73/1014 ,  C08G73/1039 ,  C08G73/1067 ,  C09D179/08 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1158 ,  Y10T156/1917

Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250°C to about 350°C for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.

Abstract translation: 本发明广泛地涉及在微电子制造过程中能够进行薄晶片处理的剥离层组合物。 优选的释放层由包含溶解或分散在溶剂体系中的聚酰胺酸或聚酰亚胺的组合物形成，随后在约250℃至约350℃下固化和/或除去溶剂小于约10分钟，产生薄膜 。 该过程将释放组合物形成聚酰亚胺释放层，其可以用于临时粘合过程，并且在期望的处理已经进行之后激光剥离。

公开(公告)号：EP3172762A4

公开(公告)日：2018-02-28

申请号：EP15824894

申请日：2015-07-22

Applicant: BREWER SCIENCE INC

Inventor： LIU XIAO ,  BAI DONGSHUN ,  FLAIM TONY D ,  ZHONG XING-FU ,  WU QI

IPC: H01L21/683 ,  C08G73/10 ,  C09D179/08 ,  H01L21/58

CPC classification number: B32B7/06 ,  B05D3/007 ,  B32B27/06 ,  B32B37/14 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2405/00 ,  B32B2457/00 ,  C08G73/1014 ,  C08G73/1039 ,  C08G73/1067 ,  C09D179/08 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1158 ,  Y10T156/1917

Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.