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    FLUORESCENCE DETECTION SYSTEM
    1.
    发明申请
    FLUORESCENCE DETECTION SYSTEM 审中-公开

    公开(公告)号：WO2023069651A1

    公开(公告)日：2023-04-27

    申请号：PCT/US2022/047322

    申请日：2022-10-20

    Applicant: BIO-RAD LABORATORIES, INC.

    Inventor： THRUSH, Evan ,  SWIHART, Stephen L. ,  HEFNER, Eli A. ,  GRIFFIN, Michael ,  LU, Li

    IPC: G01N21/64 ,  C12Q1/686 ,  G01N21/25 ,  G02B21/06

    Abstract: A fluorescence detection system, including apparatus and methods, suitable for qPCR and other fluorescence-based analyses. The system may comprise various components, including a stage, an illumination module, a detection module, and an optical relay structure. The stage may be configured to support a sample holder. The illumination module may include one or more discrete light sources configured to produce excitation light. The detection module may be configured to detect fluorescence emission light produced, in response to the excitation light, by a fluorescent sample positioned in the sample holder. The optical relay structure may include a beamsplitter assembly configured to direct the excitation light from the illumination module along an illumination path to the sample holder and to direct the fluorescence emission light from the sample holder along a response path to the imaging module. The system may enhance the quality of excitation light hitting samples in the sample holder, for example, by collimating and/or homogenizing the light.

    ELECTRONIC COMPONENT ASSEMBLY WITH THERMALLY CONDUCTIVE STRUCTURES FOR IMAGE SENSORS
    2.
    发明申请
    ELECTRONIC COMPONENT ASSEMBLY WITH THERMALLY CONDUCTIVE STRUCTURES FOR IMAGE SENSORS 审中-公开

    公开(公告)号：WO2021113240A1

    公开(公告)日：2021-06-10

    申请号：PCT/US2020/062706

    申请日：2020-12-01

    Applicant: BIO-RAD LABORATORIES, INC.

    Inventor： SWIHART, Stephen ,  LU, Li ,  JAMESON, Wade ,  THRUSH, Evan ,  GRIFFIN, Michael ,  PEREZ, Evelio

    IPC: H01L27/146

    Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.

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