公开(公告)号：JPS6134963A

公开(公告)日：1986-02-19

申请号：JP10575185

申请日：1985-05-17

Applicant: British Telecommun

Inventor： GURAHAMU KEISU HOWAITOHETSUDO ,  KENESU TEIRAA

IPC: H01L23/12 ,  H01L23/057 ,  H01L23/13 ,  H01L23/14 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H05K1/02 ,  H05K3/00 ,  H05K3/24 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42

CPC classification number: H05K3/3442 ,  H01L23/057 ,  H01L23/13 ,  H01L23/145 ,  H01L23/3677 ,  H01L23/49805 ,  H01L23/538 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0271 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/244 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09181 ,  H05K2201/09709 ,  H05K2201/10727 ,  H05K2201/10909 ,  H05K2203/0723 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: A chip carrier includes a body (1) having a central region and sidewalls (31) connected to the central region by an elastically deformable region (33), in order to reduce thermal strains. Also for the same reason a heat sink (41) may be attached underneath the carrier below the carrier's die attachment site (8) and thermally conductive material (40,42) may connect them together. The heat sink may be used for mechanical anchorage. The chip carrier may be produced by injection moulding from an aromatic thermoplastic polymer. A carrier may be moulded with more than one die attachment site or a circuit board with die attachment sites could be moulded, preferably with the die attachment site recessed so that the surface of the die 9 is co-planar with conductive tracks on the board.

Abstract translation: 芯片载体包括具有中心区域的主体（1）和通过可弹性变形区域（33）连接到中心区域的侧壁（31），以便减少热应变。 同样由于相同的原因，散热器（41）可以在载体下方的载体的芯片附接位置（8）下方附接，并且导热材料（40,42）可将它们连接在一起。 散热器可用于机械固定。 芯片载体可以通过从芳族热塑性聚合物注射成型制备。 可以使用多于一个管芯附接部位模制载体，或者可以模制具有管芯附接位置的电路​​板，优选地，将模具附接部位凹进，使得管芯9的表面与板上的导电轨道共面。