公开(公告)号：WO0051154A8

公开(公告)日：2000-11-23

申请号：PCT/US0001940

申请日：2000-01-26

Applicant: CANDESCENT TECH CORP

Inventor： CHAKRAVORTY KISHORE K ,  NADI FARIBORZ ,  SPINDT CHRISTOPHER J ,  HANSEN RONALD L ,  STANNERS COLIN D

IPC: H01J3/02 ,  H01J9/02 ,  H01J29/02 ,  H01J1/02

CPC classification number: H01J9/148 ,  H01J3/022 ,  H01J29/02

Abstract: A structure and method for forming a column electrode for a field emission display device wherein the column electrode (702) is disposed beneath the field emitters and the row electrode. In one embodiment, the present invention comprises depositing a resistor layer (706) over portions of a column electrode (702). Next, an inter-metal dielectric layer (708) is deposited over the column electrode. In the present embodiment, the inter-metal dielectric layer (708) is deposited over portions of the resistor layer (706) and over pad areas (704a, 704b) of the column electrode (702). After the deposition of the inter-metal dielectric layer (708), the column electrode (702) is subjected to an anodization process such that the exposed regions of the column electrode (702) are anodized. In so doing, the present invention provides a column electrode structure (702) which is resistant to column to row electrode shorts and which is protected from subsequent processing steps.

Abstract translation: 一种用于形成用于场致发射显示装置的列电极的结构和方法，其中列电极（702）设置在场发射极和行电极之下。 在一个实施例中，本发明包括在列电极（702）的部分上沉积电阻层（706）。 接下来，在列电极上沉积金属间介电层（708）。 在本实施例中，金属间介电层（708）沉积在列电极（702）的电阻层（706）和焊盘区域（704a，704b）的部分上。 在沉积金属间介电层（708）之后，对列电极（702）进行阳极氧化处理，使得列电极（702）的暴露区域被阳极氧化。 在这样做时，本发明提供了一种对柱对电极短路有抵抗能力的列电极结构（702），其不受后续处理步骤的保护。

公开(公告)号：WO9917323A3

公开(公告)日：1999-09-02

申请号：PCT/US9818509

申请日：1998-09-22

Applicant: CANDESCENT TECH CORP

Inventor： KNALL N JOHAN ,  PORTER JOHN D ,  STANNERS COLIN D ,  SPINDT CHRISTOPHER J ,  BASCOM VICTORIA A

IPC: H01J9/38 ,  H01J9/02

CPC classification number: H01J9/025

Abstract: Multiple procedures are presented for removing contaminant material (12) from electron-emissive elements (10) of an electron-emitting device (30). One procedure involves converting the contaminant material into gaseous products (14), typically by operating the electron-emissive elements, that move away from the electron-emissive elements. Another procedure entails converting the contaminant material into further material (16) and removing the further material. An additional procedure involves forming surface coatings (18 or 20) over the electron-emissive elements. The contaminant material is then removed directly from the surface coatings or by removing at least part of each surface coating.

Abstract translation: 提出了用于从电子发射器件（30）的电子发射元件（10）去除污染物质（12）的多个步骤。 一种方法包括通常通过操作远离电子发射元件的电子发射元件将污染物质转化为气体产物（14）。 另一个过程需要将污染物质转化成另外的材料（16）并除去其它材料。 另外的过程涉及在电子发射元件上形成表面涂层（18或20）。 然后直接从表面涂层去除污染物质，或者通过去除每个表面涂层的至少一部分。

公开(公告)号：BR9904445A

公开(公告)日：2001-06-05

申请号：BR9904445

申请日：1999-10-05

Applicant: CANDESCENT TECH CORP ,  ADVANCED TECH MATERIALS

Inventor： XU XUEPING ,  BRANDES GEORGE R ,  SPINDT CHRISTOPHER J ,  STANNERS COLIN D ,  MACAULAY JOHN M

IPC: H01J1/30

公开(公告)号：EP0968509A4

公开(公告)日：2000-02-02

申请号：EP98911427

申请日：1998-03-23

Applicant: CANDESCENT TECH CORP ,  ADVANCED TECH MATERIALS

Inventor： XU XUEPING ,  BRANDES GEORGE R ,  SPINDT CHRISTOPHER J ,  STANNERS COLIN D ,  MACAULAY JOHN M

IPC: H01J9/02 ,  H01J1/304 ,  H01J29/04 ,  H01J31/12 ,  H01J1/30 ,  H01J19/24

CPC classification number: H01J1/3042 ,  H01J2201/30426 ,  H01J2201/319 ,  H01J2329/00

Abstract: A cathode structure (200, 203, 204) suitable for a flat panel display is provided with coated emitters (229, 239, 230). The emitters are formed with material, typically nickel, capable of growing to a high aspect ration. These emitters are then coated with carbon containing material (240, 241) for improving the chemical robustness and reducing the work function. One coating process is a DC plasma deposition process in which acetylene is pumped through a DC plasma reactor (301, 305, 313, and 315) to create a DC plasma for coating the cathode structure. An alternative coating process is to electrically deposit raw carbon-based material onto the surface of the emitters, and subsequently reduce the raw carbon-based material to the carbon containing material. Work function of coated emitters is typically reduced by about 0.8 to 1.0 eV.

公开(公告)号：HK1031154A1

公开(公告)日：2001-06-01

申请号：HK01100498

申请日：2001-01-19

Applicant: CANDESCENT TECH CORP

Inventor： KNALL N JOHAN ,  PORTER JOHN D ,  STANNERS COLIN D ,  SPINDT CHRISTOPHER J ,  BASCOM VICTORIA A

IPC: H01J9/02 ,  H01J9/38 ,  H01J

Abstract: Multiple procedures are presented for removing contaminant material (12) from electron-emissive elements (10) of an electron-emitting device (30). One procedure involves converting the contaminant material into gaseous products (14), typically by operating the electron-emissive elements, that move away from the electron-emissive elements. Another procedure entails converting the contaminant material into further material (16) and removing the further material. An additional procedure involves forming surface coatings (18 or 20) over the electron-emissive elements. The contaminant material is then removed directly from the surface coatings or by removing at least part of each surface coating.

公开(公告)号：EP1099233A4

公开(公告)日：2005-07-20

申请号：EP99925586

申请日：1999-05-11

Applicant: CANDESCENT TECH CORP

Inventor： PAN LAWRENCE S ,  STANNERS COLIN D ,  FAHLEN THEODORE S

IPC: H01J9/14 ,  H01J9/227 ,  H01J9/24 ,  H01J9/38 ,  H01J31/12

CPC classification number: H01J9/38

Abstract: A flat panel display that has internal components (102) that are cleaned using a dry cleaning treatment.

公开(公告)号：EP1021818A4

公开(公告)日：2001-04-04

申请号：EP98950613

申请日：1998-09-22

Applicant: CANDESCENT TECH CORP

Inventor： KNALL N JOHAN ,  PORTER JOHN D ,  STANNERS COLIN D ,  SPINDT CHRISTOPHER J ,  BASCOM VICTORIA A

IPC: H01J9/38 ,  H01J9/02 ,  H01J7/00

CPC classification number: H01J9/025

Abstract: Multiple procedures are presented for removing contaminant material (12) from electron-emissive elements (10) of an electron-emitting device (30). One procedure involves converting the contaminant material into gaseous products (14), typically by operating the electron-emissive elements, that move away from the electron-emissive elements. Another procedure entails converting the contaminant material into further material (16) and removing the further material. An additional procedure involves forming surface coatings (18 or 20) over the electron-emissive elements. The contaminant material is then removed directly from the surface coatings or by removing at least part of each surface coating.