公开(公告)号：EP1325386A4

公开(公告)日：2006-04-26

申请号：EP01973468

申请日：2001-09-26

Applicant: CORNING INC

Inventor： ACKERMAN BRADFORD G ,  BOWDEN BRADLEY F ,  DAVIS CLAUDE L JR ,  HRDINA KENNETH E

IPC: G03F7/20 ,  H01L21/027 ,  H01L21/68 ,  G03B27/58 ,  G03B27/42

CPC classification number: G03F7/70716 ,  G03F7/70216 ,  G03F7/708

Abstract: A lithographic stage includes a platen (31) having a top face and a bottom face and a holder (32) for holding an optical component on the top face of the platen. The platen is made of a light-weight material such as high purity fused silica or ultra low expansion glass. The bottom face of the platen may further include means for connecting to a positioning device in an extreme ultraviolet lithography system.

公开(公告)号：EP1214718A4

公开(公告)日：2006-08-23

申请号：EP00948609

申请日：2000-07-10

Applicant: CORNING INC

Inventor： DAVIS CLAUDE L JR ,  HRDINA KENNETH E

IPC: G03F7/20 ,  C03B8/04 ,  C03B20/00 ,  C03C17/36 ,  C23C14/02 ,  C23C28/00 ,  G02B5/08 ,  G02B5/10 ,  G02B5/26 ,  G02B5/28 ,  G02B17/06 ,  G03F1/00 ,  G03F1/24 ,  G03F1/60 ,  G21K1/06 ,  G21K5/00 ,  G21K5/02 ,  H01L21/027

CPC classification number: B82Y10/00 ,  B82Y40/00 ,  C03B19/1415 ,  C03B2201/07 ,  C03B2201/42 ,  G02B5/0891 ,  G02B17/0615 ,  G02B17/0636 ,  G03F1/24 ,  G03F1/60 ,  G03F7/702 ,  G03F7/70233 ,  G03F7/70283 ,  G03F7/70891 ,  G03F7/70958 ,  G21K1/062 ,  G21K2201/064 ,  G21K2201/067

Abstract: The projection lithographic method for producing integrated circuits and forming patterns with extremely small feature dimensions includes an illumination sub-system ( 36 ) for producing and directing an extreme ultraviolet soft x-ray radiation lambda from an extreme ultraviolet soft x-ray source ( 38 ); a mask stage ( 22 ) illuminated by the extreme ultraviolet soft x-ray radiation lambda produced by illumination stage and the mask stage ( 22 ) includes a pattern when illuminated by radiation lambda. A protection sub-system includes reflective multilayer coated Ti doped high purity SiO2 glass defect free surface ( 32 ) and printed media subject wafer which has a radiation sensitive surface.

公开(公告)号：EP1324857A4

公开(公告)日：2004-12-01

申请号：EP01979254

申请日：2001-09-18

Applicant: CORNING INC

Inventor： DAVIS CLAUDE L JR ,  BEST MICHAEL E ,  EDWARDS MARY J ,  HOBBS THOMAS W ,  MURRAY GREGORY L

IPC: C03B8/04 ,  B24B1/00 ,  B24B13/06 ,  C03B19/14 ,  C03B23/025 ,  B24B7/24 ,  G02B5/10

CPC classification number: B24B1/00 ,  B24B13/06 ,  C03B19/1453 ,  C03B19/1469 ,  C03B23/0252

Abstract: A method for manufacturing an EUV lithography element mirror includes sagging a plate of a glass material (41) to produce an EUV mirror blank (43) and polishing a top face of the EUV mirror blank (43) to produce a polished EUV mirror. A method for manufacturing an EUV lithography element mirror includes grinding a top face of a piece of a glass material (61); sagging a plate of the glass material over the top face of the piece (63) to produce an EUV mirror blank (66); and polishing a top face of the EUV mirror blank to produce an EUV polished mirror (65).