公开(公告)号：AU2011293715A1

公开(公告)日：2013-01-31

申请号：AU2011293715

申请日：2011-08-11

Applicant: CORNING INC

Inventor： BELLMAN ROBERT A ,  BORRELLI NICHOLAS F ,  DENEKA DAVID A ,  O'MALLEY SHAWN M ,  SCHNEIDER VITOR M

IPC: C25D11/32

Abstract: Methods of fabricating dimensional silica-based substrates or structures comprising a porous silicon layers are contemplated. According to one embodiment, oxygen is extracted from the atomic elemental composition of a silica glass substrate by reacting a metallic gas with the substrate in a heated inert atmosphere to form a metal-oxygen complex along a surface of the substrate. The metal-oxygen complex is removed from the surface of the silica glass substrate to yield a crystalline porous silicon surface portion and one or more additional layers are formed over the crystalline porous silicon surface portion of the silica glass substrate to yield a dimensional silica-based substrate or structure comprising the porous silicon layer. Embodiments are also contemplated where the substrate is glass-based, but is not necessarily a silica-based glass substrate. Additional embodiments are disclosed and claimed.

公开(公告)号：WO2012027121A3

公开(公告)日：2012-08-09

申请号：PCT/US2011047367

申请日：2011-08-11

Applicant: CORNING INC ,  BELLMAN ROBERT A ,  BORRELLI NICHOLAS F ,  DENEKA DAVID A ,  O'MALLEY SHAWN M ,  SCHNEIDER VITOR M

Inventor： BELLMAN ROBERT A ,  BORRELLI NICHOLAS F ,  DENEKA DAVID A ,  O'MALLEY SHAWN M ,  SCHNEIDER VITOR M

IPC: C25D11/32

CPC classification number: C03C23/0095 ,  C03C23/008 ,  H01L21/02002 ,  H01L21/02422 ,  H01L21/0245 ,  H01L21/02513 ,  H01L21/02532 ,  H01L21/02658 ,  H01L21/2257 ,  H01L21/3221 ,  H01L29/78603 ,  Y10T428/249969

Abstract: Methods of fabricating dimensional silica-based substrates or structures comprising a porous silicon layers are contemplated. According to one embodiment, oxygen is extracted from the atomic elemental composition of a silica glass substrate by reacting a metallic gas with the substrate in a heated inert atmosphere to form a metal-oxygen complex along a surface of the substrate. The metal-oxygen complex is removed from the surface of the silica glass substrate to yield a crystalline porous silicon surface portion and one or more additional layers are formed over the crystalline porous silicon surface portion of the silica glass substrate to yield a dimensional silica-based substrate or structure comprising the porous silicon layer. Embodiments are also contemplated where the substrate is glass-based, but is not necessarily a silica-based glass substrate. Additional embodiments are disclosed and claimed.

Abstract translation: 考虑制造尺寸二氧化硅基底或包括多孔硅层的结构的方法。 根据一个实施方案，通过在加热的惰性气氛中使金属气体与衬底反应，从石英玻璃衬底的原子元素组合物中提取氧，以沿着衬底的表面形成金属 - 氧络合物。 从石英玻璃基板的表面除去金属 - 氧络合物，得到结晶多孔硅表面部分，并且在石英玻璃基板的结晶多孔硅表面部分上形成一个或多个附加层，得到尺寸二氧化硅基 包括多孔硅层的衬底或结构。 也可以考虑实施方案，其中基材是基于玻璃的，但不一定是二氧化硅基玻璃基材。 公开并要求保护附加实施例。

公开(公告)号：EP2609234A4

公开(公告)日：2015-11-04

申请号：EP11820371

申请日：2011-08-11

Applicant: CORNING INC

Inventor： BELLMAN ROBERT A ,  BORRELLI NICHOLAS F ,  DENEKA DAVID A ,  O'MALLEY SHAWN M ,  SCHNEIDER VITOR M

IPC: C03C23/00 ,  H01L21/02 ,  H01L21/225 ,  H01L21/322 ,  H01L29/786

CPC classification number: C03C23/0095 ,  C03C23/008 ,  H01L21/02002 ,  H01L21/02422 ,  H01L21/0245 ,  H01L21/02513 ,  H01L21/02532 ,  H01L21/02658 ,  H01L21/2257 ,  H01L21/3221 ,  H01L29/78603 ,  Y10T428/249969