Dimensional silica-based porous silicon structures and methods of fabrication

    公开(公告)号:AU2011293715A1

    公开(公告)日:2013-01-31

    申请号:AU2011293715

    申请日:2011-08-11

    Applicant: CORNING INC

    Abstract: Methods of fabricating dimensional silica-based substrates or structures comprising a porous silicon layers are contemplated. According to one embodiment, oxygen is extracted from the atomic elemental composition of a silica glass substrate by reacting a metallic gas with the substrate in a heated inert atmosphere to form a metal-oxygen complex along a surface of the substrate. The metal-oxygen complex is removed from the surface of the silica glass substrate to yield a crystalline porous silicon surface portion and one or more additional layers are formed over the crystalline porous silicon surface portion of the silica glass substrate to yield a dimensional silica-based substrate or structure comprising the porous silicon layer. Embodiments are also contemplated where the substrate is glass-based, but is not necessarily a silica-based glass substrate. Additional embodiments are disclosed and claimed.

    PLANAR WAVEGUIDE AND OPTICAL FIBER COUPLING
    3.
    发明申请
    PLANAR WAVEGUIDE AND OPTICAL FIBER COUPLING 审中-公开
    平面波导和光纤耦合

    公开(公告)号:WO2011066122A3

    公开(公告)日:2011-08-04

    申请号:PCT/US2010056670

    申请日:2010-11-15

    Abstract: An apparatus for optically coupling light between optical transmission components is provided. The apparatus includes first and second optical transmission components wherein the first optical transmission component includes a planar optical waveguide (102), a grating coupler (106), and a transparent substrate (104) and the second optical transmission component includes an optical fiber (120). Preferably, the planar optical waveguide includes silicon and the transparent substrate includes glass. Methods for coupling light between optical transmission components are also provided.

    Abstract translation: 提供了一种用于在光传输部件之间光耦合光的装置。 该装置包括第一和第二光传输部件,其中第一光传输部件包括平面光波导(102),光栅耦合器(106)和透明基板(104),第二光传输部件包括光纤 )。 优选地,平面光波导包括硅,并且透明基板包括玻璃。 还提供了用于在光传输部件之间耦合光的方法。

    DIMENSIONAL SILICA-BASED POROUS SILICON STRUCTURES AND METHODS OF FABRICATION
    5.
    发明申请
    DIMENSIONAL SILICA-BASED POROUS SILICON STRUCTURES AND METHODS OF FABRICATION 审中-公开
    尺寸二氧化硅多孔硅结构和制造方法

    公开(公告)号:WO2012027121A3

    公开(公告)日:2012-08-09

    申请号:PCT/US2011047367

    申请日:2011-08-11

    Abstract: Methods of fabricating dimensional silica-based substrates or structures comprising a porous silicon layers are contemplated. According to one embodiment, oxygen is extracted from the atomic elemental composition of a silica glass substrate by reacting a metallic gas with the substrate in a heated inert atmosphere to form a metal-oxygen complex along a surface of the substrate. The metal-oxygen complex is removed from the surface of the silica glass substrate to yield a crystalline porous silicon surface portion and one or more additional layers are formed over the crystalline porous silicon surface portion of the silica glass substrate to yield a dimensional silica-based substrate or structure comprising the porous silicon layer. Embodiments are also contemplated where the substrate is glass-based, but is not necessarily a silica-based glass substrate. Additional embodiments are disclosed and claimed.

    Abstract translation: 考虑制造尺寸二氧化硅基底或包括多孔硅层的结构的方法。 根据一个实施方案,通过在加热的惰性气氛中使金属气体与衬底反应,从石英玻璃衬底的原子元素组合物中提取氧,以沿着衬底的表面形成金属 - 氧络合物。 从石英玻璃基板的表面除去金属 - 氧络合物,得到结晶多孔硅表面部分,并且在石英玻璃基板的结晶多孔硅表面部分上形成一个或多个附加层,得到尺寸二氧化硅基 包括多孔硅层的衬底或结构。 也可以考虑实施方案,其中基材是基于玻璃的,但不一定是二氧化硅基玻璃基材。 公开并要求保护附加实施例。

    METHODS AND APPARATUS FOR PACKAGING ELECTRONIC COMPONENTS
    6.
    发明申请
    METHODS AND APPARATUS FOR PACKAGING ELECTRONIC COMPONENTS 审中-公开
    包装电子元件的方法和装置

    公开(公告)号:WO2009073102A2

    公开(公告)日:2009-06-11

    申请号:PCT/US2008013062

    申请日:2008-11-24

    CPC classification number: H01L51/5246

    Abstract: Packages for elements, e.g., OLEDs, that are temperature sensitive are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12, 16) and hermetically seals at least one temperature sensitive element (18, 28, 36) between the substrates (12, 16). The wall (14) comprises a sintered frit and at least a portion of the wall is laser sealed to the second substrate (16) by melting a glass component of the sintered frit. The minimum width (40) of the laser-sealed portion of the wall (14) at any location along the wall (14) is greater than or equal to 2 millimeters so as to provide greater hermeticity and strength to the package. The laser sealing is performed without substantially degrading the temperature sensitive element(s) (18, 28, 36) housed in the package.

    Abstract translation: 提供了对温度敏感的元件(例如OLED)的包装。 封装具有第一玻璃基板(12),第二玻璃基板(16)和分隔第一和第二基板(12,16)并将至少一个温度敏感元件(18,28)气密密封的壁 ,36)在基板(12,16)之间。 所述壁(14)包括烧结的玻璃料,并且所述壁的至少一部分通过熔化所述烧结玻璃料的玻璃组分而激光密封到所述第二基板(16)。 在壁(14)的任何位置处的壁(14)的激光密封部分的最小宽度(40)大于或等于2毫米,以便为包装提供更大的气密性和强度。 执行激光密封,而基本上不会降低容纳在包装中的温度敏感元件(18,28,36)。

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