Abstract:
According to a first aspect of the present invention, a regenerated thermoplastic resin composition is offered by melt blending 0.1 to 30 parts by weight of an epoxidized (partially hydrogenated) diene-based polymer (B) to 100 parts by weight of resin pieces (A) obtained by crushing the molded products comprising a thermoplastic resin (A1) or a thermoplastic resin composition (A2). According to a second aspect of the present invention, a regenerated thermoplastic resin composition is offered comprising 20 to 67 weight % of a non-rigid polyethylene resin (a), 30 to 77 weight % of a waste material (b) of a structural product made by laminating at least two kinds of thermoplastic resins, and 3 to 20 weight % of epoxidized (partially hydrogenated) diene-based polymer.
Abstract:
A photosensitive hardenable composition comprising as major components a thermoplastic high molecular binder obtained from specific addition polymerizable monomers, an acrylate (or methacryliate) derivative or mixture thereof and a photopolymerization initiator, which possesses improved properties in softness, stripping properties, stripping time, etc of hardened layers formed.
Abstract:
A process for producing an epoxidized diene polymer which comprises: dispersing or suspending a diene polymer (C) having a particle diameter in terms of sphere diameter of 0.05 to 20 mm either in a medium (A) in the presence of powder particles (B) insoluble therein or in a water medium in the presence of a phenolic stabilizer and/or phosphorus compound stabilizer; and epoxidizing the diene polymer (C) in the dispersed or suspended state with an epoxidizing agent. Thus, an epoxidized diene polymer having excellent thermal stability is obtained. By the process, the epoxidation of the diene polymer (C) in a solid state and the production and purification of the target polymer are economically conducted. The process is free from various problems associated with the epoxidation of a diene polymer dissolved in a solvent.
Abstract:
A resin composition for coating suitable as, for example, a surface coating material capable of improving the coatability, etc., of olefin resin films, etc., which contains an epoxidized block copolymer (A) and an organic compound (B) carrying a functional group reacting with an epoxy group and having a number-average molecular weight of from 150 to 150,000, wherein the weight ratio (A)/(A + B) ranges from 1/100 to 99/100. Another resin composition for coating which contains an epoxidized block copolymer (A), an organic compound (B) carrying a functional group reacting with an epoxy group and having a number-average molecular weight of from 150 to 150,000, and an epoxy ring opening promoter (C), wherein the weight ratio (A)/(A + B) ranges from 1/100 to 99/100 and the content of the above component (C) ranges from 0.1 to 10 parts by weight per 100 parts by weight of (A + B).
Abstract:
The present invention is directed to an epoxidized block copolymer (E) obtained by epoxidizing a block copolymer (C) comprising a polymer block (A) composed mainly of a vinyl aromatic hydrocarbon compound and a polymer block (B) composed mainly of a conjugated diene compound or a product (D) of hydrogenation of the block copolymer (C). The epoxidized block copolymer (E) meets at least one of the following requisites: (1) having a molar ratio (R) of contained hydroxyl to epoxy ranging from 0.001 to 0.1, the molar ratio (R) being represented by the formula: R = ÄhydroxylÜ/ÄepoxyÜ (wherein ÄhydroxylÜ represents the amount, in terms of the number of moles, of hydroxyl contained per unit weight of the epoxidized block copolymer and ÄepoxyÜ represents the amount, in terms of the number of moles, of epoxy contained per unit weight of the epoxidized block copolymer); (2) having a gel content of not greater than 5% by weight; and (3) having a chloride ion content of not greater than 7 ppm. This epoxidized block copolymer can be obtained by epoxidizing the above block copolymer in an organic solvent and evaporating off the organic solvent, and compositions comprising the same together with other compounds and resins are useful.
Abstract:
A blended composition consisting of a thermoplastic olefin resin (Comp. A) with an acrylonitrile-styrene-alkyl acrylate copolymer (Comp. B) was attempted to create substitution for vinyl chloride compound prepared from vinyl chloride resin proper and a plasticizer, but resulted in inferior interdispersibility. Incorporation of a thermoplastic epoxy resin (Comp. C) has brought definite improvement in the interdispersibility. A resinous composition including the components A, B, and C has the utility of substitution for vinyl chloride compounds as well as its products.
Abstract:
The present invention is directed to an epoxidized block copolymer (E) obtained by epoxidizing a block copolymer (C) comprising a polymer block (A) composed mainly of a vinyl aromatic hydrocarbon compound and a polymer block (B) composed mainly of a conjugated diene compound or a product (D) of hydrogenation of the block copolymer (C). The epoxidized block copolymer (E) meets at least one of the following requisites: (1) having a molar ratio (R) of contained hydroxyl to epoxy ranging from 0.001 to 0.1, the molar ratio (R) being represented by the formula: R = ÄhydroxylÜ/ÄepoxyÜ (wherein ÄhydroxylÜ represents the amount, in terms of the number of moles, of hydroxyl contained per unit weight of the epoxidized block copolymer and ÄepoxyÜ represents the amount, in terms of the number of moles, of epoxy contained per unit weight of the epoxidized block copolymer); (2) having a gel content of not greater than 5% by weight; and (3) having a chloride ion content of not greater than 7 ppm. This epoxidized block copolymer can be obtained by epoxidizing the above block copolymer in an organic solvent and evaporating off the organic solvent, and compositions comprising the same together with other compounds and resins are useful.
Abstract:
A metal/synthetic resin laminate comprising a metal substrate layer, an epoxy resin-based adhesive layer (a "1st adhesive layer"), an adhesive layer (a "2nd adhesive layer") comprising an epoxidized styrenic thermoplastic elastomer D prepared through epoxidation of a double bond derived from a conjugated diene compound of a block copolymer C comprising a polymer block A composed mainly of a styrenic compound and a polymer block B composed mainly of a conjugated diene compound or a partial hydrogenation product thereof, and a synthetic resin layer; and a synthetic resin-clad metallic pipe wherein the above metal substrate layer is tubular.
Abstract:
SE DESCRIBE UNA MEZCLA COMPATIBLE QUE COMPRENDE (A) UNA RESINA CON AFINIDAD CON UN POLIMERO DE VINILO AROMATICO, (B) UNA RESINA QUE PUEDE REACCIONAR CON UN GRUPO EPOXI Y (C) UN AGENTE DE COMPATIBILIZACION QUE COMPRENDE UN COPOLIMERO EN BLOQUE DE DIENO CONJUGADO CON VINILO AROMATICO Y MODIFICADO POR EPOXIDACION EN EL CUAL SE INCLUYEN (I) UN BLOQUE POLIMERICO DE UN COMPUESTO DE VINILO AROMATICO E (II) UN BLOQUE POLIMERICO DE UN COMPUESTO QUE TIENE UN ENLACE DOBLE CONJUGADO, ESTANDO LOS RESTANTES DOBLES ENLACES PARCIAL O TOTALMENTE EPOXIDADOS. LA MEZCLA COMPATIBLE TIENE TIENE UNA DISPERSION DE TAMAÑO DE PEQUEÑAS PARTICULAS EN UNA ESTRUCTURA MICROSCOPICA QUE SE OBSERVAN CON EL MICROSCOPIO ELECTRONICO DE BARRIDO Y UNA EXCELENTE HOMOGENEIDAD EN APARIENCIA EXTERNA, POR LO QUE TIENEN PROPIEDADES MEJORADAS DE FLUJO JUNTO CON PROPIEDADES MECANICAS MEJORADAS TALES COMO RESISTENCIA AL IMPACTO, COMPARADAS CON UNA MEZCLA COMPATIBLE QUE TENGA UN AGENTE CONVENCIONAL DE COMPATIBILIZACION QUE ES UN COPOLIMERO EN BLOQUE DE DIENO CONJUGADO CON UN COMPUESTO AROMATICO O UN COPOLIMERO EN BLOQUE DE DIENO CONJUGADO CON VINILO AROMATICO QUE TIENE GRUPOS EPOXI EN LOS EXTREMOS. TAMBIEN LA PRESENTE INVENCION TRATA DE DIFERENTES COMPOSICIONES DE RESINA QUE COMPRENDEN DIFERENTES RESINAS Y UN MODIFICADOR O ESTABILIZADOR QUE ES UN COPOLIMERO EN BLOQUE DE DIENO CONJUGADO CON VINILO AROMATICO MODIFICADO POR EPOXIDACION.