公开(公告)号：DE69839629D1

公开(公告)日：2008-07-31

申请号：DE69839629

申请日：1998-10-07

Applicant: DIMENSIONAL CIRCUITS CORP

Inventor： GREGOIRE GEORGE D

IPC: H05K3/46 ,  H01R12/55 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/12 ,  H05K3/40

Abstract: A wiring board construction includes at least one microvia disposed in a base substrate and includes a deep imprinted cup shaped in the top surface thereof. A conductor material is disposed within the recess, and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion helps to complete an electrically conductor path through the substrate to help complete an electrically conductive path through the substrate.

公开(公告)号：EP1019986A4

公开(公告)日：2003-03-26

申请号：EP98952161

申请日：1998-10-07

Applicant: DIMENSIONAL CIRCUITS CORP

Inventor： GREGOIRE GEORGE D

IPC: H01R12/55 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/12 ,  H05K3/40 ,  H05K3/46 ,  H01R9/09

CPC classification number: H05K3/005 ,  H05K1/095 ,  H05K1/112 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/061 ,  H05K3/107 ,  H05K3/1241 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/465 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09863 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/025 ,  H05K2203/041 ,  H05K2203/0746 ,  H05K2203/095 ,  H05K2203/1189 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A wiring board construction (10) includes at least one microvia (12) disposed in a base substrate (14) and includes a deep imprinted cup shaped in the top surface thereof (24). A conductor material is disposed within the recess (26), and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion (31) helps to complete an electrically conductive path through the substrate.

Abstract translation: 布线板结构包括设置在基底基板中的至少一个微孔，并且包括形成在其顶表面中的深刻印刷杯。 导体材料设置在凹部内，并且具有设置在其底部的部分。 设置在与导体材料底部相对的基板的底表面处的导体有助于完成穿过基板的导电路径，以帮助完成穿过基板的导电路径。

公开(公告)号：AU9792698A

公开(公告)日：1999-04-27

申请号：AU9792698

申请日：1998-10-07

Applicant: DIMENSIONAL CIRCUITS CORP

Inventor： GREGOIRE GEORGE D

IPC: H01R12/55 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/12 ,  H05K3/40 ,  H05K3/46 ,  H01R9/09

Abstract: A wiring board construction includes at least one microvia disposed in a base substrate and includes a deep imprinted cup shaped in the top surface thereof. A conductor material is disposed within the recess, and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion helps to complete an electrically conductor path through the substrate to help complete an electrically conductive path through the substrate.