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    ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER
    1.
    发明申请
    ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER 审中-公开
    包含聚烯烃共聚物的电子器件模块

    公开(公告)号：WO2008036708A3

    公开(公告)日：2008-05-08

    申请号：PCT/US2007078846

    申请日：2007-09-19

    Applicant: DOW GLOBAL TECHNOLOGIES INC ,  PATEL RAJEN M ,  WU SHAOFU ,  BERNIUS MARK T ,  ESSEGHIR MOHAMED ,  MCGEE ROBERT L ,  MAZOR MICHAEL H ,  NAUMOVITZ JOHN

    Inventor： PATEL RAJEN M ,  WU SHAOFU ,  BERNIUS MARK T ,  ESSEGHIR MOHAMED ,  MCGEE ROBERT L ,  MAZOR MICHAEL H ,  NAUMOVITZ JOHN

    IPC: H01L31/048 ,  C08L23/02 ,  C08L51/06 ,  H01B3/44

    CPC classification number: H01L31/0481 ,  B32B17/10018 ,  B32B17/10678 ,  B32B2457/12 ,  C08L51/06 ,  H01L31/18 ,  Y02E10/50 ,  C08L2666/02 ,  C08L2666/04

    Abstract: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95C, (d) an a-olefin content of at least about 15 and less than about 50 wt% based on the weight of the polymer, (e) a Tg of less than about -35C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/a-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

    Abstract translation: 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合材料包含（1）聚烯烃共聚物， （a）小于约0.90g / cc的密度，（b）通过ASTM D-882-02测量的小于约150兆帕（mPa）的2％割线模量中的至少一个），（c） 熔点低于约95℃，（d）基于聚合物重量，α-烯烃含量为至少约15重量％且小于约50重量％，（e）Tg小于约-35℃，（ f）至少约50的SCBDI，（2）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（3）任选的助剂。 通常，聚烯烃共聚物是乙烯/α-烯烃共聚物。 任选地，聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂，并且共聚物可以保持未交联或交联。

    ELECTRONIC DEVICE MODULE COMPRISING LONG CHAIN BRANCHED (LCB), BLOCK, OR INTERCONNECTED COPOLYMERS OF ETHYLENE AND OPTIONALLY SILANE
    6.
    发明申请
    ELECTRONIC DEVICE MODULE COMPRISING LONG CHAIN BRANCHED (LCB), BLOCK, OR INTERCONNECTED COPOLYMERS OF ETHYLENE AND OPTIONALLY SILANE 审中-公开
    包含长链分支（LCB），乙烯和可选硅烷的嵌段或互连共聚物的电子器件模块

    公开(公告)号：WO2011163024A2

    公开(公告)日：2011-12-29

    申请号：PCT/US2011040489

    申请日：2011-06-15

    Applicant: DOW GLOBAL TECHNOLOGIES INC ,  NAUMOVITZ JOHN A ,  PATEL RAJEN M ,  WU SHAOFU ,  NIEMANN DEBRA H

    Inventor： NAUMOVITZ JOHN A ,  PATEL RAJEN M ,  WU SHAOFU ,  NIEMANN DEBRA H

    IPC: B32B17/10

    CPC classification number: H01L31/0203 ,  B32B17/10018 ,  B32B17/1055 ,  B32B17/10678 ,  B32B17/10697 ,  H01L23/293 ,  H01L31/0481 ,  H01L2924/0002 ,  H05K1/032 ,  Y02E10/50 ,  H01L2924/00

    Abstract: An electronic device module is disclosed comprising: A. at least one electronic device, and B. a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) An ethylenic polymer comprising at least 0.1 amyl branches per 1000 carbon atoms as determined by Nuclear Magnetic Resonance and both a highest peak melting temperature, Tm> in °C, and a heat of fusion, Hf in J/g, as determined by DSC Crystallinity, where the numerical values of Tm and Hf correspond to the relationship: Tm > (0.2143* Hf) + 79.643, and wherein the ethylenic polymer has less than about 1 mole percent ctane comonomer, and less than about 0.5 mole percent ctane, pentene, or ctane comonomer. (2) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt% based on the weight of the copolymer, (3) optionally, a co-agent in an amount of at least about 0.05 wt% based upon the weight of the copolymer, and (4) optionally, a vinyl silane compound.

    Abstract translation: 公开了一种电子设备模块，包括：A.至少一个电子设备，以及B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合物材料包含（1）包含至少0.1个戊基 通过核磁共振测定的每1000个碳原子的分支，以及DSC结晶度测定的最高峰熔融温度Tm> in℃和熔融热，Hf / J，其中Tm和 Hf对应于Tm>（0.2143×Hf）+ 79.643的关系，并且其中乙烯类聚合物具有小于约1摩尔％的正丁烷共聚单体和小于约0.5摩尔％的正庚烷，戊烯或者正庚烷共聚单体。 （2）任选地，基于共聚物重量的至少约0.05重量％的自由基引发剂或光引发剂，（3）任选地，基于以下物质的至少约0.05重量％的量的助剂： 共聚物的重量，和（4）任选的乙烯基硅烷化合物。

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