公开(公告)号：EP1342294A4

公开(公告)日：2006-03-08

申请号：EP01964214

申请日：2001-08-20

Applicant: DT INC DI ,  ROY APURBA

Inventor： ROY APURBA

IPC: H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K5/00 ,  H01R13/46

CPC classification number: H01R12/57 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10666 ,  H05K2201/10856 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49211 ,  H01L2924/00

Abstract: A low impedance surface mount connector (20) having an I-shaped cross section for connecting between the first and second circuit boards (51, 61).

公开(公告)号：EP1342292A4

公开(公告)日：2006-03-08

申请号：EP01964215

申请日：2001-08-20

Applicant: DT INC DI

Inventor： ROY APURBA ,  BRKOVIC MILIVOJE SLOBODAN

IPC: H01L25/04 ,  H01L25/18 ,  H01R12/52 ,  H01R43/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01R43/0256 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/0949 ,  H05K2201/09954 ,  H05K2201/10303 ,  H05K2201/1031 ,  Y02P70/611

Abstract: A circuit module (11) is provided with a plurality of dual capacity connector pads (13), each pad holding a miniature surface mount connector (15) and/or a connection pin (17). The preferred I-channel surface mount connector is sufficiently small that the module can be connected by either surface mount connector (15) or pin (17) to the same region of the circuit module.

公开(公告)号：AU8509401A

公开(公告)日：2002-06-24

申请号：AU8509401

申请日：2001-08-20

Applicant: DT INC DI ,  ROY APURBA

Inventor： ROY APURBA

IPC: H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K5/00 ,  H01R13/46

Abstract: In accordance with the invention, a low impedance surface-mount connector comprises a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of low resistance, low inductance, mechanical compliance and ease of manufacture. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.

公开(公告)号：AU8509501A

公开(公告)日：2002-06-24

申请号：AU8509501

申请日：2001-08-20

Applicant: DT INC DI

Inventor： ROY APURBA ,  BRKOVIC MILIVOJE SLOBODAN

IPC: H01L25/04 ,  H01L25/18 ,  H01R12/52 ,  H01R43/02 ,  H05K3/34 ,  H05K3/36 ,  H05K1/14

Abstract: In accordance with the invention, a circuit module is provided with a plurality of dual capacity connector pads, each pad holding a miniature surface mount connector and/or a connection pin. The preferred I-channel surface mount connector is sufficiently small that the module can be connected by either surface mount or pin to the same region of the circuit board.