公开(公告)号：EP1628515A1

公开(公告)日：2006-02-22

申请号：EP05076577.5

申请日：2005-07-11

Applicant: Delphi Technologies, Inc.

Inventor： Chang, Shih-chia ,  Berlin, Carl W. ,  Myers, Bruce A. ,  Fairchild, Ray M. ,  Peugh, Darrel E.

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20254 ,  H05K1/0206 ,  H05K1/0272 ,  H05K3/4611 ,  H05K2201/064

Abstract: The present invention provides a method for producing an electronic assembly and an electronic assembly (10, 100, 200, 300, 600) with an integrated cooling system for dissipating heat. The electronic assembly comprises a base (18, 218, 318, 618); and at least one electrical component (30, 230, 330, 630) attached to the base (18, 218, 318, 618). The base (18, 218, 318, 618) defines an integrated cooling system having a fluid channel (11, 211, 311, 611) spanning within the base (18, 218, 318, 618) and at least one heat exchanger (12, 13) in heat communication with the fluid channel (11, 211, 311, 611). The integrated cooling system may further include a pump (14) attached to the base (18, 218, 318, 618) for directing the flow of the fluid within the fluid channel (11, 211, 311, 611), and a port (16) in fluid communication with the fluid channel (11, 211, 311, 611) for receiving fluid from an external source.

Abstract translation: 本发明提供了一种用于制造电子组件和具有用于散热的集成冷却系统的电子组件（10,100,200,300,600）的方法。 电子组件包括基座（18,218,318,618）; 以及附接到基座（18,218,318,618）的至少一个电气部件（30,230,330,630）。 底座（18,218,318,618）限定了一个整体的冷却系统，该冷却系统具有横跨在基座（18,218,318,618）内的流体通道（11,211,311,611）和至少一个热交换器 ，13）与所述流体通道（11,211,311,611）热连通。 集成冷却系统还可以包括附接到基座（18,218,318,618）的泵（14），用于引导流体在流体通道（11,211,311,611）内的流动，以及一个端口 16）与流体通道（11,211,311,611）流体连通，用于从外部源接收流体。

公开(公告)号：EP1628515B1

公开(公告)日：2007-09-19

申请号：EP05076577.5

申请日：2005-07-11

Applicant: Delphi Technologies, Inc.

Inventor： Chang, Shih-chia ,  Berlin, Carl W. ,  Myers, Bruce A. ,  Fairchild, Ray M. ,  Peugh, Darrel E.

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20254 ,  H05K1/0206 ,  H05K1/0272 ,  H05K3/4611 ,  H05K2201/064