公开(公告)号：EP1622199B1

公开(公告)日：2018-09-12

申请号：EP05076556.9

申请日：2005-07-07

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Peugh, Darrel E. ,  Wilkinson, Lester ,  Gerbsch, Erich W.

IPC: H01L23/433 ,  H01L23/00 ,  H01L29/06 ,  H05K1/02 ,  H01L23/473

CPC classification number: H05K1/0272 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0203 ,  H05K2201/064 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A power semiconductor device package utilizes integral fluid conducting micro-channels (14), one or more inlet ports (38) for supplying liquid coolant to the micro-channels (14), and one or more outlet ports (40) for exhausting coolant that has passed through the micro-channels (14). The semiconductor device (10) is mounted on a single or multi-layer circuit board (44) having electrical and fluid interconnect features that mate with the electrical terminals (12a, 12b) and inlet and outlet ports (38, 40) of the device (10) to define a self-contained and self-sealed micro-channel heat exchanger.

公开(公告)号：EP1628515A1

公开(公告)日：2006-02-22

申请号：EP05076577.5

申请日：2005-07-11

Applicant: Delphi Technologies, Inc.

Inventor： Chang, Shih-chia ,  Berlin, Carl W. ,  Myers, Bruce A. ,  Fairchild, Ray M. ,  Peugh, Darrel E.

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20254 ,  H05K1/0206 ,  H05K1/0272 ,  H05K3/4611 ,  H05K2201/064

Abstract: The present invention provides a method for producing an electronic assembly and an electronic assembly (10, 100, 200, 300, 600) with an integrated cooling system for dissipating heat. The electronic assembly comprises a base (18, 218, 318, 618); and at least one electrical component (30, 230, 330, 630) attached to the base (18, 218, 318, 618). The base (18, 218, 318, 618) defines an integrated cooling system having a fluid channel (11, 211, 311, 611) spanning within the base (18, 218, 318, 618) and at least one heat exchanger (12, 13) in heat communication with the fluid channel (11, 211, 311, 611). The integrated cooling system may further include a pump (14) attached to the base (18, 218, 318, 618) for directing the flow of the fluid within the fluid channel (11, 211, 311, 611), and a port (16) in fluid communication with the fluid channel (11, 211, 311, 611) for receiving fluid from an external source.

Abstract translation: 本发明提供了一种用于制造电子组件和具有用于散热的集成冷却系统的电子组件（10,100,200,300,600）的方法。 电子组件包括基座（18,218,318,618）; 以及附接到基座（18,218,318,618）的至少一个电气部件（30,230,330,630）。 底座（18,218,318,618）限定了一个整体的冷却系统，该冷却系统具有横跨在基座（18,218,318,618）内的流体通道（11,211,311,611）和至少一个热交换器 ，13）与所述流体通道（11,211,311,611）热连通。 集成冷却系统还可以包括附接到基座（18,218,318,618）的泵（14），用于引导流体在流体通道（11,211,311,611）内的流动，以及一个端口 16）与流体通道（11,211,311,611）流体连通，用于从外部源接收流体。

公开(公告)号：EP1739746B1

公开(公告)日：2018-12-19

申请号：EP06076224.2

申请日：2006-06-14

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Peugh, Darrel E. ,  Sanftleben, Henry M.

IPC: H01L23/473 ,  H01L23/44

CPC classification number: H01L23/473 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/09701 ,  H01L2924/16251 ,  H01L2924/00

Abstract: A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and the fluid outlet, and an electronic device disposed within the fluid containment chamber and connected to the base, the electronic device having a plurality of microchannels adapted to receive a cooling fluid flow therethrough, wherein the cap is shaped to direct a fluid flow from the fluid inlet to the microchannels such that a pressure drop between the fluid inlet and the fluid outlet is reduced.

公开(公告)号：EP1840962A1

公开(公告)日：2007-10-03

申请号：EP07075221.7

申请日：2007-03-22

Applicant: Delphi Technologies, Inc.

Inventor： Peugh, Darrel E. ,  Myers, Bruce A. ,  Oberlin, Gary E.

IPC: H01L23/473

CPC classification number: H01L23/053 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/13055 ,  H01L2924/00

Abstract: An electronic assembly (10) is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device (20) within a sealed compartment. The assembly (10) includes a housing generally defining a sealed fluid compartment, an electronic device (20) disposed within the housing (16) and a cooling liquid for cooling the electronic device (20). The assembly (10) includes inlet and outlet ports (44 and 46) in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device (20). Fluid flow channels (26) are formed in thermal communication with the electronic device (20) within the housing (16). The fluid channels (26) include channels that allow liquid to flow in thermal communication with the electronic device (20) to cool the device (20).

Abstract translation: 提供了一种电子组件（10），其具有诸如液体的热冷却流体，用于冷却密封隔室内的电子设备（20）。 组件（10）包括大致限定密封的流体隔室的壳体，设置在壳体（16）内的电子设备（20）和用于冷却电子设备（20）的冷却液体。 组件（10）包括与密封的流体室流体连通的入口和出口端口（44和46），用于允许冷却液体通过隔室以冷却电子设备（20）。 流体流动通道（26）形成为与壳体（16）内的电子设备（20）热连通。 流体通道（26）包括允许液体与电子设备（20）热连通流动以冷却设备（20）的通道。

公开(公告)号：EP1528850B1

公开(公告)日：2007-03-07

申请号：EP04077881.3

申请日：2004-10-20

Applicant: Delphi Technologies, Inc.

Inventor： Oberlin, Gary E. ,  Myers, Bruce A. ,  Degenkolb, Thomas A. ,  Peugh, Darrel E.

IPC: H05K7/20

CPC classification number: H01L23/427 ,  H01L23/4275 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1739746A3

公开(公告)日：2008-12-24

申请号：EP06076224.2

申请日：2006-06-14

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Peugh, Darrel E. ,  Sanftleben, Henry M.

IPC: H01L23/44

CPC classification number: H01L23/473 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/09701 ,  H01L2924/16251 ,  H01L2924/00

Abstract: A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and the fluid outlet, and an electronic device disposed within the fluid containment chamber and connected to the base, the electronic device having a plurality of microchannels adapted to receive a cooling fluid flow therethrough, wherein the cap is shaped to direct a fluid flow from the fluid inlet to the microchannels such that a pressure drop between the fluid inlet and the fluid outlet is reduced.

公开(公告)号：EP1995777A1

公开(公告)日：2008-11-26

申请号：EP08154902.4

申请日：2008-04-21

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Peugh, Darrel E. ,  Elmoursi, Alaa A. ,  Van Steenkiste, Thomas H. ,  Zhao, Zhibo ,  Gillespie, Bryan A.

IPC: H01L23/492

CPC classification number: H01L23/49838 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A low cost transistor package (10) is provided for high power applications. The package provides high thermal conductivity and dissipation for a silicon transistor die (12), high current carrying capability and isolation, and high power and thermal cycle life performance and reliability. A dielectric layer (16) is fixed to a silicon transistor die (12), for coupling to a heat conducting buffer (26) and attachment to a substrate (24). The dielectric layer (16) is fixed to the die (12) by growing the dielectric layer (16), depositing the dielectric layer (16), or applying the dielectric layer (16) using a plasma spray. In an aspect, a conductive layer (14) is formed to the silicon transistor die (12) by a thermal or kinetic spray process, and the dielectric layer (16) is applied to the conductive layer (14). The dielectric layer (16) may also be established either before or after the transistor fabrication. Electrical and thermal interconnects are advantageously positioned from opposite sides of the silicon transistor die (12).

Abstract translation: 为高功率应用提供了低成本晶体管封装（10）。 该封装为硅晶体管管芯（12）提供高导热性和耗散性，高电流承载能力和隔离性以及高功率和热循环寿命性能和可靠性。 电介质层（16）被固定到硅晶体管管芯（12）上，用于耦合到导热缓冲器（26）并连接到衬底（24）。 通过生长电介质层（16），沉积电介质层（16）或使用等离子体喷涂来施加电介质层（16），将电介质层（16）固定到管芯（12）。 在一个方面中，通过热或动力学喷涂工艺将硅导体层（14）形成到硅晶体管管芯（12）上，并且介电层（16）被施加到导电层（14）。 介电层（16）也可以在晶体管制造之前或之后建立。 电和热互连有利地从硅晶体管管芯（12）的相对侧定位。

公开(公告)号：EP1628515B1

公开(公告)日：2007-09-19

申请号：EP05076577.5

申请日：2005-07-11

Applicant: Delphi Technologies, Inc.

Inventor： Chang, Shih-chia ,  Berlin, Carl W. ,  Myers, Bruce A. ,  Fairchild, Ray M. ,  Peugh, Darrel E.

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20254 ,  H05K1/0206 ,  H05K1/0272 ,  H05K3/4611 ,  H05K2201/064

公开(公告)号：EP1622199A3

公开(公告)日：2006-03-15

申请号：EP05076556.9

申请日：2005-07-07

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Peugh, Darrel E. ,  Wilkinson, Lester ,  Gerbsch, Erich W.

IPC: H01L23/46 ,  H01L23/473

CPC classification number: H05K1/0272 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0203 ,  H05K2201/064 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A power semiconductor device package utilizes integral fluid conducting micro-channels (14), one or more inlet ports (38) for supplying liquid coolant to the micro-channels (14), and one or more outlet ports (40) for exhausting coolant that has passed through the micro-channels (14). The semiconductor device (10) is mounted on a single or multi-layer circuit board (44) having electrical and fluid interconnect features that mate with the electrical terminals (12a, 12b) and inlet and outlet ports (38, 40) of the device (10) to define a self-contained and self-sealed micro-channel heat exchanger.

公开(公告)号：EP2244290A3

公开(公告)日：2013-01-16

申请号：EP10159242.6

申请日：2010-04-07

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Chengalva, Suresh K. ,  Peugh, Darrel E.

IPC: H01L23/473 ,  H01L23/427

CPC classification number: H01L23/473 ,  F28F3/048 ,  F28F3/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipating component (10) including a heat-generating device (12) such as a power semiconductor chip and mounting structure (14) is provided with coolant channels (18) having a stair-stepped internal geometry that enhances cooling performance with both single-phase and two-phase cooling modes without unduly restricting coolant flow or significantly increasing manufacturing cost. The stair-stepped geometry enhances both single-phase and two-phase cooling modes by increasing the surface area of the channels (18), and further enhances the two-phase cooling mode by providing numerous high-quality bubble nucleation sites along the length of the channels (18). The stair-stepped channels (18) are formed in the heat-generating device (12) and/or the mounting structure (14), and the stepped sidewalls (19a, 19b) may extend toward or away from the center of the channel (18).