公开(公告)号：EP1968363A2

公开(公告)日：2008-09-10

申请号：EP08151813.6

申请日：2008-02-22

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Sarma, Dwadasi H.R. ,  Chappell, William J. ,  Hoppenjans, Eric E.

IPC: H05K1/16

CPC classification number: H05K1/162 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09763 ,  Y10T29/435

Abstract: An embedded capacitor method and system is provided for printed circuit boards. The capacitor structure is embedded within an insulator substrate (30B), minimizes real-estate usage, provides a high capacitance, enhances capacitance density, and yet forms an advantageous planar surface topography. A cavity (36) is defined within and contained by an insulator substrate layer (30B), and a dielectric material (38) at least partially fills the cavity (30B). The dielectric material (38) is connected to an electrical conductor (32A, 32B), and vias (34A, 34B) are used for interconnections and traces. In an aspect, a plurality of stacked insulator substrate layers (40B-40F) define a plurality of cavities (41A-41E) filled with the dielectric material (48A-48E), providing even greater capacitance. In another aspect, an array of cavities (76A-76L) is formed in the insulator substrate layer (70). The embedded capacitor can be employed within numerous systems that utilize capacitors including automotive electronics such as a pressure sensor, an engine control module, a transmission controller, and radio systems including satellite radio devices.

Abstract translation: 为印刷电路板提供嵌入式电容器方法和系统。 电容器结构嵌入在绝缘体基板（30B）内，最小化不动产使用，提供高电容，增强电容密度，并形成有利的平面表面形貌。 空腔（36）被限定在绝缘体基底层（30B）内并由绝缘体基底层（30B）容纳，并且至少部分地填充空腔（30B）的电介质材料（38）。 电介质材料（38）连接到电导体（32A，32B），通孔（34A，34B）用于互连和迹线。 在一个方面，多个堆叠的绝缘体衬底层（40B-40F）限定了填充有电介质材料（48A-48E）的多个空腔（41A-41E），从而提供更大的电容。 在另一方面，在绝缘体基底层（70）中形成有空腔阵列（76A-76L）。 嵌入式电容器可以用于利用诸如压力传感器，发动机控制模块，变速器控制器和包括卫星无线电设备的无线电系统在内的汽车电子产品的电容器的众多系统中。