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    EDGE SEAL FOR ELECTRONICS ASSEMBLY SUITABLE FOR EXPOSURE TO ELECTRICALLY CONDUCTIVE COOLANT
    1.
    发明公开
    EDGE SEAL FOR ELECTRONICS ASSEMBLY SUITABLE FOR EXPOSURE TO ELECTRICALLY CONDUCTIVE COOLANT 审中-公开
    用于电子器件组件的边缘密封，其适合用于暴露于导电的冷却剂

    公开(公告)号：EP2814310A2

    公开(公告)日：2014-12-17

    申请号：EP14171564.9

    申请日：2014-06-06

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

    IPC: H05K7/20

    CPC classification number: H05K7/20927 ,  H05K7/20236 ,  H05K7/20872

    Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metal sleeve around the perimeter of the dielectric plates to form a device assembly (10). The configuration allows for more direct contact between the electronic device and the coolant (16), while protecting the electronic device from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

    Abstract translation: 一种液体冷却配置为使用导电的冷却剂（16）以冷却功率电子器件做功率电子组件（10）用来与周围的电介质板的外周的金属套筒密封，以形成一个装置组件（10），电介质板。 构造允许所述电子装置和冷却剂（16）之间的更直接的接触，而具有潜在的导电的冷却剂（16）保护所述电子设备从接触。 材料用于形成电介质板与所述壳体（18）被选择为具有象在密封件的可靠性最大化热膨胀（CTE）的系数相似。

    Liquid cooled electronics assembly suitable to use electrically conductive coolant
    2.
    发明公开
    Liquid cooled electronics assembly suitable to use electrically conductive coolant 审中-公开
    液冷式电子组件适合使用导电冷却液

    公开(公告)号：EP2645839A3

    公开(公告)日：2017-04-26

    申请号：EP13160107.2

    申请日：2013-03-20

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

    IPC: H05K7/20

    CPC classification number: H05K7/20927

    Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly (10), and then forms another metallic seal between the device assembly (10) and a housing (18). The configuration allows for more direct contact between the electronic device (12) and the coolant (16), while protecting the electronic device (12) from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

    Abstract translation: 一种液冷功率电子组件（10），其被配置为使用导电冷却剂（16）来冷却功率电子设备，该功率电子设备使用围绕介电板的周边用金属密封件密封的介电板以形成设备组件（10），然后 在装置组件（10）和壳体（18）之间形成另一金属密封。 该配置允许电子设备（12）和冷却剂（16）之间更直接的接触，同时保护电子设备（12）不与潜在导电的冷却剂（16）接触。 选择用于形成电介质板和壳体（18）的材料以具有相似的热膨胀系数（CTE），使得密封件的可靠性最大化。

    Liquid cooled electronics assembly suitable to use electrically conductive coolant
    3.
    发明授权
    Liquid cooled electronics assembly suitable to use electrically conductive coolant 有权

    公开(公告)号：EP2645839B1

    公开(公告)日：2018-09-12

    申请号：EP13160107.2

    申请日：2013-03-20

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

    IPC: H05K7/20

    CPC classification number: H05K7/20927

    Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly (10), and then forms another metallic seal between the device assembly (10) and a housing (18). The configuration allows for more direct contact between the electronic device (12) and the coolant (16), while protecting the electronic device (12) from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

    Thermoelectric generator to engine exhaust manifold assembly
    5.
    发明公开
    Thermoelectric generator to engine exhaust manifold assembly 有权
    热电发电机用于发动机排气歧管组件

    公开(公告)号：EP2789822A1

    公开(公告)日：2014-10-15

    申请号：EP14163084.8

    申请日：2014-04-01

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Eltom, Khalid M. ,  Myers, Bruce A. ,  Eesley, Gary L. ,  Moor, Bruce

    IPC: F01N5/02 ,  F01N13/16

    CPC classification number: H01L35/30 ,  F01N5/025 ,  F01N2240/02 ,  Y02T10/16

    Abstract: An assembly (10) for coupling thermally a thermoelectric generator (TEG (12)) to an exhaust manifold of an internal combustion engine. The exhaust manifold forms a first heat exchanger (14) configured to couple thermally heat from exhaust gas (16) to an outer surface (22) of the first heat exchanger (14). The outer surface (22) is preferably formed of stainless steel. A first dielectric layer (24) is formed by firing a thick-film dielectric material onto the stainless steel of the first heat exchanger (14). A first conductor layer (26) is formed by firing a conductive thick-film onto the first dielectric layer (24). A first paste layer (32) of silver (Ag) based sintering paste is interposed between the first conductor layer (26) and a first contact (30) of the TEG (12). The first contact (30) is sintered to the first conductor layer (26) when the assembly (10) is suitably arranged and suitably heated.

    Abstract translation: 一种用于将热电发电机（TEG（12））热耦合至内燃机的排气歧管的组件（10）。 排气歧管形成第一热交换器（14），该第一热交换器构造成将来自排气（16）的热热量耦合到第一热交换器（14）的外表面（22）。 外表面（22）优选由不锈钢形成。 通过在第一热交换器（14）的不锈钢上烧制厚膜电介质材料来形成第一电介质层（24）。 通过在第一介电层（24）上烧制导电厚膜来形成第一导体层（26）。 在第一导体层（26）和TEG（12）的第一触点（30）之间插入银（Ag）基烧结浆料的第一浆料层（32）。 当组件（10）被合适地布置并适当地加热时，第一触点（30）被烧结到第一导体层（26）。

    Liquid cooled electronics assembly suitable to use electrically conductive coolant
    9.
    发明公开
    Liquid cooled electronics assembly suitable to use electrically conductive coolant 审中-公开
    液体冷却的电子组件，其是适于使用导电的冷却介质的

    公开(公告)号：EP2645839A2

    公开(公告)日：2013-10-02

    申请号：EP13160107.2

    申请日：2013-03-20

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

    IPC: H05K7/20

    CPC classification number: H05K7/20927

    Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly (10), and then forms another metallic seal between the device assembly (10) and a housing (18). The configuration allows for more direct contact between the electronic device (12) and the coolant (16), while protecting the electronic device (12) from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

    Abstract translation: 一种液体冷却配置为使用导电的冷却剂（16）以冷却功率电子器件做功率电子组件（10）用来与周围的电介质板的周边的金属密封件，以形成一个装置组件（10）密封的电介质板，然后 形成器件组件（10）和壳体（18）之间的另一个金属密封件。 该配置允许电子设备（12）和冷却剂（16）之间的更直接的接触，而具有潜在的导电的冷却剂（16）保护所述电子设备（12）从接触。 材料用于形成电介质板与所述壳体（18）被选择为具有象在密封件的可靠性最大化热膨胀（CTE）的系数相似。

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