公开(公告)号：EP2814310A3

公开(公告)日：2015-04-08

申请号：EP14171564.9

申请日：2014-06-06

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

IPC: H05K7/20

CPC classification number: H05K7/20927 ,  H05K7/20236 ,  H05K7/20872

Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metal sleeve around the perimeter of the dielectric plates to form a device assembly (10). The configuration allows for more direct contact between the electronic device and the coolant (16), while protecting the electronic device from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

公开(公告)号：EP2645839A2

公开(公告)日：2013-10-02

申请号：EP13160107.2

申请日：2013-03-20

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

IPC: H05K7/20

CPC classification number: H05K7/20927

Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly (10), and then forms another metallic seal between the device assembly (10) and a housing (18). The configuration allows for more direct contact between the electronic device (12) and the coolant (16), while protecting the electronic device (12) from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

Abstract translation: 一种液体冷却配置为使用导电的冷却剂（16）以冷却功率电子器件做功率电子组件（10）用来与周围的电介质板的周边的金属密封件，以形成一个装置组件（10）密封的电介质板，然后 形成器件组件（10）和壳体（18）之间的另一个金属密封件。 该配置允许电子设备（12）和冷却剂（16）之间的更直接的接触，而具有潜在的导电的冷却剂（16）保护所述电子设备（12）从接触。 材料用于形成电介质板与所述壳体（18）被选择为具有象在密封件的可靠性最大化热膨胀（CTE）的系数相似。

公开(公告)号：EP1530234A3

公开(公告)日：2011-11-02

申请号：EP04077976.1

申请日：2004-10-29

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Oman, Todd P. ,  Walsh, Matthew R.

IPC: H01L23/36

CPC classification number: H01L23/5387 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/42 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15747 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A heat sinkable package that includes a power device package (200, 300, 400, 500) including an active side (A) and a non-active side (N) is disclosed. The non-active side (N) includes a heat sinkable surface positioned adjacent to a product case (C). Another embodiment of the invention is directed to a method for manufacturing a heat sinkable package. The method comprises the steps of placing at least one flip chip (204, 304) over a flexible circuit (208) within a mold tool; compensating for height variances of the flip chips (204, 204); and positioning an input/output on an active side (A) of the power device package (200, 300, 400, 500) opposite a non-active side (N) of the power device package.

公开(公告)号：EP1748688A3

公开(公告)日：2009-06-03

申请号：EP06076287.9

申请日：2006-06-23

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Chengalva, Suresh K. ,  Brandenburg, Scott D. ,  Myers, Bruce A.

IPC: H05K7/20

CPC classification number: H01L23/473 ,  H01L23/44 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K7/20236 ,  H05K7/20909 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic package having circulated submersed cooling fluid and method are provided. The electronic package has a housing defining a sealed enclosure and electronic devices located in the housing. The electronic devices have thermal emitting electrical circuitry. A dielectric fluid, such as a liquid, is located in the housing in heat transfer relationship with the electronic devices. A fluid circulator, such as a piezo fan, is located in the housing in contact with the dielectric liquid for circulating the dielectric liquid to cool the electronic devices.

公开(公告)号：EP2043150A2

公开(公告)日：2009-04-01

申请号：EP08164601.0

申请日：2008-09-18

Applicant: Delphi Technologies, Inc.

Inventor： Walsh, Matthew R. ,  Nair, Deepukumar M. ,  Zimmerman, David W. ,  Haffke, Benjamen E. ,  Brandenburg, Scott D.

IPC: H01L23/66

CPC classification number: H01L23/66 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2924/1617 ,  H01L2924/19032 ,  H01L2924/19039 ,  H01P5/107

Abstract: A microwave communication package (10) is constructed on an electrically conducting base plate (12) having a first side (14) defining a base plate cavity (16), with an antenna apparatus (40) mounted on an opposite, second side (18). A dielectric substrate (20) on the first side of the base plate covers the base plate cavity; and sealing apparatus (72) contacting the dielectric substrate and the base plate completely around the base plate cavity hermetically seals the cavity. Circuitry (30, 32) mounted on a surface of the substrate within the base plate cavity includes one or more microstrip lines (54) communicating components (30) to one or more waveguides comprising openings (50) extending through the base plate; and the waveguides are coupled at their opposite ends to the antenna apparatus.

Abstract translation: 微波通信封装（10）构造在具有限定基板腔（16）的第一侧面（14）的导电基板（12）上，天线装置（40）安装在相对的第二侧（18 ）。 基板的第一侧上的电介质基板（20）覆盖基板空腔; 并且密封装置（72）使绝缘基片和基板完全围绕底板腔体密封，密封空腔。 安装在基板腔内的基板表面上的电路（30,32）包括一个或多个微带线路（54），其将部件（30）连接到一个或多个包括延伸穿过基板的开口（50）的波导; 并且波导在其相对端耦合到天线装置。

公开(公告)号：EP2003690A2

公开(公告)日：2008-12-17

申请号：EP08156713.3

申请日：2008-05-22

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Taylor, Ralph S. ,  Sozansky, Wayne A.

IPC: H01L23/373

CPC classification number: H01L23/3733 ,  H01L23/42 ,  H01L2224/29011 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2924/01019 ,  H01L2924/01079 ,  Y10T29/49002 ,  H01L2924/0665

Abstract: An improved thermal interface material for conducting heat away from an integrated circuit device into a heat sink is a composite material including a metal screen defining openings and a hardened structural bonding agent incorporated into the openings of the metal screen. The improved composite thermal interface material achieves outstanding bonding properties superior to conventional thermal interface materials, while also exhibiting exceptional thermal conductivity.

Abstract translation: 用于将热量从集成电路装置传导到散热器中的改进的热界面材料是复合材料，其包括限定开口的金属丝网和结合到金属丝网的开口中的硬化结构粘结剂。 改进的复合热界面材料具有优于常规热界面材料的优异的粘合性能，同时还具有出色的导热性。

公开(公告)号：EP1566992A3

公开(公告)日：2007-01-24

申请号：EP05075327.6

申请日：2005-02-10

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Laudick, David A. ,  Degenkolb, Thomas A. ,  Mandel, Larry M. ,  Parker, Richard D.

IPC: H05K3/28

CPC classification number: H05K3/284 ,  H05K1/0271 ,  H05K2201/10189 ,  H05K2203/1316

Abstract: An electronic assembly (100) having an associated connector and/or a mold (120/122) is constructed to reduce deflection and resultant damage to components and/or an associated printed circuit board (102) of the electronic assembly (100) when the electronic assembly (100) is overmolded.

公开(公告)号：EP1508915A3

公开(公告)日：2006-05-03

申请号：EP04077238.6

申请日：2004-08-05

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Myers, Bruce A.

IPC: H01L23/373

CPC classification number: H01L25/165 ,  B23K1/0008 ,  B23K35/26 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H05K7/20436 ,  H05K7/20854

Abstract: A process and electronic assembly (10) for conducting heat from a semiconductor circuit device (12) mounted to a substrate (14). The substrate (14) is supported by a housing member (20) equipped with a heat-conductive member (26). A surface (28) of the device (12) opposite the substrate (14) is bonded to the heat-conductive member (26) with a solder joint (30) formed of indium and optionally one or more alloying constituents that increase the melting temperature of the solder joint (30) above that of indium. The housing member (20), substrate (14), and device (12) are assembled so that an indium-containing solder material is present between the heat-conductive member (26) and the surface (28) of the device (12) opposite the substrate (14). The solder material is then reflowed to form the solder joint (30). The alloying constituent(s) are preferably introduced into the solder joint (30) during reflow.

Abstract translation: 一种用于从安装到衬底（14）的半导体电路器件（12）传导热量的工艺和电子组件（10）。 基板（14）由配备有导热构件（26）的壳体（20）支撑。 与衬底（14）相对的装置（12）的表面（28）通过由铟形成的焊接接头（30）和任选的一种或多种增加熔化温度的合金成分结合到导热构件（26） 的焊点（30）高于铟的焊点。 壳体构件（20），基板（14）和装置（12）组装成使得含铟焊料材料存在于导热构件（26）和装置（12）的表面（28）之间， 与衬底（14）相对。 焊料材料然后回流以形成焊点（30）。 优选在回流期间将合金成分引入焊点（30）。

公开(公告)号：EP1628509A2

公开(公告)日：2006-02-22

申请号：EP05076727.6

申请日：2005-07-27

Applicant: Delphi Technologies, Inc.

Inventor： Delheimer, Charles I. ,  Workman, Derek B. ,  Tsai, Jeenhuei S. ,  Walsh, Matthew R. ,  Brandenburg, Scott D. ,  Thompson, Brian D.

IPC: H05K3/28 ,  H05K3/30

CPC classification number: H05K3/303 ,  H01L21/563 ,  H01L23/3121 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1433 ,  H01L2924/19041 ,  H05K3/284 ,  H05K2201/10674 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An electronic module (100) includes a substrate (108), at least one surface mounted integrated circuit (IC) component (110) and an underfill material (122). The substrate (108) includes a plurality of electrically conductive traces (118A,118B), formed on at least one surface of the substrate (108), and the component (110) is electrically coupled to at least one of the conductive traces (118A,118B). The underfill material (122) is positioned between the component (110) and the substrate (108) and provides at least one pedestal that supports the component (110) during encapsulation. The underfill material (122), when cured, maintains the integrity of the electrical connections between the component (110) and the conductive traces (118A,118B).

Abstract translation: 电子模块（100）包括衬底（108），至少一个表面安装集成电路（IC）部件（110）和底部填充材料（122）。 衬底（108）包括形成在衬底（108）的至少一个表面上的多个导电迹线（118A，118B），并且部件（110）电耦合到导电迹线（118A）中的至少一个 ，118B）。 底部填充材料（122）位于部件（110）和基板（108）之间，并且提供至少一个在封装期间支撑部件（110）的基座。 底部填充材料（122）在固化时保持部件（110）和导电迹线（118A，118B）之间的电连接的完整性。

公开(公告)号：EP1628344A2

公开(公告)日：2006-02-22

申请号：EP05076730.0

申请日：2005-07-27

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Chengalva, Suresh K. ,  Degenkolb, Thomas A.

IPC: H01L23/473

CPC classification number: B29C45/14655 ,  B29C45/7207 ,  H01L23/4334 ,  H01L23/473 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: A method of making a fluid cooled microelectronic package (10'/60') in which fluid is circulated through the package in fluid-carrying channels (40/64) defined at least in part by voids in an encapsulant (38) that surrounds the package components (12, 14, 16). Preferably, the encapsulant channels (40/64) are defined in part by heat producing components (12, 14, 16) of the package so that coolant fluid directly contacts such components. The coolant fluid can be electrically conductive or non-conductive depending on the type of components being cooled. The coolant channels (40) are formed by insert-molding a form (24) in the encapsulant (38), and removing the form (24) following the molding process. Alternately, the encapsulant is formed in two or more pieces (38a, 38b) that are joined to form the package (60'), and the coolant channels (64) are defined by recesses (62) formed in at least one of the encapsulant pieces (38a, 38b).

Abstract translation: 一种制造流体冷却微电子封装的方法（10“/ 60”），其中流体通过封装在至少部分地由空隙在密封件（38）限定流体输送通道（40/64）循环没有包围 封装部件（12，14，16）。 优选地，密封剂通道（40/64）部分地由封装的发热元件（12，14，16）中所定义所以没有冷却流体直接接触的搜索组件。 冷却剂流体可以是导电的或其他非导电性取决于被冷却部件的类型。 冷却剂通道（40）通过嵌件成型在所述密封剂（38）的模具（24），并除去之后在模制过程中模具（24）形成。 可替换地，密封剂在两个或更多个部件形成（38A，38B）没有被接合，以形成在密封剂中的至少一种所形成的包装件（60“），以及冷却剂通道（64）由凹部（62）被定义 件（38A，38B）。