公开(公告)号：EP1589795A1

公开(公告)日：2005-10-26

申请号：EP05075795.4

申请日：2005-04-06

Applicant: Delphi Technologies, Inc.

Inventor： Sarma, Dwadasi H. ,  Heytens, Rhonda J. ,  Berlin, Carl W. ,  Fairchild, Ray M. ,  Myers, Bruce A. ,  Ward, Daniel K.

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H01L23/15 ,  H01L23/3677 ,  H01L23/3731 ,  H01L23/3735 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19107 ,  H05K1/0206 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0209 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit board assembly (30) that makes use of a low-temperature co-fired ceramic (LTCC) substrate (10), and a process for producing the assembly (30). The substrate (10) contains at least first and second regions (32,34) formed by a plurality of first ceramic layers (36) and at least one second ceramic layer (38), respectively, that are superimposed and bonded to each other. Conductor lines (22) are present on at least some of the first ceramic layers (36) so as to be between adjacent pairs of the layers (36). Electrically-conductive vias (16) electrically interconnect the conductor lines (22) on different first ceramic layers (36), and a surface-mount IC device (12) is mounted to the substrate (10). The first ceramic layers (36) are formed of electrically-nonconductive materials, while the one or more second ceramic layers (38) contain thermally-conductive particles dispersed in a matrix of electrically-nonconductive materials, such that the one or more second ceramic layers (38) are more thermally conductive than the first ceramic layers (36).

Abstract translation: 使用低温共烧陶瓷（LTCC）基板（10）的电路板组件（30）和用于制造组件（30）的工艺。 衬底（10）至少包含由多个第一陶瓷层（36）和至少一个第二陶瓷层（38）形成的第一和第二区域（32,34），它们彼此叠加并结合。 导体线（22）存在于至少一些第一陶瓷层（36）上，以便在相邻的层（36）之间。 导电通孔（16）将不同第一陶瓷层（36）上的导体线（22）电互连，并且表面安装IC器件（12）安装到基板（10）。 第一陶瓷层（36）由非导电材料形成，而一个或多个第二陶瓷层（38）包含分散在非导电材料的基体中的导热颗粒，使得一个或多个第二陶瓷层 （38）比第一陶瓷层（36）更加导热。