公开(公告)号：EP1622199A3

公开(公告)日：2006-03-15

申请号：EP05076556.9

申请日：2005-07-07

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Peugh, Darrel E. ,  Wilkinson, Lester ,  Gerbsch, Erich W.

IPC: H01L23/46 ,  H01L23/473

CPC classification number: H05K1/0272 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0203 ,  H05K2201/064 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A power semiconductor device package utilizes integral fluid conducting micro-channels (14), one or more inlet ports (38) for supplying liquid coolant to the micro-channels (14), and one or more outlet ports (40) for exhausting coolant that has passed through the micro-channels (14). The semiconductor device (10) is mounted on a single or multi-layer circuit board (44) having electrical and fluid interconnect features that mate with the electrical terminals (12a, 12b) and inlet and outlet ports (38, 40) of the device (10) to define a self-contained and self-sealed micro-channel heat exchanger.

公开(公告)号：EP1622199A2

公开(公告)日：2006-02-01

申请号：EP05076556.9

申请日：2005-07-07

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Peugh, Darrel E. ,  Wilkinson, Lester ,  Gerbsch, Erich W.

IPC: H01L23/46 ,  H01L23/473

CPC classification number: H05K1/0272 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0203 ,  H05K2201/064 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A power semiconductor device package utilizes integral fluid conducting micro-channels (14), one or more inlet ports (38) for supplying liquid coolant to the micro-channels (14), and one or more outlet ports (40) for exhausting coolant that has passed through the micro-channels (14). The semiconductor device (10) is mounted on a single or multi-layer circuit board (44) having electrical and fluid interconnect features that mate with the electrical terminals (12a, 12b) and inlet and outlet ports (38, 40) of the device (10) to define a self-contained and self-sealed micro-channel heat exchanger.

Abstract translation: 功率半导体器件封装利用完整的流体传导微通道（14），用于向微通道（14）供应液体冷却剂的一个或多个入口端口（38）以及用于排出冷却剂的一个或多个出口端口（40） 已经通过微通道（14）。 半导体器件（10）安装在单层或多层电路板（44）上，该电路板具有与设备的电端子（12a，12b）和入口和出口端口（38,40）配合的电和流体互连特征 （10）来限定自含式自密封微通道热交换器。

公开(公告)号：EP1622199B1

公开(公告)日：2018-09-12

申请号：EP05076556.9

申请日：2005-07-07

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Peugh, Darrel E. ,  Wilkinson, Lester ,  Gerbsch, Erich W.

IPC: H01L23/433 ,  H01L23/00 ,  H01L29/06 ,  H05K1/02 ,  H01L23/473

CPC classification number: H05K1/0272 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0203 ,  H05K2201/064 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A power semiconductor device package utilizes integral fluid conducting micro-channels (14), one or more inlet ports (38) for supplying liquid coolant to the micro-channels (14), and one or more outlet ports (40) for exhausting coolant that has passed through the micro-channels (14). The semiconductor device (10) is mounted on a single or multi-layer circuit board (44) having electrical and fluid interconnect features that mate with the electrical terminals (12a, 12b) and inlet and outlet ports (38, 40) of the device (10) to define a self-contained and self-sealed micro-channel heat exchanger.