公开(公告)号：DE69729590T2

公开(公告)日：2005-06-09

申请号：DE69729590

申请日：1997-06-25

Applicant: EBARA CORP

Inventor： KIMURA NORIO ,  ISHII YOU ,  NISHI TOYOMI ,  KAWAMOTO TAKAYOSHI ,  SAKURAI TAKESHI

IPC: B24B49/00 ,  B24B53/00 ,  B24B37/04

Abstract: A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polishing cloth in a radial direction thereof, determining a rotational speed of the dresser with respect to a rotational speed of the turntable on the basis of the measured heights, and dressing the polishing cloth by pressing the dresser against the polishing cloth while the turntable and the dresser are rotating. The dresser has an annular diamond grain layer or an annular SiC layer.

公开(公告)号：DE69333322T2

公开(公告)日：2004-09-30

申请号：DE69333322

申请日：1993-09-22

Applicant: EBARA CORP

Inventor： HIROSE MASAYOSHI ,  TSUJIMURA MANABU ,  ISHIKAWA SEIJI ,  KIMURA NORIO ,  ISHII YOU

IPC: B24B37/10 ,  B24B37/30 ,  H01L21/304 ,  B24B37/04

Abstract: A polishing apparatus for polishing a surface of a workpiece (6), comprising: a turntable (20); a top ring (3) for supporting the workpiece to be polished and pressing the workpiece against said turntable; and a transferring device (66) for transferring the workpiece to and from said top ring, said transferring device having holding means for holding the workpiece, said hold means being raised when the workpiece is transferred to and from said top ring located above said transferring device.

公开(公告)号：DE69902021T2

公开(公告)日：2003-03-06

申请号：DE69902021

申请日：1999-03-26

Applicant: TOSHIBA KAWASAKI KK ,  EBARA CORP

Inventor： KIMURA NORIO ,  ISHII YOU ,  TATEYAMA YOSHIKUNI

IPC: B24B37/04 ,  B24B1/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/304

Abstract: A polishing apparatus has a turntable with a polishing cloth attached thereto and a top ring for holding and pressing a workpiece to be polished against the polishing cloth under a certain pressure. The polishing apparatus also has a first dressing unit having a contact-type dresser for dressing the polishing cloth by bringing the contact-type dresser in contact with the polishing cloth, and a second dressing unit having a noncontact-type dresser for dressing the polishing cloth with a fluid jet applied therefrom to the polishing cloth. The contact-type dresser comprises a diamond dresser or an SiC dresser.

公开(公告)号：DE69325756D1

公开(公告)日：1999-09-02

申请号：DE69325756

申请日：1993-09-22

Applicant: EBARA CORP

Inventor： HIROSE MASAYOSHI ,  TSUJIMURA MANABU ,  ISHIKAWA SEIJI ,  KIMURA NORIO ,  ISHII YOU

IPC: B24B37/10 ,  B24B37/30 ,  H01L21/304 ,  B24B37/04

Abstract: A polishing apparatus for polishing a surface of a workpiece (6), comprising: a turntable (20); a top ring (3) for supporting the workpiece to be polished and pressing the workpiece against said turntable; and a transferring device (66) for transferring the workpiece to and from said top ring, said transferring device having holding means for holding the workpiece, said hold means being raised when the workpiece is transferred to and from said top ring located above said transferring device.

公开(公告)号：DE69317838T2

公开(公告)日：1998-11-12

申请号：DE69317838

申请日：1993-09-22

Applicant: EBARA CORP

Inventor： HIROSE MASAYOSHI ,  ISHIKAWA SEIJI ,  KIMURA NORIO ,  KAWASHIMA KIYOTAKA ,  ISHII YOU

IPC: B24B37/26 ,  B24B53/007 ,  B24B53/017 ,  B24B37/04

Abstract: A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereof for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.

公开(公告)号：EP0813932A1

公开(公告)日：1997-12-29

申请号：EP97110228

申请日：1997-06-23

Applicant: EBARA CORP

Inventor： KIMURA NORIO ,  ISHII YOU

IPC: B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  B24B37/04

CPC classification number: B24B37/26 ,  B24B37/12 ,  B24B37/20

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer. The polishing apparatus has a cloth cartridge which is detachably exchangeably mounted on a turntable. The polishing apparatus comprises a turntable, a cloth cartridge detachably exchangeably mounted on the turntable, and a top ring for holding the workpiece and pressing the workpiece against the polishing cloth. The cloth cartridge includes a cartridge base member and a polishing cloth bonded to an upper surface of the cartridge base member. The cartridge base member comprises a plurality of base member segments, and the polishing cloth comprises a plurality of polishing cloth segments bonded to upper surfaces of the base member segments, respectively.

Abstract translation: 抛光装置用于抛光诸如半导体晶片的工件。 抛光装置具有可拆卸地安装在转台上的布料盒。 抛光装置包括可转动地安装在转台上的转台，可拆卸地布置的布盒，以及用于保持工件并将工件压靠抛光布的顶环。 该布料盒包括一个与基座部件的上表面接合的墨盒底座部件和抛光布。 盒基部件包括多个基座部件，并且抛光布分别包括多个结合到基部部件段的上表面的抛光布段。

公开(公告)号：DE69902021D1

公开(公告)日：2002-08-08

申请号：DE69902021

申请日：1999-03-26

Applicant: TOSHIBA KAWASAKI KK ,  EBARA CORP

Inventor： KIMURA NORIO ,  ISHII YOU ,  TATEYAMA YOSHIKUNI

IPC: B24B37/04 ,  B24B1/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/304

Abstract: A polishing apparatus has a turntable with a polishing cloth attached thereto and a top ring for holding and pressing a workpiece to be polished against the polishing cloth under a certain pressure. The polishing apparatus also has a first dressing unit having a contact-type dresser for dressing the polishing cloth by bringing the contact-type dresser in contact with the polishing cloth, and a second dressing unit having a noncontact-type dresser for dressing the polishing cloth with a fluid jet applied therefrom to the polishing cloth. The contact-type dresser comprises a diamond dresser or an SiC dresser.

公开(公告)号：DE69707565T2

公开(公告)日：2002-07-11

申请号：DE69707565

申请日：1997-06-23

Applicant: EBARA CORP

Inventor： KIMURA NORIO ,  ISHII YOU

IPC: B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  B24B37/04

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer. The polishing apparatus has a cloth cartridge which is detachably exchangeably mounted on a turntable. The polishing apparatus comprises a turntable, a cloth cartridge detachably exchangeably mounted on the turntable, and a top ring for holding the workpiece and pressing the workpiece against the polishing cloth. The cloth cartridge includes a cartridge base member and a polishing cloth bonded to an upper surface of the cartridge base member. The cartridge base member comprises a plurality of base member segments, and the polishing cloth comprises a plurality of polishing cloth segments bonded to upper surfaces of the base member segments, respectively.

公开(公告)号：DE69316849D1

公开(公告)日：1998-03-12

申请号：DE69316849

申请日：1993-11-24

Applicant: TOSHIBA KAWASAKI KK ,  EBARA CORP

Inventor： OKUMURA KATSUYA ,  WATANABE TOHRU ,  AOKI RIICHIROU ,  YANO HIROYUKI ,  KODERA MASAKO ,  SHIGETA ATSUSHI ,  ISHII YOU ,  KIMURA NORIO ,  HIROSE MASAYOSHI ,  IKEDA YUKIO

IPC: B24B37/10 ,  B24B37/30 ,  B24B37/04

Abstract: A workpiece such as a semiconductor wafer (6) is positioned between a turntable and a top ring (3) and polished by an abrasive cloth on the turntable while the top ring is being pressed against the turntable. The top ring has a retaining ring (5) for preventing the workpiece (6) from deviating from the lower surface of the top ring, and the retaining ring has an inside diameter larger than an outside diameter of the workpiece. The rotation of the turntable imparts a pressing force in a direction parallel to the upper surface of the turntable to the workpiece so that an outer periphery of the workpiece contacts an inner periphery of the retaining ring, and the rotation of the retaining ring imparts a rotational force to the workpiece so that the workpiece performs a planetary motion relative to the top ring in the retaining ring.

公开(公告)号：DE19602458A1

公开(公告)日：1996-12-12

申请号：DE19602458

申请日：1996-01-24

Applicant: EBARA CORP

Inventor： KIMURA NORIO ,  ISHII YOU ,  YASUDA HOZUMI ,  SAITO KOJI ,  WATASE MASAKO ,  MISHIMA SHIRO

IPC: B24B37/00 ,  B24B57/02 ,  B24B29/02 ,  H01L21/304

Abstract: A polishing apparatus for polishing a surface of an object such as a semiconductor wafer includes a turntable having a polishing cloth mounted on an upper surface thereof, a top ring for holding and pressing the object against the polishing cloth, and a plurality of radially arranged nozzles for supplying a polishing solution, containing abrasive material, of different concentrations that differ along a radial direction of the polishing cloth.