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公开(公告)号：DE69325756T2
公开(公告)日：2000-03-02
申请号：DE69325756
申请日：1993-09-22
Applicant: EBARA CORP
Inventor： HIROSE MASAYOSHI , TSUJIMURA MANABU , ISHIKAWA SEIJI , KIMURA NORIO , ISHII YOU
IPC: B24B37/10 , B24B37/30 , H01L21/304 , B24B37/04
Abstract: A polishing apparatus for polishing a surface of a workpiece (6), comprising: a turntable (20); a top ring (3) for supporting the workpiece to be polished and pressing the workpiece against said turntable; and a transferring device (66) for transferring the workpiece to and from said top ring, said transferring device having holding means for holding the workpiece, said hold means being raised when the workpiece is transferred to and from said top ring located above said transferring device.
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公开(公告)号：DE69433067T2
公开(公告)日：2004-06-03
申请号：DE69433067
申请日：1994-09-20
Applicant: EBARA CORP
Inventor： OKUMURA KATSUYA , AOKI RIICHIROU , YAJIMA HIROMI , KODERA MASAKO , MISHIMA SHIROU , SHIGETA ATSUSHI , HIROSE MASAYOSHI , KIMURA NORIO , ISHIKAWA SEIJI
IPC: H01L21/302 , B08B1/04 , B24B27/00 , B24B37/04 , B24B37/34 , B24B51/00 , B24B55/12 , H01L21/00 , H01L21/677
Abstract: A polishing apparatus is a cluster type of apparatus having a plurality of units to deal with various works. The polishing apparatus includes a universal transfer robot having at least one arm for transferring a workpiece, a plurality of units disposed around the universal transfer robot and including a loading unit for placing thereon the workpiece to be polished, at least one polishing unit for polishing the workpiece, at least one washing unit for washing the workpiece which has been polished and an unloading unit for placing thereon the cleaned workpiece. The polishing apparatus further includes an exclusive transferring device for transferring the workpiece between two units of the plurality of units adjacent to each other. The universal transfer robot transfers a clean workpiece and the exclusive transferring device transfers a dirty workpiece. The loading unit and the unloading unit are integrally formed.
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公开(公告)号：DE69333322D1
公开(公告)日：2004-01-08
申请号：DE69333322
申请日：1993-09-22
Applicant: EBARA CORP
Inventor： HIROSE MASAYOSHI , TSUJIMURA MANABU , ISHIKAWA SEIJI , KIMURA NORIO , ISHII YOU
IPC: B24B37/10 , B24B37/30 , H01L21/304 , B24B37/04
Abstract: A polishing apparatus for polishing a surface of a workpiece (6), comprising: a turntable (20); a top ring (3) for supporting the workpiece to be polished and pressing the workpiece against said turntable; and a transferring device (66) for transferring the workpiece to and from said top ring, said transferring device having holding means for holding the workpiece, said hold means being raised when the workpiece is transferred to and from said top ring located above said transferring device.
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公开(公告)号：DE69433067D1
公开(公告)日：2003-09-25
申请号：DE69433067
申请日：1994-09-20
Applicant: EBARA CORP
Inventor： OKUMURA KATSUYA , AOKI RIICHIROU , YAJIMA HIROMI , KODERA MASAKO , MISHIMA SHIROU , SHIGETA ATSUSHI , HIROSE MASAYOSHI , KIMURA NORIO , ISHIKAWA SEIJI
IPC: H01L21/302 , B08B1/04 , B24B27/00 , B24B37/04 , B24B37/34 , B24B51/00 , B24B55/12 , H01L21/00 , H01L21/677
Abstract: A polishing apparatus is a cluster type of apparatus having a plurality of units to deal with various works. The polishing apparatus includes a universal transfer robot having at least one arm for transferring a workpiece, a plurality of units disposed around the universal transfer robot and including a loading unit for placing thereon the workpiece to be polished, at least one polishing unit for polishing the workpiece, at least one washing unit for washing the workpiece which has been polished and an unloading unit for placing thereon the cleaned workpiece. The polishing apparatus further includes an exclusive transferring device for transferring the workpiece between two units of the plurality of units adjacent to each other. The universal transfer robot transfers a clean workpiece and the exclusive transferring device transfers a dirty workpiece. The loading unit and the unloading unit are integrally formed.
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公开(公告)号：DE69317838D1
公开(公告)日：1998-05-14
申请号：DE69317838
申请日：1993-09-22
Applicant: EBARA CORP
Inventor： HIROSE MASAYOSHI , ISHIKAWA SEIJI , KIMURA NORIO , KAWASHIMA KIYOTAKA , ISHII YOU
IPC: B24B37/26 , B24B53/007 , B24B53/017 , B24B37/04
Abstract: A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereof for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.
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Patent Agency Ranking
公开(公告)号：DE69434678T2
公开(公告)日：2007-04-12
申请号：DE69434678
申请日：1994-09-20
Applicant: EBARA CORP
Inventor： OKUMURA KATSUYA , AOKI RIICHIROU , YAJIMA HIROMI , KODERA MASAKO , MISHIMA SHIROU , SHIGETA ATSUSHI , HIROSE MASAYOSHI , KIMURA NORIO , ISHIKAWA SEIJI
IPC: H01L21/302 , B08B1/04 , B24B27/00 , B24B37/04 , B24B37/34 , B24B51/00 , B24B55/12 , H01L21/00 , H01L21/677
Abstract: A polishing apparatus is a cluster type of apparatus having a plurality of units to deal with various works. The polishing apparatus includes a universal transfer robot having at least one arm for transferring a workpiece, a plurality of units disposed around the universal transfer robot and including a loading unit for placing thereon the workpiece to be polished, at least one polishing unit for polishing the workpiece, at least one washing unit for washing the workpiece which has been polished and an unloading unit for placing thereon the cleaned workpiece. The polishing apparatus further includes an exclusive transferring device for transferring the workpiece between two units of the plurality of units adjacent to each other. The universal transfer robot transfers a clean workpiece and the exclusive transferring device transfers a dirty workpiece. The loading unit and the unloading unit are integrally formed.
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公开(公告)号：DE69434678D1
公开(公告)日：2006-05-18
申请号：DE69434678
申请日：1994-09-20
Applicant: EBARA CORP
Inventor： OKUMURA KATSUYA , AOKI RIICHIROU , YAJIMA HIROMI , KODERA MASAKO , MISHIMA SHIROU , SHIGETA ATSUSHI , HIROSE MASAYOSHI , KIMURA NORIO , ISHIKAWA SEIJI
IPC: H01L21/302 , B08B1/04 , B24B27/00 , B24B37/04 , B24B37/34 , B24B51/00 , B24B55/12 , H01L21/00 , H01L21/677
Abstract: A polishing apparatus is a cluster type of apparatus having a plurality of units to deal with various works. The polishing apparatus includes a universal transfer robot having at least one arm for transferring a workpiece, a plurality of units disposed around the universal transfer robot and including a loading unit for placing thereon the workpiece to be polished, at least one polishing unit for polishing the workpiece, at least one washing unit for washing the workpiece which has been polished and an unloading unit for placing thereon the cleaned workpiece. The polishing apparatus further includes an exclusive transferring device for transferring the workpiece between two units of the plurality of units adjacent to each other. The universal transfer robot transfers a clean workpiece and the exclusive transferring device transfers a dirty workpiece. The loading unit and the unloading unit are integrally formed.
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公开(公告)号：DE69421577D1
公开(公告)日：1999-12-16
申请号：DE69421577
申请日：1994-08-16
Applicant: EBARA CORP
Inventor： KIMURA NORIO , AOKI KATSUYUKI , KAWASHIMA KIYOTAKA , ISHIKAWA SEIJI
Abstract: A waste treatment system in a polishing apparatus treates waste gas and waste liquid discharged from the polishing apparatus. The waste treatment system comprises an exhaust duct provided in a partition wall enclosing the polishing apparatus, a scrubber connected to the exhaust duct through an exhauster for scrubbing waste gas discharged from the polishing apparatus, a waste liquid receiver provided below an abrasive cloth of the polishing apparatus for receiving waste liquid generated by polishing operation and a waste liquid treatment apparatus connected to the waste liquid receiver for treating the waste liquid discharged from the polishing apparatus.
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公开(公告)号：DE19540626A1
公开(公告)日：1996-06-05
申请号：DE19540626
申请日：1995-10-31
Applicant: EBARA CORP
Inventor： HIROSE MASAYOSHI , ISHIKAWA SEIJI , KIMURA NORIO , SASAKI YOSHIMI , YAMADA KOUKI , AOYAMA FUJIO , SHIMIZU NOBURU , OKUMURA KATSUYA
Abstract: The polishing device has a rotary drum (3) with a polishing cloth (16) applied to its outer surface, pressed into contact with the surface of the semiconductor wafer (9). A polishing soln. containing fine abrasive particles is applied to the cloth during polishing.The drum or the seating (8) supporting the semiconductor wafer is displaced in a direction perpendicular to the drum axis and a direction parallel to the polished surface, so that the polishing is effected over the full surface of the semiconductor wafer.
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公开(公告)号：DE69333322T2
公开(公告)日：2004-09-30
申请号：DE69333322
申请日：1993-09-22
Applicant: EBARA CORP
Inventor： HIROSE MASAYOSHI , TSUJIMURA MANABU , ISHIKAWA SEIJI , KIMURA NORIO , ISHII YOU
IPC: B24B37/10 , B24B37/30 , H01L21/304 , B24B37/04
Abstract: A polishing apparatus for polishing a surface of a workpiece (6), comprising: a turntable (20); a top ring (3) for supporting the workpiece to be polished and pressing the workpiece against said turntable; and a transferring device (66) for transferring the workpiece to and from said top ring, said transferring device having holding means for holding the workpiece, said hold means being raised when the workpiece is transferred to and from said top ring located above said transferring device.
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