公开(公告)号：EP0812656A3

公开(公告)日：1998-07-15

申请号：EP97116489

申请日：1993-09-22

Applicant: EBARA CORP

Inventor： HIROSE MASAYOSHI ,  ISHIKAWA SEIJI ,  KIMURA NORIO ,  KAWASHIMA KIYOTAKA ,  ISHII YOU

IPC: B24B37/26 ,  B24B53/007 ,  B24B53/017 ,  B24B37/04

CPC classification number: B24B53/017 ,  B24B37/26

Abstract: A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereof for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.

Abstract translation: 具有安装在其上的研磨布的转盘和位于转台上方的顶环可独立地可旋转地设置。 顶环保持要抛光的工件，并将工件压在研磨布上。 转盘和顶环旋转以将工件的表面抛光到研磨布上的平整镜面。 压在研磨布上的可旋转刷子围绕基本上垂直于研磨布平面的轴线旋转，并且在磨料布的径向内部和外部位置之间基本径向摆动。 将清洁溶液从喷嘴喷射到研磨布上。 转台沿其外圆周边缘具有一个堤，用于防止当转盘静止时供给磨料以保持磨料湿润并防止磨损的保护液从转盘流出。

公开(公告)号：DE69333322T2

公开(公告)日：2004-09-30

申请号：DE69333322

申请日：1993-09-22

Applicant: EBARA CORP

Inventor： HIROSE MASAYOSHI ,  TSUJIMURA MANABU ,  ISHIKAWA SEIJI ,  KIMURA NORIO ,  ISHII YOU

IPC: B24B37/10 ,  B24B37/30 ,  H01L21/304 ,  B24B37/04

Abstract: A polishing apparatus for polishing a surface of a workpiece (6), comprising: a turntable (20); a top ring (3) for supporting the workpiece to be polished and pressing the workpiece against said turntable; and a transferring device (66) for transferring the workpiece to and from said top ring, said transferring device having holding means for holding the workpiece, said hold means being raised when the workpiece is transferred to and from said top ring located above said transferring device.

公开(公告)号：DE69434678T2

公开(公告)日：2007-04-12

申请号：DE69434678

申请日：1994-09-20

Applicant: EBARA CORP

Inventor： OKUMURA KATSUYA ,  AOKI RIICHIROU ,  YAJIMA HIROMI ,  KODERA MASAKO ,  MISHIMA SHIROU ,  SHIGETA ATSUSHI ,  HIROSE MASAYOSHI ,  KIMURA NORIO ,  ISHIKAWA SEIJI

IPC: H01L21/302 ,  B08B1/04 ,  B24B27/00 ,  B24B37/04 ,  B24B37/34 ,  B24B51/00 ,  B24B55/12 ,  H01L21/00 ,  H01L21/677

Abstract: A polishing apparatus is a cluster type of apparatus having a plurality of units to deal with various works. The polishing apparatus includes a universal transfer robot having at least one arm for transferring a workpiece, a plurality of units disposed around the universal transfer robot and including a loading unit for placing thereon the workpiece to be polished, at least one polishing unit for polishing the workpiece, at least one washing unit for washing the workpiece which has been polished and an unloading unit for placing thereon the cleaned workpiece. The polishing apparatus further includes an exclusive transferring device for transferring the workpiece between two units of the plurality of units adjacent to each other. The universal transfer robot transfers a clean workpiece and the exclusive transferring device transfers a dirty workpiece. The loading unit and the unloading unit are integrally formed.

公开(公告)号：DE69434678D1

公开(公告)日：2006-05-18

申请号：DE69434678

申请日：1994-09-20

Applicant: EBARA CORP

Inventor： OKUMURA KATSUYA ,  AOKI RIICHIROU ,  YAJIMA HIROMI ,  KODERA MASAKO ,  MISHIMA SHIROU ,  SHIGETA ATSUSHI ,  HIROSE MASAYOSHI ,  KIMURA NORIO ,  ISHIKAWA SEIJI

IPC: H01L21/302 ,  B08B1/04 ,  B24B27/00 ,  B24B37/04 ,  B24B37/34 ,  B24B51/00 ,  B24B55/12 ,  H01L21/00 ,  H01L21/677

Abstract: A polishing apparatus is a cluster type of apparatus having a plurality of units to deal with various works. The polishing apparatus includes a universal transfer robot having at least one arm for transferring a workpiece, a plurality of units disposed around the universal transfer robot and including a loading unit for placing thereon the workpiece to be polished, at least one polishing unit for polishing the workpiece, at least one washing unit for washing the workpiece which has been polished and an unloading unit for placing thereon the cleaned workpiece. The polishing apparatus further includes an exclusive transferring device for transferring the workpiece between two units of the plurality of units adjacent to each other. The universal transfer robot transfers a clean workpiece and the exclusive transferring device transfers a dirty workpiece. The loading unit and the unloading unit are integrally formed.

公开(公告)号：DE69316214T2

公开(公告)日：1998-08-13

申请号：DE69316214

申请日：1993-07-06

Applicant: EBARA CORP

Inventor： MORI SATOSHI ,  MATSUMURA MASAO ,  KANEMITSU YOICHI ,  YOSHIOKA TAKESHI ,  KAJIYAMA MASAAKI ,  KONDO FUMIO ,  SHIRAO YUJI ,  EGUCHI MASATO ,  SHINOZAKI HIROYUKI ,  IKEDA YUKIO ,  HIROSE MASAYOSHI ,  NAKANIWA MASARU ,  KIMURA NORIO ,  USUI KATSUAKI ,  AOKI KATSUYUKI

IPC: H01L21/00 ,  H01L21/677 ,  B65G54/02 ,  B65G49/00 ,  B65G49/07 ,  B65G47/52 ,  B65G47/68 ,  B65G47/92 ,  B60L13/06 ,  H01L21/68

Abstract: In a tunnel which is kept in a high-vacuum or filled with a highly clean atmosphere, a carrying truck (3) is moved by an electromagnetic levitation system. Electromagnets (4) for electromagnetically levitate the carrying truck (3) which travels in the tunnel (1) in a noncontact way and carries semiconductor waters, electromagnets (6) constituting a linear motor for driving the carrying truck (3), and displacement sensors (8) for sensing the levitation quantity of the carrying truck (3) in the tunnel (1) are provided outside the tunnel (1). Thereby, gases are not produced and the semiconductor wafers (22) are not contaminated. Also, when the carrying truck (3) changes the traveling direction by 90 DEG at a branch part where two tracks intersect at right angles in the tunnel (1), the electromagnets (4) are provided in parallel with the respective tracks and are so controlled that the excitation levels of the electromagnets (4) are changed gradually. Thereby, the traveling direction of the carrying truck (3) can be changed smoothly without contact of the truck with the inner wall of the tunnel (1) and the semiconductor wafers (22) are prevented from being damaged by collisions, etc.

公开(公告)号：DE69316849D1

公开(公告)日：1998-03-12

申请号：DE69316849

申请日：1993-11-24

Applicant: TOSHIBA KAWASAKI KK ,  EBARA CORP

Inventor： OKUMURA KATSUYA ,  WATANABE TOHRU ,  AOKI RIICHIROU ,  YANO HIROYUKI ,  KODERA MASAKO ,  SHIGETA ATSUSHI ,  ISHII YOU ,  KIMURA NORIO ,  HIROSE MASAYOSHI ,  IKEDA YUKIO

IPC: B24B37/10 ,  B24B37/30 ,  B24B37/04

Abstract: A workpiece such as a semiconductor wafer (6) is positioned between a turntable and a top ring (3) and polished by an abrasive cloth on the turntable while the top ring is being pressed against the turntable. The top ring has a retaining ring (5) for preventing the workpiece (6) from deviating from the lower surface of the top ring, and the retaining ring has an inside diameter larger than an outside diameter of the workpiece. The rotation of the turntable imparts a pressing force in a direction parallel to the upper surface of the turntable to the workpiece so that an outer periphery of the workpiece contacts an inner periphery of the retaining ring, and the rotation of the retaining ring imparts a rotational force to the workpiece so that the workpiece performs a planetary motion relative to the top ring in the retaining ring.

公开(公告)号：DE19540626A1

公开(公告)日：1996-06-05

申请号：DE19540626

申请日：1995-10-31

Applicant: EBARA CORP

Inventor： HIROSE MASAYOSHI ,  ISHIKAWA SEIJI ,  KIMURA NORIO ,  SASAKI YOSHIMI ,  YAMADA KOUKI ,  AOYAMA FUJIO ,  SHIMIZU NOBURU ,  OKUMURA KATSUYA

IPC: B24B7/22 ,  B24B29/02 ,  B24B37/07 ,  B24B37/10 ,  H01L21/304 ,  B24B29/00

Abstract: The polishing device has a rotary drum (3) with a polishing cloth (16) applied to its outer surface, pressed into contact with the surface of the semiconductor wafer (9). A polishing soln. containing fine abrasive particles is applied to the cloth during polishing.The drum or the seating (8) supporting the semiconductor wafer is displaced in a direction perpendicular to the drum axis and a direction parallel to the polished surface, so that the polishing is effected over the full surface of the semiconductor wafer.

公开(公告)号：DE69325756T2

公开(公告)日：2000-03-02

申请号：DE69325756

申请日：1993-09-22

Applicant: EBARA CORP

Inventor： HIROSE MASAYOSHI ,  TSUJIMURA MANABU ,  ISHIKAWA SEIJI ,  KIMURA NORIO ,  ISHII YOU

IPC: B24B37/10 ,  B24B37/30 ,  H01L21/304 ,  B24B37/04

Abstract: A polishing apparatus for polishing a surface of a workpiece (6), comprising: a turntable (20); a top ring (3) for supporting the workpiece to be polished and pressing the workpiece against said turntable; and a transferring device (66) for transferring the workpiece to and from said top ring, said transferring device having holding means for holding the workpiece, said hold means being raised when the workpiece is transferred to and from said top ring located above said transferring device.

公开(公告)号：DE69316849T2

公开(公告)日：1998-09-10

申请号：DE69316849

申请日：1993-11-24

Applicant: TOSHIBA KAWASAKI KK ,  EBARA CORP

Inventor： OKUMURA KATSUYA ,  WATANABE TOHRU ,  AOKI RIICHIROU ,  YANO HIROYUKI ,  KODERA MASAKO ,  SHIGETA ATSUSHI ,  ISHII YOU ,  KIMURA NORIO ,  HIROSE MASAYOSHI ,  IKEDA YUKIO

IPC: B24B37/10 ,  B24B37/30 ,  B24B37/04

Abstract: A workpiece such as a semiconductor wafer (6) is positioned between a turntable and a top ring (3) and polished by an abrasive cloth on the turntable while the top ring is being pressed against the turntable. The top ring has a retaining ring (5) for preventing the workpiece (6) from deviating from the lower surface of the top ring, and the retaining ring has an inside diameter larger than an outside diameter of the workpiece. The rotation of the turntable imparts a pressing force in a direction parallel to the upper surface of the turntable to the workpiece so that an outer periphery of the workpiece contacts an inner periphery of the retaining ring, and the rotation of the retaining ring imparts a rotational force to the workpiece so that the workpiece performs a planetary motion relative to the top ring in the retaining ring.

公开(公告)号：DE60326760D1

公开(公告)日：2009-04-30

申请号：DE60326760

申请日：2003-09-17

Applicant: EBARA CORP

Inventor： NAGASAWA HIROSHI ,  KAGOSHIMA KAORI ,  OGURE NAOAKI ,  HIROSE MASAYOSHI ,  CHIKAMORI YUSUKE

IPC: B23K35/02 ,  B22F1/00 ,  B22F7/06 ,  B23K35/30 ,  B23K35/36 ,  C09J5/06 ,  C09J11/04 ,  H01L21/60 ,  H01L23/482 ,  H05K3/32

Abstract: There is provided a bonding material and a bonding method which enable lead-free bonding that can replace high-temperature soldering. The bonding material of the present invention comprises a dispersion in an organic solvent of composite metallic nano-particles having such a structure that a metal core of a metal particle having an average particle diameter of not more than 100 nm. The bonding material can be advantageously used in a stepwise bonding process containing at least two bonding steps.