公开(公告)号：US20170285609A1

公开(公告)日：2017-10-05

申请号：US15474158

申请日：2017-03-30

Applicant: EBARA CORPORATION

Inventor： Hidetatsu ISOKAWA

IPC: G05B19/402

CPC classification number: G05B19/402 ,  G05B2219/39548 ,  G05B2219/42129 ,  G05B2219/45031 ,  H01L21/67219 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/681

Abstract: A teaching apparatus is provided with an arm-side position sensor attached to arms, a dummy wafer placed on a stage, a dummy-wafer-side position sensor attached to the dummy wafer, and a signal receiver configured to receive a position signal from the arm-side position sensor to determine a position coordinate of the arm-side position sensor, and receive a position signal from the dummy-wafer-side position sensor to determine a position coordinate of the dummy-wafer-side position sensor. A control part, based on the position coordinate of the dummy-wafer-side position sensor, calculates a position coordinate of the arm-side position sensor when the arms hold the wafer, and moves the arms such that the arm-side position sensor moves to the calculated position coordinate.

公开(公告)号：US20190355594A1

公开(公告)日：2019-11-21

申请号：US16410378

申请日：2019-05-13

Applicant: EBARA CORPORATION

Inventor： Hidetatsu ISOKAWA ,  Koji MAEDA ,  Xu HAIYANG ,  Shun EHARA

IPC: H01L21/67 ,  B24B37/34 ,  B08B3/04 ,  H01L21/677 ,  H01L21/687

Abstract: A mechanism that conveys a substrate is cleaned in a cleaning unit. A substrate processing apparatus that includes a substrate polishing device and a substrate cleaning unit is disclosed. The substrate cleaning unit includes a cleaning module and a cleaning unit conveyance mechanism. The cleaning unit conveyance mechanism includes a hand and a hand open/close mechanism. The substrate processing apparatus further includes a hand cleaning unit. The hand cleaning unit includes a hand cleaning tank and a cleaning liquid injection mechanism.

公开(公告)号：US20210394332A1

公开(公告)日：2021-12-23

申请号：US17041734

申请日：2020-03-04

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Hiroshi SHIMOMOTO ,  Soichi ISOBE ,  Koji MAEDA ,  Kenji SHINKAI ,  Hidetatsu ISOKAWA ,  Dai YOSHINARI ,  Masayuki TAMURA ,  Haiyang XU ,  Shun EHARA ,  Kentaro ASANO

IPC: B24B37/015 ,  B24B57/02 ,  B24B53/00

Abstract: A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.

公开(公告)号：US20180315611A1

公开(公告)日：2018-11-01

申请号：US15963777

申请日：2018-04-26

Applicant: EBARA CORPORATION

Inventor： Hidetatsu ISOKAWA

IPC: H01L21/306 ,  H01L21/304 ,  B24B37/04 ,  B24B55/06 ,  G03F1/82

Abstract: A substrate processing apparatus is disclosed. In an embodiment, a substrate processing apparatus includes a plurality of polishing units including discharge valves that can discharge water at a predetermined flow rate, a plurality of cleaning units including discharge valves that discharges water at a predetermined flow rate, and a controller that controls opening and closing of the discharge valve of each of the plurality of polishing units and the plurality of cleaning units, and the controller controls opening and closing of the discharge valves of the plurality of polishing units and the plurality of cleaning units based on predetermined priority orders allocated to the plurality of polishing units and the plurality of cleaning units, so that the total discharge flow rate from the plurality of polishing units and the plurality of cleaning units is a predetermined flow rate or less.

公开(公告)号：US20180001440A1

公开(公告)日：2018-01-04

申请号：US15615375

申请日：2017-06-06

Applicant: Ebara Corporation

Inventor： Hiroshi AONO ,  Kuniaki YAMAGUCHI ,  Hiroshi SHIMOMOTO ,  Koji MAEDA ,  Tetsuya YASHIMA ,  Kenji SHINKAI ,  Koichi HASHIMOTO ,  Mitsuhiko INABA ,  Hidetatsu ISOKAWA ,  Hidetaka NAKAO ,  Soichi ISOBE

IPC: B24B37/34 ,  H01L21/67 ,  B24B37/10 ,  B08B3/12 ,  B08B1/04 ,  H01L21/687 ,  B08B1/00

Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.