公开(公告)号：US20210394332A1

公开(公告)日：2021-12-23

申请号：US17041734

申请日：2020-03-04

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Hiroshi SHIMOMOTO ,  Soichi ISOBE ,  Koji MAEDA ,  Kenji SHINKAI ,  Hidetatsu ISOKAWA ,  Dai YOSHINARI ,  Masayuki TAMURA ,  Haiyang XU ,  Shun EHARA ,  Kentaro ASANO

IPC: B24B37/015 ,  B24B57/02 ,  B24B53/00

Abstract: A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.

公开(公告)号：US20190299360A1

公开(公告)日：2019-10-03

申请号：US16366546

申请日：2019-03-27

Applicant: EBARA CORPORATION

Inventor： Tadakazu SONE ,  Ryuichi KOSUGE ,  Kenji SHINKAI ,  Hiroshi AONO ,  Hideo AIZAWA

IPC: B24B57/00 ,  B24B37/24 ,  B24B37/22

Abstract: A polishing apparatus includes a polishing table supplied with liquid on a upper surface and rotating around a central axis, a liquid receiver having an annular shape and disposed below a peripheral portion of the polishing table, and a drain member having a tubular shape, attached to a peripheral portion of the polishing table, and including a lower end portion extending toward the liquid receiver.

公开(公告)号：US20170008144A1

公开(公告)日：2017-01-12

申请号：US14787424

申请日：2015-03-27

Applicant: EBARA CORPORATION

Inventor： Kenji SHINKAI ,  Tadakazu SONE ,  Hideo AIZAWA ,  Hiroshi AONO

IPC: B24B37/34 ,  B24B53/017

CPC classification number: B24B37/34 ,  B24B53/017

Abstract: There is provided a cover to which a polishing liquid is less likely to stick and solidify. The cover for a component of a polishing apparatus for polishing substrates is provided with a locking mechanism disposed inside the cover and configured to latch together a main body of the component and the cover. An external surface of the cover exposed to the outside has no recessed portion, and has no horizontal plane, except on the top portion of the cover.

Abstract translation: 提供了一种不太可能粘附和固化的抛光液的盖子。 用于抛光基板的抛光装置的部件的盖设置有设置在盖内并被构造成将部件的主体和盖闩锁在一起的锁定机构。 暴露于外部的盖的外表面没有凹部，除了盖的顶部以外，没有水平面。

公开(公告)号：US20150082613A1

公开(公告)日：2015-03-26

申请号：US14494038

申请日：2014-09-23

Applicant: EBARA CORPORATION

Inventor： Hiroyuki SHINOZAKI ,  Kenji SHINKAI ,  Tadakazu SONE ,  Hideo AIZAWA ,  Hiroshi AONO ,  Toshio YOKOYAMA

IPC: B23Q7/00

CPC classification number: H01L21/68742 ,  H01L21/6719 ,  Y10T29/49998

Abstract: [Problem] An object of the present invention is to facilitate height level adjustment of a substrate processing apparatus regardless of size thereof.[Means for Solving] A lifting device 630b includes: a lifting mechanism 640 that is provided between at least one of a plurality of units of a substrate processing apparatus and an installation surface of the unit, and that adjusts height of the at least one unit with respect to the installation surface; and an adjustment member 660 that is provided with an extended section 664 extended from the lifting mechanism 640, and that is capable of operating the lifting mechanism 640 through the extended section 664.

Abstract translation: 本发明的目的在于便于基板处理装置的高度调整，而不管其尺寸如何。 具体实施方式提升装置630b具有：提升机构640，其设置在基板处理装置的多个单元中的至少一个与该单元的安装面之间，并且调整至少一个单元的高度 相对于安装面; 以及调节构件660，其具有从提升机构640延伸的延伸部664，并且能够通过延伸部664操作提升机构640。

公开(公告)号：US20230001539A1

公开(公告)日：2023-01-05

申请号：US17809074

申请日：2022-06-27

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Masayuki TAMURA ,  Kenji SHINKAI ,  Soichi ISOBE ,  Yusuke MOCHIDA

IPC: B24B53/00 ,  B24B53/017 ,  B24B57/02

Abstract: A liquid feeder includes: a first arm having a first nozzle; a second arm having a second nozzle; a first rotation shaft supporting a proximal end part of the first arm; a second rotation shaft supporting a proximal end part of the second arm; a first rotation driver configured to rotate the first rotation shaft to turn the first arm from a fluid feed position to a retracted position; a second rotation driver configured to rotate the second rotation shaft to turn the second arm from a fluid feed position to a retracted position; and a controller. The first rotation shaft and the second rotation shaft are disposed coaxially with each other. The controller is capable of controlling the operation of the first rotation driver and the operation of the second rotation driver independently of each other.

公开(公告)号：US20180001440A1

公开(公告)日：2018-01-04

申请号：US15615375

申请日：2017-06-06

Applicant: Ebara Corporation

Inventor： Hiroshi AONO ,  Kuniaki YAMAGUCHI ,  Hiroshi SHIMOMOTO ,  Koji MAEDA ,  Tetsuya YASHIMA ,  Kenji SHINKAI ,  Koichi HASHIMOTO ,  Mitsuhiko INABA ,  Hidetatsu ISOKAWA ,  Hidetaka NAKAO ,  Soichi ISOBE

IPC: B24B37/34 ,  H01L21/67 ,  B24B37/10 ,  B08B3/12 ,  B08B1/04 ,  H01L21/687 ,  B08B1/00

Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.

公开(公告)号：US20150314418A1

公开(公告)日：2015-11-05

申请号：US14699075

申请日：2015-04-29

Applicant: EBARA CORPORATION

Inventor： Hiroyuki SHINOZAKI ,  Hiroshi AONO ,  Tadakazu SONE ,  Kenji SHINKAI ,  Hideo AIZAWA

IPC: B24B55/12 ,  B24B37/34

Abstract: A substrate polishing apparatus includes a polishing table 30 having a polishing surface 10 in the upper surface, a substrate holding portion 31 that holds a substrate W having a surface to be polished in the lower surface, and a holding portion cover 36 that covers the outer side of the substrate holding portion 31. Between the lower portion of the holding portion cover 36 and the upper surface of the polishing table 30, a gap portion for intake 37 is provided, and in the upper portion of the holding portion cover 36, a pipe for exhaust 39 connected to an exhaust mechanism 38 is provided. By operating the exhaust mechanism 38, a rising air current from the gap portion 37 toward the pipe 39 is formed between the outer surface of the substrate holding portion 31 and the inner surface of the holding portion cover 36.

Abstract translation: 基板研磨装置具备：上表面具有研磨面10的研磨台30，在下表面保持具有被研磨面的基板W的基板保持部31;以及覆盖外侧的保持部覆盖部36 在保持部盖36的下部与研磨台30的上表面之间，设置有用于吸入口37的间隙部，在保持部罩36的上部设有 设置有与排气机构38连接的排气管39。 通过操作排气机构38，在基板保持部31的外表面和保持部盖36的内表面之间形成有从间隙部37向管39的上升气流。