公开(公告)号：US20210370461A1

公开(公告)日：2021-12-02

申请号：US17048674

申请日：2019-04-25

Applicant: EBARA CORPORATION

Inventor： Keisuke KAMIKI ,  Toru MARUYAMA ,  Yasuyuki MOTOSHIMA

IPC: B24B37/005

Abstract: The present invention relates to a polishing apparatus having a surface-property measuring device for measuring surface properties of a polishing pad which is used to polish a substrate, such as semiconductor wafer, and a polishing system including such a polishing apparatus. The polishing apparatus includes a surface-property measuring device (30) for measuring surface properties of a polishing pad (2), a support arm (50) for supporting the surface-property measuring device (30), and a moving unit (53) coupled to the support arm (50) and configured to move the surface-property measuring device (30) from a retreat position to a measure position.

公开(公告)号：US20220305617A1

公开(公告)日：2022-09-29

申请号：US17692038

申请日：2022-03-10

Applicant: EBARA CORPORATION

Inventor： Keisuke KAMIKI ,  Toru MARUYAMA ,  Yasuyuki MOTOSHIMA

IPC: B24B55/02 ,  B24B37/04 ,  B24B37/015 ,  B24B37/34

Abstract: A pad-temperature regulating apparatus is disclosed, which includes a heat exchanger capable of being cleaned in a limited space. A pad-temperature regulating apparatus includes a heat exchanger configured to contact a polishing pad to exchange heat with the polishing pad, a moving mechanism configured to move the heat exchanger between a temperature regulating position where the heat exchanger can exchange heat with the polishing pad, and a retreat position located on a side of the polishing pad, and a cleaning mechanism configured to clean the heat exchanger moved to the retreat position. The heat exchanger has an approximate triangular shape in a horizontal cross-section, and a longest side of the heat exchanger faces the polishing pad when the heat exchanger is moved to the retreat position.

公开(公告)号：US20210114164A1

公开(公告)日：2021-04-22

申请号：US17065787

申请日：2020-10-08

Applicant: EBARA CORPORATION

Inventor： Masashi KABASAWA ,  Yasuyuki MOTOSHIMA ,  Hisanori MATSUO ,  Keisuke KAMIKI

IPC: B24B37/015 ,  B24B37/013 ,  B24B37/20

Abstract: There is disclosed a polishing apparatus which can regulate a surface temperature of the polishing pad without causing a defect such as a scratch on a substrate such as a wafer. The polishing apparatus includes: a non-contact type pad-temperature regulating device; a pad-temperature measuring device. The pad-temperature measuring device is arranged adjacent to the pad-temperature regulating device and on a downstream side of the pad-temperature regulating device in a rotation direction of a polishing table.