公开(公告)号：US20230321696A1

公开(公告)日：2023-10-12

申请号：US18128892

申请日：2023-03-30

Applicant: EBARA CORPORATION

Inventor： Hiroki TAKAHASHI ,  Ban ITO ,  Seungho YUN ,  Kohei SATO

IPC: B08B3/10 ,  B08B1/00 ,  B08B3/02 ,  B08B5/02 ,  B24B57/02

CPC classification number: B08B3/10 ,  B08B1/002 ,  B08B3/02 ,  B08B5/02 ,  B24B57/02 ,  B08B2205/00 ,  B08B2203/00

Abstract: A substrate processing system capable of supplying a processing liquid containing fine bubbles at a high concentration without generating large sized bubbles in a middle of a supply line of the processing liquid is disclosed. There is provided a substrate processing system comprising: a gas dissolved water generation tank; a chemical liquid dilution module; and a substrate processing module. The substrate processing module comprises a processing liquid supply nozzle configured to supply the processing liquid onto a substrate. The processing liquid supply nozzle has a decompression release portion configured to generate fine bubbles of a gas from a diluted chemical liquid. The processing liquid supply nozzle is configured to supply the diluted chemical liquid containing fine bubbles in a process scrubbing the substrate.

公开(公告)号：US20230207339A1

公开(公告)日：2023-06-29

申请号：US18087619

申请日：2022-12-22

Applicant: EBARA CORPORATION

Inventor： Kohei SATO ,  Hiroki TAKAHASHI

IPC: H01L21/67 ,  B08B3/02 ,  B08B13/00 ,  B05C11/10 ,  B05C5/02

CPC classification number: H01L21/67051 ,  B05C5/0225 ,  B05C11/1007 ,  B08B3/02 ,  B08B13/00 ,  H01L21/67248

Abstract: A substrate processing apparatus includes: a first module used in a substrate processing process; a second module used in a substrate processing process after the first module; a nozzle provided in the second module and configured to supply a target treatment liquid; a temperature detector that detects a temperature of a treatment liquid inside the nozzle or a temperature of the nozzle; a substrate detection sensor that detects a position of a substrate; and a controller that controls discharge of the target treatment liquid from the nozzle performed before the substrate is conveyed to the second module according to the temperature of the treatment liquid detected by the temperature detector and the position of the substrate.

公开(公告)号：US20230023260A1

公开(公告)日：2023-01-26

申请号：US17783069

申请日：2020-11-25

Applicant: EBARA CORPORATION

Inventor： Hiroki TAKAHASHI ,  Kohei SATO ,  Koichi FUKAYA

IPC: B08B3/08 ,  H01L21/02 ,  H01L21/67 ,  B08B3/02 ,  B08B3/14 ,  B08B1/00 ,  B08B1/02 ,  B08B13/00

Abstract: The present invention relates to a substrate cleaning system and a substrate cleaning method for cleaning a substrate. The substrate cleaning system (50) includes a heater (51), a chemical-liquid diluting module (52), and a cleaning module. A temperature of the diluted-chemical-liquid mixed by the chemical-liquid diluting module (52) is determined to be higher than normal a temperature and lower than a glass transition point of a cleaning member. The cleaning member scrubs the substrate (W) with the diluted chemical liquid having the determined temperature supplied to the substrate (W).